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2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008, p.714-719
2008
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Thema
- Dielectric Constant
- Dielectric Materials
- Dielectric Substrates
- Electronics Packaging
- Engineering
- Engineering, Electrical & Electronic
- Engineering, Mechanical
- Mechanical Factors
- Optical Films
- Physical Sciences
- Science & Technology
- Strain Measurement
- Technology
- Temperature
- Thermal Expansion
- Thermal Stresses
- Thermodynamics
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