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Ventricular fibrillation or general seizure?

Deutsche medizinische Wochenschrift (1946), 2014-08, Vol.139 (31-32), p.1606

Makabe, T

2014

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Functional separation of biasing and sustaining voltages in two-frequency capacitively coupled plasma

Applied physics letters, 2000-07, Vol.77 (4), p.489-491

2000

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In situ measurement of plasma charging on SiO2 hole bottoms and reduction by negative charge injection during etching

Applied surface science, 2008-04, Vol.254 (12), p.3696-3709

2008

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Functional separation in two frequency operation of an inductively coupled plasma

Journal of applied physics, 2004-02, Vol.95 (3), p.870-876

2004

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A set of cross sections and transport coefficients for electrons in HBr

Chemical physics, 2012-04, Vol.398, p.154-159

2012

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This special issue resulted from the International Workshop on Basis of Low Temperature Plasma Applications which was held at Hakone in Japan on July 24–25, 2001

Applied surface science, 2002-05, Vol.192 (1), p.ix-ix

Makabe, T

2002

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Argon metastable state densities in inductively coupled plasma in mixtures of Ar and O 2

Journal of physics. D, Applied physics, 2009-07, Vol.42 (14), p.145206

2009

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Kinetic phenomena in electron transport in radio-frequency fields

Applied surface science, 2002-05, Vol.192 (1), p.1-25

2002

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Argon metastable state densities in inductively coupled plasma in mixtures of Ar and O2

Journal of physics. D, Applied physics, 2009-07, Vol.42 (14), p.145206-145206 (6)

2009

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Negative charge injection to a positively charged SiO2 hole exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma in CF4/Ar

Applied physics letters, 2003-12, Vol.83 (22), p.4637-4639

2003

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Development of optical computerized tomography in capacitively coupled plasmas and inductively coupled plasmas for plasma etching

Applied surface science, 2002-05, Vol.192 (1), p.88-114

2002

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Three dimensional freezing around a coolant-carrying tube

Heat and mass transfer, 2010-12, Vol.46 (11-12), p.1307-1314

2010

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Modeling of radial uniformity at a wafer interface in a 2f-CCP for SiO2 etching

Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 2005-09, Vol.23 (5), p.2212-2217

2005

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Data and modeling of negative ion transport in gases of interest for production of integrated circuits and nanotechnologies

Applied surface science, 2007-06, Vol.253 (16), p.6619-6640

2007

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The serum level of vitamin D of endometriosis patients

Journal of reproductive immunology, 2014-12, Vol.106, p.20-20

2014

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Modeling of N $_2$ –H $_2$ Capacitively Coupled Plasma for Low-k Material Etching

IEEE transactions on plasma science, 2004-04, Vol.32 (2), p.390-398

2004

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Optical emission diagnostics of etching of low- k dielectrics in a two frequency inductively coupled plasma

Solid-state electronics, 2007-10, Vol.51 (10), p.1418-1424

2007

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Two-dimensional CT images of two-frequency capacitively coupled plasma

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 1999-09, Vol.17 (5), p.2510-2516

1999

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Space-and Time-Resolved E-H Transition in an Inductively Coupled Plasma in Ar

IEEE transactions on plasma science, 2008-08, Vol.36 (4), p.1410-1411

2008

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Prediction of a radial variation of plasma structure and ion distributions in the wafer interface in two-frequency capacitively coupled plasma

IEEE transactions on plasma science, 2004-02, Vol.32 (1), p.90-100

2004

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Effect of aspect ratio on topographic dependent charging in oxide etching

Journal of physics. D, Applied physics, 2001-10, Vol.34 (19), p.2950-2955

2001

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Prediction of organic low-k material etching in two frequency capacitively coupled plasma

Plasma physics and controlled fusion, 2006-12, Vol.48 (12B), p.B99-B104

2006

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Effects of frequency on the two-dimensional structure of capacitively coupled plasma in Ar

Journal of applied physics, 1998-12, Vol.84 (11), p.5928-5936

1998

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Numerical Modeling of RF Magnetron Sputtering with Metallic or Dielectric Target

Materials science forum, 2007-09, Vol.555, p.65-71

2007

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In situ measurement of plasma charging on SiO 2 hole bottoms and reduction by negative charge injection during etching

Applied surface science, 2008-04, Vol.254 (12), p.3696-3709

2008

Volltextzugriff (PDF)

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Ventricular fibrillation or general seizure?

Functional separation of biasing and sustaining voltages in two-frequency capacitively coupled plasma

In situ measurement of plasma charging on SiO2 hole bottoms and reduction by negative charge injection during etching

Functional separation in two frequency operation of an inductively coupled plasma

A set of cross sections and transport coefficients for electrons in HBr

This special issue resulted from the International Workshop on Basis of Low Temperature Plasma Applications which was held at Hakone in Japan on July 24–25, 2001

Argon metastable state densities in inductively coupled plasma in mixtures of Ar and O 2

Kinetic phenomena in electron transport in radio-frequency fields

Argon metastable state densities in inductively coupled plasma in mixtures of Ar and O2

Negative charge injection to a positively charged SiO2 hole exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma in CF4/Ar

Development of optical computerized tomography in capacitively coupled plasmas and inductively coupled plasmas for plasma etching

Three dimensional freezing around a coolant-carrying tube

Modeling of radial uniformity at a wafer interface in a 2f-CCP for SiO2 etching

Data and modeling of negative ion transport in gases of interest for production of integrated circuits and nanotechnologies

The serum level of vitamin D of endometriosis patients

Modeling of N $_2$ –H $_2$ Capacitively Coupled Plasma for Low-k Material Etching

Optical emission diagnostics of etching of low- k dielectrics in a two frequency inductively coupled plasma

Two-dimensional CT images of two-frequency capacitively coupled plasma

Space-and Time-Resolved E-H Transition in an Inductively Coupled Plasma in Ar

Prediction of a radial variation of plasma structure and ion distributions in the wafer interface in two-frequency capacitively coupled plasma

Effect of aspect ratio on topographic dependent charging in oxide etching

Prediction of organic low-k material etching in two frequency capacitively coupled plasma

Effects of frequency on the two-dimensional structure of capacitively coupled plasma in Ar

Numerical Modeling of RF Magnetron Sputtering with Metallic or Dielectric Target

In situ measurement of plasma charging on SiO 2 hole bottoms and reduction by negative charge injection during etching

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