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Relationship between interfacial adhesion and electromigration in Cu metallization

Journal of applied physics, 2003-02, Vol.93 (3), p.1417-1421

2003

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Processing and moisture effects on TDDB for Cu/ULK BEOL structures

Microelectronic engineering, 2012-04, Vol.92, p.130-133

2012

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Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures

Thin solid films, 2006-08, Vol.513 (1-2), p.295-299

2006

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Effect of liner thickness on electromigration lifetime

Journal of applied physics, 2003-06, Vol.93 (12), p.9576-9582

2003

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Polymeric Organic−Inorganic Hybrid Nanocomposites: Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) Precursors

Macromolecules, 1997-12, Vol.30 (26), p.8512-8515

1997

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Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects

Microelectronic engineering, 2003-11, Vol.70 (2), p.398-405

2003

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Stress‐Corrosion Cracking of Low‐Dielectric‐Constant Spin‐On‐Glass Thin Films

Journal of the Electrochemical Society, 1999-12, Vol.146 (12), p.4439-4448

1999

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Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics

Review of scientific instruments, 2000-05, Vol.71 (5), p.1991-2000

2000

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Random loose packings of uniform spheres and the dilatancy onset

Physical review letters, 1990-05, Vol.64 (22), p.2727-2730

1990

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Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Applied physics letters, 2000-06, Vol.76 (25), p.3726-3728

2000

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Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films

Journal of applied physics, 2004-09, Vol.96 (6), p.3482-3485

2004

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Delamination from edge flaws

Proceedings of the Royal Society. A, Mathematical and physical sciences, 1994-11, Vol.447 (1930), p.271-279

1994

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Phase Compatibilities in the System Y2O3-BaO-CuO at 950°C

Journal of the American Ceramic Society, 1987-09, Vol.70 (9), p.C-204-C-205

1987

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Grain-size effects in the indentation fracture of MgO

Journal of materials science, 1992-09, Vol.27 (17), p.4751-4761

1992

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Kinetics of Indentation Cracking in Glass

Journal of the American Ceramic Society, 1993-05, Vol.76 (5), p.1096-1105

1993

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Low-field TDDB reliability data to enable accurate lifetime predictions

2014 IEEE International Reliability Physics Symposium, 2014, p.BD.4.1-BD.4.4

2014

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Spatial Variations in the Sintering Rate of Ordered and Disordered Particle Structures

Journal of the American Ceramic Society, 1988-09, Vol.71 (9), p.C-408-C-410

1988

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Characterization of substrate/thin-film interfaces with x-ray microdiffraction

Applied physics letters, 1998-06, Vol.72 (25), p.3338-3340

1998

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Effect of moisture on the time dependent dielectric breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric

2005 IEEE International Integrated Reliability Workshop, 2005, p.5 pp.

2005

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A Controlled Flaw Technique for Lifetime Characterization

Journal of the American Ceramic Society, 1993-08, Vol.76 (8), p.2123-2126

1993

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Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires

Applied physics letters, 2001-04, Vol.78 (18), p.2712-2714

2001

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Materials and scaling effects on on-chip interconnect reliability

MRS proceedings, 2013, Vol.1559 (1), Article mrss13-1559-aa07-01

2013

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Effect of H2O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners

2016 IEEE International Reliability Physics Symposium (IRPS), 2016, p.DI-7-1-DI-7-5

2016

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Pore orientation and silylation effects on mesoporous silica film properties

Applied physics letters, 2009-03, Vol.94 (9), p.093502-093502-3

2009

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Growth and configurational stability of circular, buckling-driven film delaminations

Acta metallurgica et materialia, 1992-02, Vol.40 (2), p.295-308

1992

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Relationship between interfacial adhesion and electromigration in Cu metallization

Processing and moisture effects on TDDB for Cu/ULK BEOL structures

Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures

Effect of liner thickness on electromigration lifetime

Polymeric Organic−Inorganic Hybrid Nanocomposites: Preparation of Polyimide-Modified Poly(silsesquioxane) Using Functionalized Poly(amic acid alkyl ester) Precursors

Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects

Stress‐Corrosion Cracking of Low‐Dielectric‐Constant Spin‐On‐Glass Thin Films

Divergence effects in monochromatic x-ray microdiffraction using tapered capillary optics

Random loose packings of uniform spheres and the dilatancy onset

Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films

Delamination from edge flaws

Phase Compatibilities in the System Y2O3-BaO-CuO at 950°C

Grain-size effects in the indentation fracture of MgO

Kinetics of Indentation Cracking in Glass

Low-field TDDB reliability data to enable accurate lifetime predictions

Spatial Variations in the Sintering Rate of Ordered and Disordered Particle Structures

Characterization of substrate/thin-film interfaces with x-ray microdiffraction

Effect of moisture on the time dependent dielectric breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric

A Controlled Flaw Technique for Lifetime Characterization

Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires

Materials and scaling effects on on-chip interconnect reliability

Effect of H2O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners

Pore orientation and silylation effects on mesoporous silica film properties

Growth and configurational stability of circular, buckling-driven film delaminations

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