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Inflammatory Cytokines Induce Sustained CTLA-4 Cell Surface Expression on Human MAIT Cells
ImmunoHorizons, 2020-01, Vol.4 (1), p.14-22
2020
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In Situ Stress and Reliability Monitoring on Plastic Packaging Through Piezoresistive Stress Sensor
IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1358-1363
2013
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The effects of nitrogen partial pressure on the properties of the TaNx films deposited by reactive magnetron sputtering
Surface & coatings technology, 2006-10, Vol.201 (3-4), p.1031-1036
2006
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A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FOAiP) for 60 GHz mmWave Applications
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2023, p.50-53
2023
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Warpage Reduction on a Typical Fan-out Wafer Level Process by an Encircling Silicon Ring
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021, p.168-172
2021
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The effects of nitrogen partial pressure on the properties of the TaN(x) films deposited by reactive magnetron sputtering
Surface & coatings technology, 2006-10, Vol.201 (3-4), p.1031-1036
2006
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The effects of nitrogen partial pressure on the properties of the TaN x films deposited by reactive magnetron sputtering
Surface & coatings technology, 2006, Vol.201 (3), p.1031-1036
2006
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The advanced pattern designs with electrical test methodologies on through silicon via for CMOS image sensor
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.297-302
2010
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In-situ reliability monitoring on PBGA packaging through piezoresistive stress sensor
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, p.1-4
2010
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Calibrate piezoresistive stress sensors through the assembled structure
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592), 2001, p.149-154
2001
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