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IEEE transactions on components and packaging technologies, 2007-12, Vol.30 (4), p.824-829
2007
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Microelectronic engineering, 2014-01, Vol.113, p.40-49
2014
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International journal of adhesion and adhesives, 2005-02, Vol.25 (1), p.1-12
2005
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International communications in heat and mass transfer, 2012-12, Vol.39 (10), p.1616-1623
2012
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International journal of adhesion and adhesives, 2006-08, Vol.26 (5), p.325-336
2006
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Microelectronics and reliability, 2013-04, Vol.53 (4), p.600-611
2013
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British journal of general practice, 2017-03, Vol.67 (656), p.e168-e177
2017
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Engineering fracture mechanics, 2002-12, Vol.69 (18), p.2113-2128
2002
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Applied Mechanics and Materials, 2015-08, Vol.786 (Trends and Applications in Mechanical Engineering), p.361-366
2015
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Hong Kong medical journal = Xianggang yi xue za zhi, 2021-02, Vol.27 (1), p.70-72
2021
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Engineering applications of computational fluid mechanics, 2013, Vol.7 (2), p.210-222
2013
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Journal of engineering science & technology, 2017-04, Vol.12 (4), p.948-957
2017
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Journal of adhesion science and technology, 2002-01, Vol.16 (11), p.1407-1429
2002
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Pattern recognition, 2001-06, Vol.34 (6), p.1127-1146
2001
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1984
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7th International Conference on Control, Automation, Robotics and Vision, 2002. ICARCV 2002, 2002, Vol.2, p.820-825 vol.2
2002
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2005 7th Electronic Packaging Technology Conference, 2005, Vol.2, p.5 pp.
2005
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Proceedings of the 2005 IEEE International Conference on Robotics and Automation, 2005, p.1585-1590
2005
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2006 International Electron Devices Meeting, 2006, p.1-4
2006
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2003 IEEE International Conference on Robotics and Automation (Cat. No.03CH37422), 2003, Vol.3, p.3237-3242 vol.3
2003
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2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.102-108
2006
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IEEE journal of solid-state circuits, 1986-10, Vol.21 (5), p.635-642
1986
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Proceedings of ICCS '94, 1994, Vol.2, p.389-392 vol.2
1994
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Proceedings of IEEE 3rd International Symposium on Spread Spectrum Techniques and Applications (ISSSTA'94), 1994, p.372-375 vol.2
1994
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Journal of industrial and engineering chemistry (Seoul, Korea)
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