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Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm)

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.2466-2480

2020

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Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength

Acta materialia, 2018-05, Vol.149, p.350-363

2018

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SiO2@C hollow sphere anodes for lithium-ion batteries

Journal of materials science & technology, 2017-03, Vol.33 (3), p.239-245

2017

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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Science and technology of advanced materials, 2019-12, Vol.20 (1), p.421-444

2019

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Reliability issues of lead-free solder joints in electronic devices

Science and technology of advanced materials, 2019-12, Vol.20 (1), p.876-901

2019

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Review of Large Spacecraft Deployable Membrane Antenna Structures

Chinese journal of mechanical engineering, 2017-11, Vol.30 (6), p.1447-1459

English ed., 2017

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Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor

IEEE transactions on magnetics, 2022-04, Vol.58 (4), p.1-7

2022

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Boosting Li ion kinetics in H–Co3O4@CNT electrode by synergic design of CNT coating and hollow structure

Journal of power sources, 2024-04, Vol.599, p.234234, Article 234234

2024

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Materials, processing and reliability of low temperature bonding in 3D chip stacking

Journal of alloys and compounds, 2018-06, Vol.750, p.980-995

2018

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Sweet Sorghum Originated through Selection of Dry, a Plant-Specific NAC Transcription Factor Gene

The Plant cell, 2018-10, Vol.30 (10), p.2286-2307

2018

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Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Journal of materials science. Materials in electronics, 2022-02, Vol.33 (4), p.1942-1952

2022

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Improving Electromigration Resistance of Fine‐Pitch Redistributed Layer Using Graphene‐Doped Twinned Copper Composites

Advanced engineering materials, 2024-03, Vol.26 (6), p.n/a

2024

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SbHKT1;4, a member of the high-affinity potassium transporter gene family from Sorghum bicolor, functions to maintain optimal Na＋/K＋ balance under Na＋ stress

Journal of integrative plant biology, 2014-03, Vol.56 (3), p.315-332

2014

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Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors

Journal of materials science. Materials in electronics, 2022-03, Vol.33 (7), p.3576-3585

2022

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Effects of salinity acclimation on the growth performance, osmoregulation and energy metabolism of the oriental river prawn, Macrobrachium nipponense (De Haan)

Aquaculture research, 2019-02, Vol.50 (2), p.685-693

2019

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Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging

Materials, 2023-06, Vol.16 (13), p.4614

2023

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Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (19), p.17583-17590

2019

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Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters

Journal of microscopy (Oxford), 2020-09, Vol.279 (3), p.212-216

2020

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Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

Journal of materials science. Materials in electronics, 2021, Vol.32 (2), p.2172-2186

2021

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Influence of Macroscale Dimension on the Electrocrystallization of Cu Pad and Redistributed Layer in Advanced Packaging

Advanced engineering materials, 2024-06, Vol.26 (12), p.n/a

2024

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Parametric Design of Functional Interval Observer for Time-Delay Systems with Additive Disturbances

Circuits, systems, and signal processing, 2022-05, Vol.41 (5), p.2614-2635

2022

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Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics

ACS applied materials & interfaces, 2019-01, Vol.11 (3), p.3231-3240

2019

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Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Metals (Basel ), 2024-01, Vol.14 (2), p.139

2024

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Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections

Small (Weinheim an der Bergstrasse, Germany), 2015-09, Vol.11 (33), p.4097-4103

2015

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Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

Journal of electronic materials, 2020-04, Vol.49 (4), p.2651-2659

2020

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