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Through-Silicon Via Fault-Tolerant Clock Networks for 3-D ICs

IEEE transactions on computer-aided design of integrated circuits and systems, 2013-07, Vol.32 (7), p.1100-1109

2013

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Soft-Error-Tolerant Design Methodology for Balancing Performance, Power, and Reliability

IEEE transactions on very large scale integration (VLSI) systems, 2015-09, Vol.23 (9), p.1628-1639

2015

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Thermal-Aware On-Line Scheduler for 3-D Many-Core Processor Throughput Optimization

IEEE transactions on computer-aided design of integrated circuits and systems, 2014-05, Vol.33 (5), p.763-773

2014

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Fault-tolerant 3D clock network

2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC), 2011, p.645-651

2011

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Clock skew optimization considering complicated power modes

Proceedings of the Conference on Design, Automation and Test in Europe, 2010, p.1474-1479

2010

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Thermal stress aware design for stacking IC with through glass via

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.133-136

2012

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Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1455-1460

2012

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SoC power analysis framework and its application to power-thermal co-simulation

Proceedings of 2011 International Symposium on VLSI Design, Automation and Test, 2011, p.1-4

2011

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Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.873-879

2011

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TSV fault-tolerant mechanisms with application to 3D clock networks

2011 International SoC Design Conference, 2011, p.127-130

2011

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LP-based multi-mode multi-corner clock skew optimization

Proceedings of 2010 International Symposium on VLSI Design, Automation and Test, 2010, p.335-338

2010

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Design and implementation of 3D-thermal test chip for exploration of package effects

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.238-241

2011

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Thermal analysis experiences of a tri-core SoC system

The 2010 International Conference on Green Circuits and Systems, 2010, p.589-594

2010

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Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization

2011 Design, Automation & Test in Europe, 2011, p.1-6

2011

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Clock skew optimization considering complicated power modes

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010), 2010, p.1474-1479

2010

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Three-Dimensional integrated Circuits Design For Thousand-Core Processors : From Aspect of Thermal Management

Lung, Chiao-Ling

2012

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Floorplanning 1024 cores in a 3D-stacked networkon- chip with thermal-aware redistribution

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-6

2010

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Laparoscopic training workshop to assess medical students' skill acquisition and interest in surgical careers

BMC medical education, 2024-07, Vol.24 (1), p.721-9, Article 721

2024

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Elizabethkingia Intra-Abdominal Infection and Related Trimethoprim-Sulfamethoxazole Resistance: A Clinical-Genomic Study

Antibiotics (Basel), 2021-02, Vol.10 (2), p.173

2021

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Fenofibrate Facilitates Post-Active Tuberculosis Infection in Macrophages and is Associated with Higher Mortality in Patients under Long-Term Treatment

Journal of clinical medicine, 2020-01, Vol.9 (2), p.337

2020

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The 8-oxoguanine glycosylase I (hOGG1) Ser326Cys variant affects the susceptibility to multi-vessel disease in Taiwan coronary artery disease patients

Thrombosis research, 2010-10, Vol.126 (4), p.319-323

2010

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A CMOS transceiver with internal PA and digital pre-distortion for WLAN 802.11a/b/g/n Applications

2010 IEEE Radio Frequency Integrated Circuits Symposium, 2010, p.435-438

2010

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Unraveling the role of hepatitis B virus DNA integration in B-cell lymphomagenesis

British journal of cancer, 2024-10, Vol.131 (6), p.996-1004

2024

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The 8-oxoguanine glycosylase I (hOGG1) Ser 326 Cys variant affects the susceptibility to multi-vessel disease in Taiwan coronary artery disease patients

Thrombosis research, 2010, Vol.126 (4), p.319-323

2010

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Through-Silicon Via Fault-Tolerant Clock Networks for 3-D ICs

Soft-Error-Tolerant Design Methodology for Balancing Performance, Power, and Reliability

Thermal-Aware On-Line Scheduler for 3-D Many-Core Processor Throughput Optimization

Fault-tolerant 3D clock network

Clock skew optimization considering complicated power modes

Thermal stress aware design for stacking IC with through glass via

Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures

SoC power analysis framework and its application to power-thermal co-simulation

Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons

TSV fault-tolerant mechanisms with application to 3D clock networks

LP-based multi-mode multi-corner clock skew optimization

Design and implementation of 3D-thermal test chip for exploration of package effects

Thermal analysis experiences of a tri-core SoC system

Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization

Clock skew optimization considering complicated power modes

Three-Dimensional integrated Circuits Design For Thousand-Core Processors : From Aspect of Thermal Management

Floorplanning 1024 cores in a 3D-stacked networkon- chip with thermal-aware redistribution

Laparoscopic training workshop to assess medical students' skill acquisition and interest in surgical careers

Elizabethkingia Intra-Abdominal Infection and Related Trimethoprim-Sulfamethoxazole Resistance: A Clinical-Genomic Study

Fenofibrate Facilitates Post-Active Tuberculosis Infection in Macrophages and is Associated with Higher Mortality in Patients under Long-Term Treatment

The 8-oxoguanine glycosylase I (hOGG1) Ser326Cys variant affects the susceptibility to multi-vessel disease in Taiwan coronary artery disease patients

A CMOS transceiver with internal PA and digital pre-distortion for WLAN 802.11a/b/g/n Applications

Unraveling the role of hepatitis B virus DNA integration in B-cell lymphomagenesis

The 8-oxoguanine glycosylase I (hOGG1) Ser 326 Cys variant affects the susceptibility to multi-vessel disease in Taiwan coronary artery disease patients

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