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Simultaneous Formation of a Metallic Mn Layer and a MnOx/MnSixOy Barrier Layer by Chemical Vapor Deposition at 250 °C

Jpn J Appl Phys, 2013-05, Vol.52 (5), p.05FA02-05FA02-3

2013

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Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Scientific reports, 2021-01, Vol.11 (1), p.357-357, Article 357

2021

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Cryo atomic layer etching of SiO 2 by C F8 physisorption followed by Ar plasma

Applied physics letters, 2019-10, Vol.115 (15)

2019

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300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration

IEEE transactions on semiconductor manufacturing, 2010-05, Vol.23 (2), p.293-302

2010

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Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

Journal of physics. D, Applied physics, 2015-11, Vol.48 (43)

2015

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The role of physisorption in the cryogenic etching process of silicon

Japanese Journal of Applied Physics, 2019-06, Vol.58 (SE), p.SEEB03

2019

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Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Journal of physics. D, Applied physics, 2016-05, Vol.49 (17), p.175203-175214

2016

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Use of a Thermally Degradable Chemical Vapor Deposited Polymer Film for Low Damage Plasma Processing of Highly Porous Dielectrics

ACS applied electronic materials, 2019-12, Vol.1 (12), p.2602-2611

2019

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Development of post-CMP cleanup processing for Cu/low-k devices

Electronics & communications in Japan. Part 2, Electronics, 2006-11, Vol.89 (11), p.19-30

2006

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Simultaneous Formation of a Metallic Mn Layer and a MnO sub(x)/MnSi sub(x)O sub(y) Barrier Layer by Chemical Vapor Deposition at 250 [degrees]C

Japanese Journal of Applied Physics, 2013-05, Vol.52 (5S3)

2013

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Simultaneous Formation of a Metallic Mn Layer and a MnO x /MnSi x O y Barrier Layer by Chemical Vapor Deposition at 250 °C

Japanese Journal of Applied Physics, 2013-05, Vol.52 (5S3), p.5

2013

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First Demonstration of Quasi-Planar Segmented-Channel MOSFET Design for Improved Scalability

IEEE transactions on electron devices, 2012-08, Vol.59 (8), p.2273-2276

2012

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Atomistic simulation analysis of plasma surface activation in wafer-to-wafer oxide fusion bonding

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.2034-2039

2023

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Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1329-1334

2024

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Wafer Surface Control for Ru Capping on Cu interconnect

2020 IEEE International Interconnect Technology Conference (IITC), 2020, p.10-12

2020

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Electrical properties and TDDB performance of Cu interconnects using ALD Ta(Al)N barrier and Ru liner for 7nm node and beyond

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.99-101

2016

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Cost Analysis of TSV Process and Scaling Options

International Symposium on Microelectronics, 2014-10, Vol.2014 (1), p.1-7

2014

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SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES

International Symposium on Microelectronics, 2014-10, Vol.2014 (1), p.794-803

2014

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Thermo-mechanical and electrical characterization of through-silicon vias with a vapor deposited polyimide dielectric liner

2012 IEEE International Interconnect Technology Conference, 2012, p.1-3

2012

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Fabrication of segmented-channel MOSFETs for reduced short-channel effects

2011 International Semiconductor Device Research Symposium (ISDRS), 2011, p.1-2

2011

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Deep learning-assisted comparative analysis of animal trajectories with DeepHL

Nature communications, 2020-10, Vol.11 (1), p.5316-15, Article 5316

2020

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Pathophysiological analysis of uninephrectomized db/db mice as a model of severe diabetic kidney disease

Physiological research, 2022-04, Vol.71 (2), p.209-217

2022

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Yeast Flocculin: Methods for Quantitative Analysis of Flocculation in Yeast Cells

Methods in molecular biology (Clifton, N.J.), 2020, Vol.2132, p.437

2020

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Cross-species behavior analysis with attention-based domain-adversarial deep neural networks

Nature communications, 2021-09, Vol.12 (1), p.5519-5519, Article 5519

2021

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Direct control of shoot meristem activity by a cytokinin-activating enzyme

Nature, 2007-02, Vol.445 (7128), p.652-655

2007

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Simultaneous Formation of a Metallic Mn Layer and a MnOx/MnSixOy Barrier Layer by Chemical Vapor Deposition at 250 °C

Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption

Cryo atomic layer etching of SiO 2 by C F8 physisorption followed by Ar plasma

300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration

Cryogenic etching processes applied to porous low-k materials using SF6/C4F8 plasmas

The role of physisorption in the cryogenic etching process of silicon

Mitigation of plasma-induced damage in porous low-k dielectrics by cryogenic precursor condensation

Use of a Thermally Degradable Chemical Vapor Deposited Polymer Film for Low Damage Plasma Processing of Highly Porous Dielectrics

Development of post-CMP cleanup processing for Cu/low-k devices

Simultaneous Formation of a Metallic Mn Layer and a MnO sub(x)/MnSi sub(x)O sub(y) Barrier Layer by Chemical Vapor Deposition at 250 [degrees]C

Simultaneous Formation of a Metallic Mn Layer and a MnO x /MnSi x O y Barrier Layer by Chemical Vapor Deposition at 250 °C

First Demonstration of Quasi-Planar Segmented-Channel MOSFET Design for Improved Scalability

Atomistic simulation analysis of plasma surface activation in wafer-to-wafer oxide fusion bonding

Quantifying the Electrical Impact of Bonding Misalignment for 0.5 μm Pitch Hybrid Bonding Structures

Wafer Surface Control for Ru Capping on Cu interconnect

Electrical properties and TDDB performance of Cu interconnects using ALD Ta(Al)N barrier and Ru liner for 7nm node and beyond

Cost Analysis of TSV Process and Scaling Options

SHORT LOOP ELECTRICAL AND RELIABILITY LEARNING FOR THROUGH SILICON VIA (TSV)MID-WAFER FRONT-SIDE PROCESSES

Thermo-mechanical and electrical characterization of through-silicon vias with a vapor deposited polyimide dielectric liner

Fabrication of segmented-channel MOSFETs for reduced short-channel effects

Deep learning-assisted comparative analysis of animal trajectories with DeepHL

Pathophysiological analysis of uninephrectomized db/db mice as a model of severe diabetic kidney disease

Yeast Flocculin: Methods for Quantitative Analysis of Flocculation in Yeast Cells

Cross-species behavior analysis with attention-based domain-adversarial deep neural networks

Direct control of shoot meristem activity by a cytokinin-activating enzyme

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