UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 114

Sortiert nach

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-11, Vol.8 (11), p.2012-2020

2018

Volltextzugriff (PDF)

Genus Physalis L.: A review of resources and cultivation, chemical composition, pharmacological effects and applications

Journal of ethnopharmacology, 2024-04, Vol.324, p.117736, Article 117736

2024

Volltextzugriff (PDF)

Anti-aging activities of Rehmannia glutinosa Libosch. crude polysaccharide in Caenorhabditis elegans based on gut microbiota and metabonomic analysis

International journal of biological macromolecules, 2023-12, Vol.253, p.127647-127647, Article 127647

2023

Volltextzugriff (PDF)

Antioxidant and anti-aging effects of purified Rehmannia glutinosa polysaccharide in Caenorhabditis elegans

Process biochemistry (1991), 2024-02, Vol.137, p.41-53

2024

Volltextzugriff (PDF)

Multi-metabolomics and intestine microbiome analysis: YZC extract ameliorates septic-ALI by modulating intestine microbiota to reduce TMAO/NLRP3 signaling

Phytomedicine (Stuttgart), 2024-07, Vol.130, p.155345, Article 155345

2024

Volltextzugriff (PDF)

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Journal of micromechanics and microengineering, 2019-07, Vol.29 (7), p.75002

2019

Volltextzugriff (PDF)

Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2016-09, Vol.34 (5)

2016

Volltextzugriff (PDF)

Fabrication and Characterization of a Low Parasitic Capacitance and Low-Stress Si Interposer for 2.5-D Integration

IEEE transactions on semiconductor manufacturing, 2018-11, Vol.31 (4), p.521-527

2018

Volltextzugriff (PDF)

Process development of through-glass-via (TGV) interposer for radio frequency (RF) applications

2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2016, p.1-4

2016

Volltextzugriff (PDF)

Process Development and Characterization for Integrating Microchannel into TSV Interposer

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.2487-2493

2016

Volltextzugriff (PDF)

Design, fabrication and stress evaluation of Si electrical interconnection Air-gapped from Si interposer

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.719-723

2015

Volltextzugriff (PDF)

Process development of a new TGV interposer for wafer level package of inertial MEMS device

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.983-987

2016

Volltextzugriff (PDF)

Fabrication and Characterization of Low Stress Si Interposer with Air-Gapped Si Interconnection for Hermetical System-in-Package

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1758-1764

2016

Volltextzugriff (PDF)

Process development of thick Si interposer for 2.5D integration of RF MEMS devices

2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2016, p.1-4

2016

Volltextzugriff (PDF)

Design and characterization of petaloid hollow Cu interconnection for interposer

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.1033-1036

2016

Volltextzugriff (PDF)

A novel TSV interposer based System-in-Package for RF applications

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-5

2018

Volltextzugriff (PDF)

A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2018, p.304-307

2018

Volltextzugriff (PDF)

Si interposer with multiple cavities for 3D stacked fan-out package

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.1406-1410

2018

Volltextzugriff (PDF)

Self-Assembled DNA Nanoflowers Triggered by a DNA Walker for Highly Sensitive Electrochemical Detection of Staphylococcus aureus

ACS applied materials & interfaces, 2021-02, Vol.13 (4), p.4905-4914

2021

Volltextzugriff (PDF)

The performance enhancement and temperature dependence of piezoelectric properties for Pb(Mg1/3Nb2/3)O3-0.30PbTiO3 single crystal by alternating current polarization

Journal of applied physics, 2019-01, Vol.125 (3)

2019

Volltextzugriff (PDF)

Dynamic scaling hysteresis behavior and field-induced domain transition of 0.16PIN-0.62PMN-0.22 PT single crystals

Current Applied Physics, 2021, 21(1), , pp.64-71

2021

Volltextzugriff (PDF)

A Fully Biodegradable Battery for Self‐Powered Transient Implants

Small (Weinheim an der Bergstrasse, Germany), 2018-07, Vol.14 (28), p.e1800994-n/a

2018

Volltextzugriff (PDF)

The influence of punching process on residual stress and magnetic domain structure of non-oriented silicon steel

Journal of magnetism and magnetic materials, 2016-05, Vol.406, p.42-47

2016

Volltextzugriff (PDF)

Theoretical study on low-temperature oxidation kinetics of methyl pentanoate

Combustion and flame, 2024-03, Vol.261, p.113320, Article 113320

2024

Volltextzugriff (PDF)

Analysis of Forest Deforestation and its Driving Factors in Myanmar from 1988 to 2017

Sustainability, 2019-06, Vol.11 (11), p.3047

2019

Volltextzugriff (PDF)

1 – 25 von 114

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(100)
Mit Volltextzugriff
(103)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(86)
Life Sciences & Biomedicine
(42)
Technology
(37)
Physical Sciences
(33)
Humans
(29)
Materials Science
(20)
Chemistry
(16)
Engineering
(16)
Materials Science, Multidisciplinary
(16)
Physics
(14)
Adult
(11)
Engineering, Electrical & Electronic
(11)
Physics, Applied
(11)
Science & Technology - Other Topics
(11)
Silicon
(11)
Female
(10)
Neurosciences & Neurology
(10)
Psychiatry
(10)
Male
(9)
Physics, Condensed Matter
(9)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(3)

Menü

Weitere Dienste

Einstellungen

Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Genus Physalis L.: A review of resources and cultivation, chemical composition, pharmacological effects and applications

Anti-aging activities of Rehmannia glutinosa Libosch. crude polysaccharide in Caenorhabditis elegans based on gut microbiota and metabonomic analysis

Antioxidant and anti-aging effects of purified Rehmannia glutinosa polysaccharide in Caenorhabditis elegans

Multi-metabolomics and intestine microbiome analysis: YZC extract ameliorates septic-ALI by modulating intestine microbiota to reduce TMAO/NLRP3 signaling

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology

Fabrication and Characterization of a Low Parasitic Capacitance and Low-Stress Si Interposer for 2.5-D Integration

Process development of through-glass-via (TGV) interposer for radio frequency (RF) applications

Process Development and Characterization for Integrating Microchannel into TSV Interposer

Design, fabrication and stress evaluation of Si electrical interconnection Air-gapped from Si interposer

Process development of a new TGV interposer for wafer level package of inertial MEMS device

Fabrication and Characterization of Low Stress Si Interposer with Air-Gapped Si Interconnection for Hermetical System-in-Package

Process development of thick Si interposer for 2.5D integration of RF MEMS devices

Design and characterization of petaloid hollow Cu interconnection for interposer

A novel TSV interposer based System-in-Package for RF applications

A Study on High Resolution Batch-Mode Micro-Utralsonic-Machining with Constant Feed Force of Sapphire for MEMS Application

Si interposer with multiple cavities for 3D stacked fan-out package

Self-Assembled DNA Nanoflowers Triggered by a DNA Walker for Highly Sensitive Electrochemical Detection of Staphylococcus aureus

The performance enhancement and temperature dependence of piezoelectric properties for Pb(Mg1/3Nb2/3)O3-0.30PbTiO3 single crystal by alternating current polarization

Dynamic scaling hysteresis behavior and field-induced domain transition of 0.16PIN-0.62PMN-0.22 PT single crystals

A Fully Biodegradable Battery for Self‐Powered Transient Implants

The influence of punching process on residual stress and magnetic domain structure of non-oriented silicon steel

Theoretical study on low-temperature oxidation kinetics of methyl pentanoate

Analysis of Forest Deforestation and its Driving Factors in Myanmar from 1988 to 2017

Suchergebnisse filtern