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Adhesion Energy and Bonding Wave Velocity Measurements

ECS transactions, 2016, Vol.75 (9), p.145-152

2016

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Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

Microelectronic engineering, 2010-03, Vol.87 (3), p.477-484

2010

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SiO2-SiO2 die-to-wafer direct bonding interface weakening

Microelectronics and reliability, 2020-04, Vol.107, p.113589, Article 113589

2020

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Accurate control of the misorientation angles in direct wafer bonding

Applied physics letters, 2002-02, Vol.80 (5), p.793-795

2002

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Surface plasma treatments enabling low température direct bonding

Microsystem technologies : sensors, actuators, systems integration, 2006-04, Vol.12 (5), p.378-382

2006

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Direct bonding conditions of ferrite garnet layer on ion-exchanged glass waveguides

Physica status solidi. A, Applications and materials science, 2008-10, Vol.205 (10), p.2313-2316

2008

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Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces

Microsystem technologies : sensors, actuators, systems integration, 2018, Vol.24 (1), p.801-808

2018

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Interface water diffusion in silicon direct bonding

Applied physics letters, 2016-09, Vol.109 (11)

2016

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Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Applied surface science, 2014, Vol.288, p.83-89

2014

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Thin Layer Transfer Using Room Temperature Wafer-Level Bonding Process

ECS transactions, 2016, Vol.75 (9), p.203-211

2016

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Study of high-temperature Smart Cut™: Application to silicon-on-sapphire films and to thin foils of single crystal silicon

Solid-state electronics, 2016-01, Vol.115, p.225-231

2016

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Impact of Water Edge Absorption on Silicon Oxide Direct Bonding Energy

ECS transactions, 2016, Vol.75 (9), p.129-134

2016

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Edge Water Penetration in Direct Bonding Interface

ECS transactions, 2016, Vol.75 (9), p.163-167

2016

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Mechanism involved in direct hydrophobic Si(100)-2x1:H bonding

Microsystem technologies : sensors, actuators, systems integration, 2015-05, Vol.21 (5), p.961-968

2015

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Electrical modeling of the GaAs/InP wafer bonded heterojunction

Physica status solidi. C, 2014-02, Vol.11 (2), p.222-227

2014

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Germanium oxynitride (GeOxNy) as a back interface passivation layer for Germanium-on-insulator substrates

Applied physics letters, 2008-07, Vol.93 (2), p.22109

2008

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Defect Formation at Hydrophilic Silicon Bonding Interfaces

ECS transactions, 2010, Vol.33 (4), p.451-456

2010

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InP-based composite substrates for four junction concentrator solar cells

AIP Conference Proceedings, 2015, Vol.1679 (1)

2015

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Single Crystal Silicon Film Transfer onto Polymer

ECS transactions, 2010, Vol.33 (4), p.217-224

2010

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Direct inversion of interfacial reflectivity data using the Patterson function

Journal of applied crystallography, 2003-12, Vol.36 (6), p.1352-1355

2003

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Efficiency of H 2 O Diffusion Barriers at Si-Si Direct Bonding Interfaces

ECS transactions, 2010-10, Vol.33 (4), p.467-474

2010

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Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

On-Surface Atomic Wires and Logic Gates, 2017, p.25-51

2017

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Drying Impact on Semiconductor Surfaces after Innovative Solvent Exposure

ECS transactions, 2009, Vol.25 (5), p.131-138

2009

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Realization of AlGaN/GaN HEMTs on Si-on-polySiC substrates

Physica status solidi. C, 2007-06, Vol.4 (7), p.2670-2673

2007

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Direct Wafer Bonding for Nanostructure Preparations

Solid state phenomena, 2007-03, Vol.121-123, p.29-32

2007

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Adhesion Energy and Bonding Wave Velocity Measurements

Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

SiO2-SiO2 die-to-wafer direct bonding interface weakening

Accurate control of the misorientation angles in direct wafer bonding

Surface plasma treatments enabling low température direct bonding

Direct bonding conditions of ferrite garnet layer on ion-exchanged glass waveguides

Influence of water diffusion in deposited silicon oxides on direct bonding of hydrophilic surfaces

Interface water diffusion in silicon direct bonding

Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment

Thin Layer Transfer Using Room Temperature Wafer-Level Bonding Process

Study of high-temperature Smart Cut™: Application to silicon-on-sapphire films and to thin foils of single crystal silicon

Impact of Water Edge Absorption on Silicon Oxide Direct Bonding Energy

Edge Water Penetration in Direct Bonding Interface

Mechanism involved in direct hydrophobic Si(100)-2x1:H bonding

Electrical modeling of the GaAs/InP wafer bonded heterojunction

Germanium oxynitride (GeOxNy) as a back interface passivation layer for Germanium-on-insulator substrates

Defect Formation at Hydrophilic Silicon Bonding Interfaces

InP-based composite substrates for four junction concentrator solar cells

Single Crystal Silicon Film Transfer onto Polymer

Direct inversion of interfacial reflectivity data using the Patterson function

Efficiency of H 2 O Diffusion Barriers at Si-Si Direct Bonding Interfaces

Nanopackaging of Si(100)H Wafer for Atomic-Scale Investigations

Drying Impact on Semiconductor Surfaces after Innovative Solvent Exposure

Realization of AlGaN/GaN HEMTs on Si-on-polySiC substrates

Direct Wafer Bonding for Nanostructure Preparations

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