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Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm)

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.2466-2480

2020

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Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength

Acta materialia, 2018-05, Vol.149, p.350-363

2018

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SiO2@C hollow sphere anodes for lithium-ion batteries

Journal of materials science & technology, 2017-03, Vol.33 (3), p.239-245

2017

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Reliability issues of lead-free solder joints in electronic devices

Science and technology of advanced materials, 2019-12, Vol.20 (1), p.876-901

2019

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Science and technology of advanced materials, 2019-12, Vol.20 (1), p.421-444

2019

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Review of Large Spacecraft Deployable Membrane Antenna Structures

Chinese journal of mechanical engineering, 2017-11, Vol.30 (6), p.1447-1459

English ed., 2017

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Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor

IEEE transactions on magnetics, 2022-04, Vol.58 (4), p.1-7

2022

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Boosting Li ion kinetics in H–Co3O4@CNT electrode by synergic design of CNT coating and hollow structure

Journal of power sources, 2024-04, Vol.599, p.234234, Article 234234

2024

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Materials, processing and reliability of low temperature bonding in 3D chip stacking

Journal of alloys and compounds, 2018-06, Vol.750, p.980-995

2018

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Sweet Sorghum Originated through Selection of Dry, a Plant-Specific NAC Transcription Factor Gene

The Plant cell, 2018-10, Vol.30 (10), p.2286-2307

2018

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Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Journal of materials science. Materials in electronics, 2022-02, Vol.33 (4), p.1942-1952

2022

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Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors

Journal of materials science. Materials in electronics, 2022-03, Vol.33 (7), p.3576-3585

2022

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SbHKT1;4, a member of the high-affinity potassium transporter gene family from Sorghum bicolor, functions to maintain optimal Na＋/K＋ balance under Na＋ stress

Journal of integrative plant biology, 2014-03, Vol.56 (3), p.315-332

2014

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Improving Electromigration Resistance of Fine‐Pitch Redistributed Layer Using Graphene‐Doped Twinned Copper Composites

Advanced engineering materials, 2024-03, Vol.26 (6), p.n/a

2024

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Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging

Materials, 2023-06, Vol.16 (13), p.4614

2023

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Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (19), p.17583-17590

2019

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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

Journal of materials science. Materials in electronics, 2021, Vol.32 (2), p.2172-2186

2021

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Effects of salinity acclimation on the growth performance, osmoregulation and energy metabolism of the oriental river prawn, Macrobrachium nipponense (De Haan)

Aquaculture research, 2019-02, Vol.50 (2), p.685-693

2019

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Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

Journal of microscopy (Oxford), 2020-09, Vol.279 (3), p.212-216

2020

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Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

Advanced engineering materials, 2024-06, Vol.26 (12), p.n/a

2024

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Parametric Design of Functional Interval Observer for Time-Delay Systems with Additive Disturbances

Circuits, systems, and signal processing, 2022-05, Vol.41 (5), p.2614-2635

2022

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Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

ACS applied materials & interfaces, 2019-01, Vol.11 (3), p.3231-3240

2019

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Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Metals (Basel ), 2024-01, Vol.14 (2), p.139

2024

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Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Small (Weinheim an der Bergstrasse, Germany), 2015-09, Vol.11 (33), p.4097-4103

2015

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Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

Journal of electronic materials, 2020-04, Vol.49 (4), p.2651-2659

2020

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Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm)

Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength

SiO2@C hollow sphere anodes for lithium-ion batteries

Reliability issues of lead-free solder joints in electronic devices

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Review of Large Spacecraft Deployable Membrane Antenna Structures

Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor

Boosting Li ion kinetics in H–Co3O4@CNT electrode by synergic design of CNT coating and hollow structure

Materials, processing and reliability of low temperature bonding in 3D chip stacking

Sweet Sorghum Originated through Selection of Dry, a Plant-Specific NAC Transcription Factor Gene

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors

SbHKT1;4, a member of the high-affinity potassium transporter gene family from Sorghum bicolor, functions to maintain optimal Na＋/K＋ balance under Na＋ stress

Improving Electromigration Resistance of Fine‐Pitch Redistributed Layer Using Graphene‐Doped Twinned Copper Composites

Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging

Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder

Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

Effects of salinity acclimation on the growth performance, osmoregulation and energy metabolism of the oriental river prawn, Macrobrachium nipponense (De Haan)

Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

Parametric Design of Functional Interval Observer for Time-Delay Systems with Additive Disturbances

Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

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