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Interfacial reactions during sputter deposition of Ta and TaN films on organosilicate glass: XPS and TEM results

Applied surface science, 2007-05, Vol.253 (14), p.6176-6184

2007

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Chemical vapor deposition of tantalum nitride with tert-butylimino tris(diethylamino) tantalum and atomic hydrogen

Thin solid films, 2005-05, Vol.478 (1-2), p.188-195

2005

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Oxide film growth on Fe(111) and scanning tunneling microscopy induced high electric field stress in Fe2O3/Fe(111)

Thin solid films, 2003-11, Vol.444 (1-2), p.179-188

2003

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Characterization of oxidized Ni3Al(1 1 0) and interaction of the oxide film with water vapor

Surface science, 2002-11, Vol.519 (3), p.259-268

2002

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Effect of surface impurities on the Cu/Ta interface

Thin solid films, 2000-11, Vol.376 (1), p.115-123

2000

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H2O-induced instability of Al2O3/Ni3Al(110) and Al2O3/Ni3Al(111) thin films under non-UHV conditions

Surface science, 2004-09, Vol.565 (2-3), p.L277-L282

2004

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Copper interaction with a Ta silicate surface: implications for interconnect technology

Thin solid films, 2002-08, Vol.415 (1), p.308-314

2002

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Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO2

Applied surface science, 2004-01, Vol.222 (1-4), p.253-262

2004

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Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition

Thin solid films, 2006-02, Vol.497 (1-2), p.121-129

2006

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Reactivities of ultrathin alumina films exposed to intermediate pressures of H2O : Substrate-mediated mechanism for growth and loss of surface order

Surface science, 2007-08, Vol.601 (16), p.3464-3471

2007

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Tetrakis(diethylamido) titanium (TDEAT) interactions with SiO 2 and Cu substrates

Applied surface science, 2003-12, Vol.220 (1), p.203-216

2003

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Ta metallization of Si–O–C substrate and Cu metallization of Ta/Si–O–C multilayer

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2003-01, Vol.21 (1), p.293-300

2003

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Theory and experiments on the structure of 7 Å alumina films grown on Ni3Al

Journal of molecular catalysis. A, Chemical, 2005, Vol.228 (1-2), p.83-87

2005

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Copper wetting of a tantalum silicate surface: Implications for interconnect technology

Applied physics letters, 2001-11, Vol.79 (21), p.3479-3481

2001

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Dielectric breakdown of ultrathin aluminum oxide films induced by scanning tunneling microscopy

Applied physics letters, 2000-10, Vol.77 (14), p.2228-2230

2000

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STM atomic-scale characterization of the γ'-Al2O3 film on Ni3Al(111)

Surface science, 1999-12, Vol.442 (3), p.385-399

1999

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Interactions at the Ni3Al(111)−S−Al2O3 Interface at Elevated Temperatures: Ordering of Al2O3 on an S-Modified Substrate

Langmuir, 2000-10, Vol.16 (22), p.8352-8359

2000

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STM-induced void formation at the Al2O3/Ni3Al(1 1 1) interface

Surface science, 2001-02, Vol.472 (3), p.L157-L163

2001

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Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

Applied surface science, 2002-02, Vol.187 (3), p.253-260

2002

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H2S adsorption and the effect of sulfur on the oxidation of Ni3Al(111)

Surface science, 2000-06, Vol.458 (1-3), p.123-134

2000

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Cu wetting and interfacial stability on clean and nitrided tungsten surfaces

Applied surface science, 2001-02, Vol.171 (3), p.275-282

2001

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Copper metallization of hydroxyl-modified amorphous Si:C:H films

Thin solid films, 2003-09, Vol.440 (1), p.100-108

2003

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In situ infrared reflection–absorption spectroscopic characterization of sustained kinetic oscillations in the Pt(100)/NO+CO system

Surface science, 1998-11, Vol.417 (2), p.189-200

1998

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Ruthenium Sputter Deposition on Organosilicate Glass and on Paralyne: an XPS Study of Interfacial Chemistry, Nucleation and Growth

MRS proceedings, 2004, Vol.812, Article F2.5

2004

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Moisture-induced instability at the Al2O3/Ni3Al(110) interface: interfacial chemistry

Materials at high temperatures, 2004-11, Vol.21 (4), p.193-204

2004

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Interfacial reactions during sputter deposition of Ta and TaN films on organosilicate glass: XPS and TEM results

Chemical vapor deposition of tantalum nitride with tert-butylimino tris(diethylamino) tantalum and atomic hydrogen

Oxide film growth on Fe(111) and scanning tunneling microscopy induced high electric field stress in Fe2O3/Fe(111)

Characterization of oxidized Ni3Al(1 1 0) and interaction of the oxide film with water vapor

Effect of surface impurities on the Cu/Ta interface

H2O-induced instability of Al2O3/Ni3Al(110) and Al2O3/Ni3Al(111) thin films under non-UHV conditions

Copper interaction with a Ta silicate surface: implications for interconnect technology

Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO2

Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition

Reactivities of ultrathin alumina films exposed to intermediate pressures of H2O : Substrate-mediated mechanism for growth and loss of surface order

Tetrakis(diethylamido) titanium (TDEAT) interactions with SiO 2 and Cu substrates

Ta metallization of Si–O–C substrate and Cu metallization of Ta/Si–O–C multilayer

Theory and experiments on the structure of 7 Å alumina films grown on Ni3Al

Copper wetting of a tantalum silicate surface: Implications for interconnect technology

Dielectric breakdown of ultrathin aluminum oxide films induced by scanning tunneling microscopy

STM atomic-scale characterization of the γ'-Al2O3 film on Ni3Al(111)

Interactions at the Ni3Al(111)−S−Al2O3 Interface at Elevated Temperatures: Ordering of Al2O3 on an S-Modified Substrate

STM-induced void formation at the Al2O3/Ni3Al(1 1 1) interface

Interaction of polymeric Si:C:H films with copper substrates and with deposited Cu adatoms

H2S adsorption and the effect of sulfur on the oxidation of Ni3Al(111)

Cu wetting and interfacial stability on clean and nitrided tungsten surfaces

Copper metallization of hydroxyl-modified amorphous Si:C:H films

In situ infrared reflection–absorption spectroscopic characterization of sustained kinetic oscillations in the Pt(100)/NO+CO system

Ruthenium Sputter Deposition on Organosilicate Glass and on Paralyne: an XPS Study of Interfacial Chemistry, Nucleation and Growth

Moisture-induced instability at the Al2O3/Ni3Al(110) interface: interfacial chemistry

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