UB Paderborn / Katalog / Suche / in CDI

AN ACCURATE MODELING OF DELAY AND SLEW METRICS FOR ON-CHIP VLSI RC INTERCONNECTS FOR RAMP INPUTS USING BURR’S DISTRIBUTION FUNCTION

ICTACT journal on communication technology, 2010-09, Vol.1 (3), p.137-142

2010

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Wave propagation in layered composite laminates under periodic surface loads

Wave motion, 1988-06, Vol.10 (3), p.257-266

Mal, A.K.

1988

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Fatigue life prediction of fiber-reinforced titanium matrix composites

Acta materialia, 1996-03, Vol.44 (3), p.1097-1108

1996

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Analysis of Adiabatic flip-flops for Ultra Low Power Applications

2019 Devices for Integrated Circuit (DevIC), 2019, p.306-309

2019

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"CLOSED FORM MODELING OF CROSSTALK FOR DISTRIBUTED RLCG ON-CHIP INTERCONNECTS USING DIFFERENCE MODEL APPROACH"

ICTACT journal on communication technology, 2010-03, Vol.1 (1), p.17-22

2010

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An adaptive integration scheme for irregularly oscillatory functions

Wave motion, 1985-01, Vol.7 (3), p.235-243

1985

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Elastic waves in a fiber-reinforced composite

Journal of the mechanics and physics of solids, 1974-05, Vol.22 (3), p.217-229

1974

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A generalized analog architecture for DCT, DST and its inverse

2004 IEEE International Conference on Acoustics, Speech, and Signal Processing, 2004, Vol.5, p.V-261

2004

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Analog sampled data architecture for discrete cosine transform

ASIC, 2003. Proceedings. 5th International Conference on, 2003, Vol.1, p.502-505 Vol.1

2003

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Characterization of film adhesion by acoustic microscopy: Review of progress in quantitative nondestructive evaluation, Williamsburg, Virginia (United States), 22–26 Jun. 1987. Vol. 7B, pp. 903–910. Edited by D.D. Thompson and D.E. Chimenti, Plenum Press, 1988

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.104-105

1992

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Characterization of film adhesion by acoustic microscopy

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.104-105

1992

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Guided waves in layered solids with interface zones

International journal of engineering science, 1988, Vol.26 (8), p.873-881

Mal, A.K.

1988

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Analog sampled data architecture for discrete Hartley transform

TENCON 2003. Conference on Convergent Technologies for Asia-Pacific Region, 2003, Vol.3, p.1035-1039 Vol.3

2003

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NDE of strength related properties of adhesive joints: Proceedings of the 7th international conference on fracture (ICFY), Houston, Texas (United States), 20–24 March 1989. Spons. International Congress on fracture, pp/ 3197–3204 (1989)

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.103-103

1992

Volltextzugriff (PDF)

Characterization of adhesive bonding using leakly lamb waves: Review of progress in quantitative nondestructive evaluation, Brunswick, Maine (United States), 23–28 Jul. 1989. vol. 9B, pp. 1271–1277. Edited by D.O. Thompson and D.E. Chimenti. Plenum Press (1990)

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.100-100

1992

Volltextzugriff (PDF)

NDE of strength related properties of adhesive joints

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.103

1992

Volltextzugriff (PDF)

Characterization of adhesive bonding using leakly lamb waves

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.100

1992

Volltextzugriff (PDF)

Elastic waves in a multilayered solid due to a dislocation source

Wave motion, 1985-01, Vol.7 (5), p.459-471

1985

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Delay Estimation for On-Chip VLSI Interconnect using Weibull Distribution Function

2008 IEEE Region 10 and the Third international Conference on Industrial and Information Systems, 2008, p.1-3

2008

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Ultrasonic evaluation of adhesive bonding

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.101

1992

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Ultrasonic evaluation of adhesive bonding: Journal of adhesion, Vol. 29, pp. 257–274 (1989)

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.101-101

1992

Volltextzugriff (PDF)

Ultrasonic nondestructive evaluation of adhesive bonds

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.103

1992

Volltextzugriff (PDF)

Ultrasonic nondestructive evaluation of adhesive bonds: New directions in the nondestructive evaluation of advanced materials, Winter annual meeting, American Society of Mechanical Engineers, Chicago, Illinois 27 Nov. – 2 Dec. 1988. Edited by J.L. Rose & A.A. Tseng, pp. 85–90, American Society of Mechanical Engineers (1988)

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.103-103

1992

Volltextzugriff (PDF)

Ultrasonic nondestructive evaluation of adhesive bonds: New directions in the nondestructive evaluation of advanced materials, winter annual meeting of the American Society of Mechanical Engineers, Chicago, Illinois, 27 Nov. – 2 Dec. 1988. pp. 85–90. American Society of Mechanical Engineers, New York (1989)

NDT & E international : independent nondestructive testing and evaluation, 1992, Vol.25 (2), p.103-103

1992

Volltextzugriff (PDF)

A closed form delay evaluation approach using burr's distribution function for high speed on-chip RC interconnects

2010 IEEE 2nd International Advance Computing Conference (IACC), 2010, p.129-133

2010

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AN ACCURATE MODELING OF DELAY AND SLEW METRICS FOR ON-CHIP VLSI RC INTERCONNECTS FOR RAMP INPUTS USING BURR’S DISTRIBUTION FUNCTION

Wave propagation in layered composite laminates under periodic surface loads

Fatigue life prediction of fiber-reinforced titanium matrix composites

Analysis of Adiabatic flip-flops for Ultra Low Power Applications

"CLOSED FORM MODELING OF CROSSTALK FOR DISTRIBUTED RLCG ON-CHIP INTERCONNECTS USING DIFFERENCE MODEL APPROACH"

An adaptive integration scheme for irregularly oscillatory functions

Elastic waves in a fiber-reinforced composite

A generalized analog architecture for DCT, DST and its inverse

Analog sampled data architecture for discrete cosine transform

Characterization of film adhesion by acoustic microscopy: Review of progress in quantitative nondestructive evaluation, Williamsburg, Virginia (United States), 22–26 Jun. 1987. Vol. 7B, pp. 903–910. Edited by D.D. Thompson and D.E. Chimenti, Plenum Press, 1988

Characterization of film adhesion by acoustic microscopy

Guided waves in layered solids with interface zones

Analog sampled data architecture for discrete Hartley transform

NDE of strength related properties of adhesive joints: Proceedings of the 7th international conference on fracture (ICFY), Houston, Texas (United States), 20–24 March 1989. Spons. International Congress on fracture, pp/ 3197–3204 (1989)

Characterization of adhesive bonding using leakly lamb waves: Review of progress in quantitative nondestructive evaluation, Brunswick, Maine (United States), 23–28 Jul. 1989. vol. 9B, pp. 1271–1277. Edited by D.O. Thompson and D.E. Chimenti. Plenum Press (1990)

NDE of strength related properties of adhesive joints

Characterization of adhesive bonding using leakly lamb waves

Elastic waves in a multilayered solid due to a dislocation source

Delay Estimation for On-Chip VLSI Interconnect using Weibull Distribution Function

Ultrasonic evaluation of adhesive bonding

Ultrasonic evaluation of adhesive bonding: Journal of adhesion, Vol. 29, pp. 257–274 (1989)

Ultrasonic nondestructive evaluation of adhesive bonds

A closed form delay evaluation approach using burr's distribution function for high speed on-chip RC interconnects

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