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Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Journal of electronic materials, 2018-03, Vol.47 (3), p.1832-1846

2018

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IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Microelectronics and reliability, 2013-01, Vol.53 (1), p.30-40

2013

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Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-12, Vol.3 (12), p.2037-2047

2013

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Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

Computers, materials & continua, 2013, Vol.38 (3), p.129-154

2013

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Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects

IEEE transactions on components and packaging technologies, 2010-12, Vol.33 (4), p.819-829

2010

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Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-01, Vol.1 (1), p.33-42

2011

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58.2: Distinguished Paper: Roll-to-roll Process on Ultra-thin Flexible Glass for Manufacturing the Multi-Touch Sensor Panel

SID International Symposium Digest of technical papers, 2013-06, Vol.44 (1), p.807-809

2013

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Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints

IEEE transactions on advanced packaging, 2010-08, Vol.33 (3), p.702-712

2010

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Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1043-1049

2010

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Development and reliability of ultra-thin chip on plastic bonding for flexible liquid crystal displays

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.575-580

2010

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Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

2008 58th Electronic Components and Technology Conference, 2008, p.1287-1293

2008

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Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.71-76

2013

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The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.114-118

2012

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Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.171-174

2012

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Temperature effects on ink transfer performance of gravure offset printing for fine-line circuitry

2017 International Conference on Electronics Packaging (ICEP), 2017, p.475-478

2017

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A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch

2009 59th Electronic Components and Technology Conference, 2009, p.1544-1551

2009

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Theoretical and experimental characterization of process-induced thermal-mechanical behaviors of an ultra-thin chip-on-film assembly

2007 International Microsystems, Packaging, Assembly and Circuits Technology, 2007, p.318-321

2007

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Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure

2006 8th Electronics Packaging Technology Conference, 2006, p.324-329

2006

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Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing

Microelectronics and reliability, 2012-08, Vol.52 (8), p.1699-1710

2012

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An innovative chip-to-wafer and wafer-to-wafer stacking

56th Electronic Components and Technology Conference 2006, 2006, p.6 pp.

2006

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Development and characterization of rigid-flex interface

56th Electronic Components and Technology Conference 2006, 2006, p.5 pp.

2006

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Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.14-21

2011

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Reliability of 20 μm pitch ncf type cof package with compliant-bump

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009, p.568-571

2009

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Mechanical analysis of Ultra-Thin-Chip-on-Flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, p.1-4

2010

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Influence of IMC surface geometry and material properties on micro-bump reliability of 3D Chip-on-Chip interconnect technology

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.210-213

2011

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Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects

Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch

58.2: Distinguished Paper: Roll-to-roll Process on Ultra-thin Flexible Glass for Manufacturing the Multi-Touch Sensor Panel

Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints

Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection

Development and reliability of ultra-thin chip on plastic bonding for flexible liquid crystal displays

Reliability of ultra-thin chip-on-flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

Temperature effects on ink transfer performance of gravure offset printing for fine-line circuitry

A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch

Theoretical and experimental characterization of process-induced thermal-mechanical behaviors of an ultra-thin chip-on-film assembly

Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure

Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing

An innovative chip-to-wafer and wafer-to-wafer stacking

Development and characterization of rigid-flex interface

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Reliability of 20 μm pitch ncf type cof package with compliant-bump

Mechanical analysis of Ultra-Thin-Chip-on-Flex (UTCOF) with anisotropic conductive adhesive (ACA) joints

Influence of IMC surface geometry and material properties on micro-bump reliability of 3D Chip-on-Chip interconnect technology

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