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Effects of dielectric materials on electromigration failure

Journal of applied physics, 2001-06, Vol.89 (12), p.7797-7808

2001

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Electromigration lifetime and critical void volume

Applied physics letters, 2004-11, Vol.85 (20), p.4639-4641

2004

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A high-voltage scanning electron microscopy system for in situ electromigration testing

Review of scientific instruments, 2000-07, Vol.71 (7), p.2848-2854

2000

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Void nucleation on intentionally added defects in Al interconnects

Applied physics letters, 1999-08, Vol.75 (5), p.633-635

1999

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Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects

MRS proceedings, 1999, Vol.563, Article 219

1999

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Electromigration Voiding in Argon-Implanted Interconnects

MRS proceedings, 1999, Vol.563, Article 97

1999

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Comparison of Stresses in Al Lines Under Various Passivations

MRS proceedings, 1997, Vol.473, Article 415

1997

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The Effects of Width Transitions on the Reliability of Interconnects

MRS proceedings, 2000, Vol.612, Article D2.8.1

2000

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Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride

Journal of applied physics, 2002-03, Vol.91 (6), p.3653-3657

2002

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The evolution of the resistance of aluminum interconnects during electromigration

Microelectronics and reliability, 2000-06, Vol.40 (6), p.981-990

2000

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In Situ SEM Observations of Electromigration Voids in Aluminum Lines Under Passivation

MRS bulletin, 1994-06, Vol.19 (6), p.51-55

1994

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Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines

Journal of materials research, 1996-01, Vol.11 (1), p.184-193

1996

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Stress-Induced Void Formation in Metal Lines

MRS bulletin, 1993-12, Vol.18 (12), p.26-35

1993

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A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

MRS proceedings, 1998, Vol.516, Article 83

1998

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A Detailed Study of Void Motion In Passivated Aluminum Interconnects

MRS proceedings, 1999, Vol.563, Article 103

1999

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The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior

MRS proceedings, 1998, Vol.516, Article 249

1998

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High-Temperature Deformation of Nb-18 Al

MRS proceedings, 1990, Vol.213, Article 329

1990

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In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation

MRS bulletin, 1994-06, Vol.19 (6), p.51-55

1994

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Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum alloy Lines

MRS proceedings, 1993, Vol.309, Article 181

1993

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Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum Alloy Lines

MRS proceedings, 1993, Vol.308, Article 249

1993

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The relationship between resistance changes and void volume changes in passivated aluminum interconnects

1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296), 1999, p.206-212

1999

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Improving glycemic control in the cardiothoracic intensive care unit: Clinical experience in two hospital settings

Journal of cardiothoracic and vascular anesthesia, 2004-12, Vol.18 (6), p.690-697

2004

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High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction

Applied physics letters, 2002-05, Vol.80 (20), p.3724-3726

2002

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Hemorrhagic Pheochromocytoma Associated with Systemic Corticosteroid Therapy and Presenting as Myocardial Infarction with Severe Hypertension

The journal of clinical endocrinology and metabolism, 2005-01, Vol.90 (1), p.563-569

2005

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Local plasticity of Al thin films as revealed by x-ray microdiffraction

Physical review letters, 2003-03, Vol.90 (9), p.096102-096102, Article 096102

2003

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Effects of dielectric materials on electromigration failure

Electromigration lifetime and critical void volume

A high-voltage scanning electron microscopy system for in situ electromigration testing

Void nucleation on intentionally added defects in Al interconnects

Effect of Modified Metal/Passivation Interfaces on Stress Voiding in Interconnects

Electromigration Voiding in Argon-Implanted Interconnects

Comparison of Stresses in Al Lines Under Various Passivations

The Effects of Width Transitions on the Reliability of Interconnects

Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride

The evolution of the resistance of aluminum interconnects during electromigration

In Situ SEM Observations of Electromigration Voids in Aluminum Lines Under Passivation

Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines

Stress-Induced Void Formation in Metal Lines

A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects

A Detailed Study of Void Motion In Passivated Aluminum Interconnects

The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior

High-Temperature Deformation of Nb-18 Al

In Situ SEM Observations of Electromigration Voids in Al Lines under Passivation

Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum alloy Lines

Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum Alloy Lines

The relationship between resistance changes and void volume changes in passivated aluminum interconnects

Improving glycemic control in the cardiothoracic intensive care unit: Clinical experience in two hospital settings

High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction

Hemorrhagic Pheochromocytoma Associated with Systemic Corticosteroid Therapy and Presenting as Myocardial Infarction with Severe Hypertension

Local plasticity of Al thin films as revealed by x-ray microdiffraction

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