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Vivipary as a tool to analyze late embryogenic events in maize

Heredity, 2008-11, Vol.101 (5), p.465-470

2008

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Endoscopic ligation and sclerotherapy in the treatment of esophageal varices

Il Giornale di chirurgia, 1997-10, Vol.18 (10), p.715

1997

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Endoscopic treatment of benign esophageal stenosis

Il Giornale di chirurgia, 1997-10, Vol.18 (10), p.481

1997

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Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element Analysis

Composite structures, 2022-02, Vol.281, p.114996, Article 114996

2022

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Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

Journal of physics. Conference series, 2017-05, Vol.841 (1), p.12014

2017

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Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis

Applied sciences, 2023-07, Vol.13 (14), p.8528

2023

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TIMs for transfer molded power modules: Characterization, reliability, and modeling

Microelectronics and reliability, 2023-09, Vol.148, p.115162, Article 115162

2023

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Microscale material variability and its effect on longitudinal tensile failure of unidirectional carbon fibre composites

Composite structures, 2021-04, Vol.261, p.113300, Article 113300

2021

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Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Elements Analysis

Applied sciences, 2023-01, Vol.13 (14), p.8528

2023

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A Full Computerized Workflow for Planning Surgically Assisted Rapid Palatal Expansion and Orthognathic Surgery in a Skeletal Class III Patient

Case reports in dentistry, 2022-10, Vol.2022, p.1-18

2022

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Use of Bioinoculants Affects Variation in Snap Bean Yield Grown under Deficit Irrigation

Agriculture (Basel), 2023-04, Vol.13 (4), p.865

2023

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Plant-Microbe Interaction in Sustainable Agriculture: The Factors That May Influence the Efficacy of PGPM Application

Sustainability, 2022-02, Vol.14 (4), p.2253

2022

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The Facile Microwave-Assisted Coprecipitation Route to Obtain Polyoxoniobate (Na7(H3O)Nb6O19·14H2O) Nanorods Modified with Copper for CO2 Photoreduction

AppliedChem, 2023-06, Vol.3 (2), p.320-333

2023

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Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System

IEEE journal of solid-state circuits, 2012-01, Vol.47 (1), p.151-163

2012

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Short-Term and Long-Term Changes of Nasal Soft Tissue after Rapid Maxillary Expansion (RME) with Tooth-Borne and Bone-Borne Devices. A CBCT Retrospective Study

Diagnostics (Basel), 2022-03, Vol.12 (4), p.875

2022

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Azolla-Anabaena as a Biofertilizer for Rice Paddy Fields in the Po Valley, a Temperate Rice Area in Northern Italy

International Journal of Agronomy, 2010-01, Vol.2010, p.1-5

2010

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IBM z14 design methodology enhancements in the 14-nm technology node

IBM journal of research and development, 2018-03, p.1-1

2018

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The Road to Recovery the Role of Poverty in the Exposure, Vulnerability and Resilience to Floods in Accra

Economics of disasters and climate change, 2020, Vol.4 (1), p.171-193

2020

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Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-4

2024

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Extension of the Equivalent Thickness Concept to the Bifurcation of Large Semiconductor Front Side Metal Taiko Wafer investigated by ANSYS Finite Element Analysis Methods

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-5

2024

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A Comparison of Analytical and Finite Element Analysis Methods for Determining the Equivalent Thickness of Large 4H-SiC Taiko Wafers

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024, p.1-4

2024

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IBM z14™: 14nm microprocessor for the next-generation mainframe

2018 IEEE International Solid - State Circuits Conference - (ISSCC), 2018, p.36-38

2018

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Wafer Bifurcation as a Spontaneous Symmetry Breaking

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, p.1-3

2022

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Models of Bifurcation in a Semiconductor Wafer: A Comparison of the Analytical Solution vs. the ANSYS Finite Element Analysis

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, p.1-4

2022

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Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-5

2023

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Vivipary as a tool to analyze late embryogenic events in maize

Endoscopic ligation and sclerotherapy in the treatment of esophageal varices

Endoscopic treatment of benign esophageal stenosis

Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element Analysis

Thermal fatigue life evaluation of SnAgCu solder joints in a multi-chip power module

Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis

TIMs for transfer molded power modules: Characterization, reliability, and modeling

Microscale material variability and its effect on longitudinal tensile failure of unidirectional carbon fibre composites

Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Elements Analysis

A Full Computerized Workflow for Planning Surgically Assisted Rapid Palatal Expansion and Orthognathic Surgery in a Skeletal Class III Patient

Use of Bioinoculants Affects Variation in Snap Bean Yield Grown under Deficit Irrigation

Plant-Microbe Interaction in Sustainable Agriculture: The Factors That May Influence the Efficacy of PGPM Application

The Facile Microwave-Assisted Coprecipitation Route to Obtain Polyoxoniobate (Na7(H3O)Nb6O19·14H2O) Nanorods Modified with Copper for CO2 Photoreduction

Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System

Short-Term and Long-Term Changes of Nasal Soft Tissue after Rapid Maxillary Expansion (RME) with Tooth-Borne and Bone-Borne Devices. A CBCT Retrospective Study

Azolla-Anabaena as a Biofertilizer for Rice Paddy Fields in the Po Valley, a Temperate Rice Area in Northern Italy

IBM z14 design methodology enhancements in the 14-nm technology node

The Road to Recovery the Role of Poverty in the Exposure, Vulnerability and Resilience to Floods in Accra

Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers

Extension of the Equivalent Thickness Concept to the Bifurcation of Large Semiconductor Front Side Metal Taiko Wafer investigated by ANSYS Finite Element Analysis Methods

A Comparison of Analytical and Finite Element Analysis Methods for Determining the Equivalent Thickness of Large 4H-SiC Taiko Wafers

IBM z14™: 14nm microprocessor for the next-generation mainframe

Wafer Bifurcation as a Spontaneous Symmetry Breaking

Models of Bifurcation in a Semiconductor Wafer: A Comparison of the Analytical Solution vs. the ANSYS Finite Element Analysis

Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers

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