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IEEE electron device letters, 2011-02, Vol.32 (2), p.200-202
2011
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Surface and interface analysis, 2013-01, Vol.45 (1), p.338-344
2013
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Microelectronic engineering, 2016-08, Vol.161, p.98-103
2016
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Journal of the American Ceramic Society, 1990-11, Vol.73 (11), p.3189-3194
1990
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Journal of applied physics, 2008-03, Vol.103 (5)
2008
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Microelectronic engineering, 2016-08, Vol.161, p.98-103
2016
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Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2008-05, Vol.26 (3), p.517-521
2008
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Journal of applied physics, 2008-03, Vol.103 (5), p.054104-054104-6
2008
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Microelectronic engineering, 2012-04, Vol.92, p.62-66
2012
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Applied physics letters, 1993-05, Vol.62 (18), p.2286-2288
1993
Link zum Volltext
2010 International Electron Devices Meeting, 2010, p.33.5.1-33.5.4
- Nogami, T
- Bolom, T
- Simon, A
- Kim, B
- Hu, C
- Tsumura, K
- Madan, A
- Baumann, F
- Wang, Y
- Flaitz, P
- Parks, C
- DeHaven, P
- Davis, R
- Zaitz, M
- Lawrence, B S
- Murphy, R
- Tai, L
- Molis, S
- Rhee, S
- Usui, T
- Cabral, C
- Maniscalco, J
- Clevenger, L
- Li, B
- Christiansen, C
- Chen, F
- Lee, T
- Schmatz, J
- Shobha, H
- Ito, F
- Ryan, T
- Nguyen, S
- Canaperi, D
- Arnold, J
- Choi, S
- Cohen, S
- Liniger, E
- Chen, H
- Chen, S
- Vo, T
- Kelly, J
- Straten, O
- Penny, C
- Bonilla, G
- Kozlowski, P
- Spooner, T
- Edelstein, D
2010
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2012 International Electron Devices Meeting, 2012, p.33.7.1-33.7.4
2012
- Link zum Volltext
Microelectronic engineering, 2012-04, Vol.92, p.42-44
- Augur, R.
- Child, C.
- Ahn, J.H.
- Tang, T.J.
- Clevenger, L.
- Kioussis, D.
- Masuda, H.
- Srivastava, R.
- Oda, Y.
- Oguma, H.
- Quon, R.
- Kim, B.
- Sheng, H.
- Hirooka, S.
- Gupta, R.
- Thomas, A.
- Singh, S.M.
- Fang, Q.
- Schiwon, R.
- Hamieh, B.
- Wornyo, E.
- Allen, S.
- Kaltalioglu, E.
- Ribes, G.
- Zhang, G.
- Fryxell, T.
- Ogino, A.
- Shimada, E.
- Aizawa, H.
- Minda, H.
- Kim, S.O.
- Oki, T.
- Fujii, K.
- Pallachalil, M.
- Takewaki, T.
- Hu, C.K.
- Sundlof, B.
- Permana, D.
- Bolom, T.
- Engel, B.
- Labelle, C.
- Sapp, B.
- Nogami, T.
- Simon, A.
- Shobha, H.
- Gates, S.
- Ryan, E.T.
- Bonilla, G.
- Daubenspeck, T.
- Shaw, T.
- Osborne, G.
- Grill, A.
- Edelstein, D.
- Restaino, D.
- Molis, S.
- Spooner, T.
- Ferreira, P.
- Biery, G.
- Sampson, R.
2012
Link zum Volltext
Microelectronic engineering, 2012-04, Vol.92, p.42-44
- AUGUR, R
- CHILD, C
- QUON, R
- KIM, B
- SHENG, H
- HIROOKA, S
- GUPTA, R
- THOMAS, A
- SINGH, S. M
- FANG, Q
- SCHIWON, R
- HAMIEH, B
- AHN, J. H
- WORNYO, E
- ALLEN, S
- KALTALIOGLU, E
- RIBES, G
- ZHANG, G
- FRYXELL, T
- OGINO, A
- SHIMADA, E
- AIZAWA, H
- MINDA, H
- TANG, T. J
- KIM, S. O
- OKI, T
- FUJII, K
- PALLACHALIL, M
- TAKEWAKI, T
- HU, C. K
- SUNDLOF, B
- PERMANA, D
- BOLOM, T
- ENGEL, B
- CLEVENGER, L
- LABELLE, C
- SAPP, B
- NOGAMI, T
- SIMON, A
- SHOBHA, H
- GATES, S
- RYAN, E. T
- BONILLA, G
- DAUBENSPECK, T
- SHAW, T
- KIOUSSIS, D
- OSBORNE, G
- GRILL, A
- EDELSTEIN, D
- RESTAINO, D
- MOLIS, S
- SPOONER, T
- FERREIRA, P
- BIERY, G
- SAMPSON, R
- MASUDA, H
- SRIVASTAVA, R
- ODA, Y
- OGUMA, H
2012
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Macromolecules, 1984-09, Vol.17 (9), p.1830-1834
1984
Link zum Volltext
Journal of adhesion science and technology, 1991-01, Vol.5 (7), p.509-521
1991
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Polymer engineering and science, 1983-07, Vol.23 (10), p.543-547
1983
Link zum Volltext
Applied surface science, 1989-09, Vol.38 (1-4), p.94-105
1989
Link zum Volltext
Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.214-216
- Edelstein, D.
