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Scientific Bulletin. Series C, Electrical Engineering and Computer Science, 2019-01 (4), p.133
2019
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Future Access Enablers for Ubiquitous and Intelligent Infrastructures, p.138-145
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2019 42nd International Conference on Telecommunications and Signal Processing (TSP), 2019, p.629-632
2019
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Education 4.0 Lab for Digital Innovation Units - Collaborative Learning in Time of COVID-19 Pandemic
2021
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2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2016, p.244-247
2016
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Future Access Enablers for Ubiquitous and Intelligent Infrastructures, p.212-217
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2020 43rd International Conference on Telecommunications and Signal Processing (TSP), 2020, p.166-169
2020
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2019 42nd International Conference on Telecommunications and Signal Processing (TSP), 2019, p.402-405
2019
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2019 11th International Conference on Electronics, Computers and Artificial Intelligence (ECAI), 2019, p.1-4
2019
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Applied sciences, 2023-01, Vol.13 (1), p.369
2023
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Life (Basel, Switzerland), 2023-07, Vol.13 (7), p.1501
2023
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