UB Paderborn / Katalog / Suche / in CDI

2001 IEEE International Conference on Systems, Man and Cybernetics. e-Systems and e-Man for Cybernetics in Cyberspace (Cat.No.01CH37236), 2001, Vol.2, p.678-683 vol.2

2001

Link zum Volltext
IEEE_Xplore

Comparative Cu Diffusion Studies in Advanced Metallizations of Cu and Al-Cu Based Thin Films

MRS proceedings, 1994, Vol.337, Article 209

Gupta, D.

1994

Link zum Volltext

Verfügbarkeit prüfen

Preparation Of Low-Density Xerogels At Ambient Pressure For Low K Dielectrics

MRS proceedings, 1995, Vol.381, Article 261

1995

Link zum Volltext

Verfügbarkeit prüfen

Texture Control and Electromigration Performance in Al-Based and Cu-Based Layered Interconnects

MRS proceedings, 1998, Vol.514, Article 91

1998

Link zum Volltext

Verfügbarkeit prüfen

Polyimide Nanofoams For Low Dielectric Applications

MRS proceedings, 1995, Vol.381, Article 79

1995

Link zum Volltext

Verfügbarkeit prüfen

Copper Electroplating for Damascene ULSI Interconnects

MRS proceedings, 1998, Vol.514, Article 275

1998

Link zum Volltext

Verfügbarkeit prüfen

Surface Layer Formation During the Chemical Mechanical Polishing of Copper Thin Films

MRS proceedings, 1994, Vol.337, Article 133

1994

Link zum Volltext

Verfügbarkeit prüfen

Power Supply Distribution and Other Wiring Issues For deep-submicron Ic's

MRS proceedings, 1998, Vol.514, Article 11

1998

Link zum Volltext

Verfügbarkeit prüfen

Vapor Deposition Of Very Low K Polymer Films, Poly(Naphthalene), Poly(Fluorinated Naphthalene)

MRS proceedings, 1995, Vol.381, Article 45

1995

Link zum Volltext

Verfügbarkeit prüfen

Basic Science in Silica Glass Polishing

MRS proceedings, 1994, Vol.337, Article 89

1994

Link zum Volltext

Verfügbarkeit prüfen

Integration of Multi-Level Copper Metallization into a High Performance Sub-0.25μM Technology

MRS proceedings, 1998, Vol.514, Article 41

1998

Link zum Volltext

Verfügbarkeit prüfen

1 – 25 von 1.018

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(402)
Mit Volltextzugriff
(562)

Publikationsform

3 weitere anzeigen...

Weniger anzeigen...

Sprache

Englisch
(1.011)
Japanisch
(104)
Deutsch
(3)

Erscheinungsjahr

n.n

Thema

Science & Technology
(636)
Technology
(436)
Physical Sciences
(391)
Materials Science
(365)
Physics
(314)
Materials Science, Multidisciplinary
(248)
Materials Science, Coatings & Films
(212)
Physics, Condensed Matter
(207)
Engineering
(192)
Engineering, Electrical & Electronic
(154)
Physics, Applied
(104)
Metallurgy & Metallurgical Engineering
(92)
Life Sciences & Biomedicine
(85)
Chemistry
(69)
Exact Sciences And Technology
(66)
Humans
(40)
Applied Sciences
(33)
Computer Science
(31)
Electrochemistry
(27)
Polymer Science
(27)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(5)
... seit 90 Tagen
(11)

Menü

Weitere Dienste

Einstellungen

Detecting obstacles and drop-offs using stereo and motion cues for safe local motion

Design and Deployment of a Four-Degrees-of-Freedom Hovering Autonomous Underwater Vehicle for sub-Ice Exploration and Mapping

Interlayer Dielectrics for Semiconductor Technologies

Chemical Mechanical Planarization of Microelectronic Materials

A stereo vision based mapping algorithm for detecting inclines, drop-offs, and obstacles for safe local navigation

A phase I/II study of the safety and pharmacokinetics of nevirapine in HIV-1-infected pregnant Ugandan women and their neonates (HIVNET 006)

Total Face and Scalp Replantation

Methods And Needs For Low K Material Research

Consumables for the Chemical Mechanical Polishing (Cmp) of Dielectrics and Conductors

Effect of Polishing Pad Material Properties on Chemical Mechanical Polishing (Cmp) Processes

Barriers For Copper Interconnections

Microstructure and Texture of Electroplated Copper in Damascene Structures

The Influence of Capping Layer Type on Cobalt Salicide Formation in Films and Narrow Lines

Synthesis And Characterization Of Fluorinated Poly(Arylethers): Organic Polymers For Ic Imd

Using CAD drawings for robot navigation

Comparative Cu Diffusion Studies in Advanced Metallizations of Cu and Al-Cu Based Thin Films

Preparation Of Low-Density Xerogels At Ambient Pressure For Low K Dielectrics

Texture Control and Electromigration Performance in Al-Based and Cu-Based Layered Interconnects

Polyimide Nanofoams For Low Dielectric Applications

Copper Electroplating for Damascene ULSI Interconnects

Surface Layer Formation During the Chemical Mechanical Polishing of Copper Thin Films

Power Supply Distribution and Other Wiring Issues For deep-submicron Ic's

Vapor Deposition Of Very Low K Polymer Films, Poly(Naphthalene), Poly(Fluorinated Naphthalene)

Basic Science in Silica Glass Polishing

Integration of Multi-Level Copper Metallization into a High Performance Sub-0.25μM Technology

Suchergebnisse filtern