- Davis, C.
- Clevenger, L.
- Yoon, M.
- Cowley, A.
- Nogami, T.
- Rathore, H.
- Agarwala, B.
- Arai, S.
- Carbone, A.
- Chanda, K.
- Cohen, S.
- Cote, W.
- Cullinan, M.
- Dalton, T.
- Das, S.
- Davis, P.
- Demarest, J.
- Dunn, D.
- Dziobkowski, C.
- Filippi, R.
- Fitzsimmons, J.
- Flaitz, P.
- Gates, S.
- Gill, J.
- Grill, A.
- Hawken, D.
- Ida, K.
- Klaus, D.
- Klymko, N.
- Lane, M.
- Lane, S.
- Lee, J.
- Landers, W.
- Li, W.-K.
- Lin, Y.-H.
- Liniger, E.
- Liu, X.-H.
- Madan, A.
- Malhotra, S.
- Martin, J.
- Molis, S.
- Muzzy, C.
- Nguyen, D.
- Nguyen, S.
- Ono, M.
- Parks, C.
- Questad, D.
- Restaino, D.
- Sakamoto, A.
- Shaw, T.
- Shimooka, Y.
- Simon, A.
- Simonyi, E.
- Tempest, S.
- Van Kleeck, T.
- Vogt, S.
- Wang, Y.-Y.
- Wille, W.
- Wright, J.
- Yang, C.-C.
- Ivers, T.
2004
- Link zum Volltext
Journal of materials science letters, 1991-01, Vol.10 (7), p.374-376
1991
Link zum Volltext
2004 IEEE International Reliability Physics Symposium. Proceedings, 2004, p.316-319
- Edelstein, D.
- Rathore, H.
- Davis, C.
- Clevenger, L.
- Cowley, A.
- Nogami, T.
- Agarwala, B.
- Arai, S.
- Carbone, A.
- Chanda, K.
- Chen, F.
- Cohen, S.
- Cote, W.
- Cullinan, M.
- Dalton, T.
- Das, S.
- Davis, P.
- Demarest, J.
- Dunn, D.
- Dziobkowski, C.
- Filippi, R.
- Fitzsimmons, J.
- Flaitz, P.
- Gates, S.
- Gill, J.
- Grill, A.
- Hawken, D.
- Ida, K.
- Klaus, D.
- Klymko, N.
- Lane, M.
- Lane, S.
- Lee, J.
- Landers, W.
- Li, W.-K.
- Lin, Y.-H.
- Liniger, E.
- Liu, X.-H.
- Madan, A.
- Malhotra, S.
- Martin, J.
- Molis, S.
- Muzzy, C.
- Nguyen, D.
- Nguyen, S.
- Ono, M.
- Parks, C.
- Questad, D.
- Restaino, D.
- Sakamoto, A.
- Shaw, T.
- Shimooka, Y.
- Simon, A.
- Simonyi, E.
- Swift, A.
- Van Kleeck, T.
- Vogt, S.
- Wang, Y.-Y.
- Wille, W.
- Wright, J.
- Yang, C.-C.
- Yoon, M.
- Ivers, T.
2004
- Link zum Volltext
2011 IEEE International Interconnect Technology Conference, 2011, p.1-3
2011
- Link zum Volltext
2011 IEEE International Interconnect Technology Conference, 2011, p.1-3
2011
- Link zum Volltext
Journal of adhesion science and technology, 1991-07, Vol.5 (7), p.509-521
1991
Link zum Volltext
Applied surface science, 1989, Vol.38 (1), p.94-105
1989
Link zum Volltext
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