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Bioimaging of alloantigen-stimulated regulatory T cells in rat vascularized composite allotransplantation

PloS one, 2018-09, Vol.13 (9), p.e0203624-e0203624

2018

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Enhancing Immunomodulatory Function of Mesenchymal Stromal Cells by Hydrogel Encapsulation

Cells (Basel, Switzerland), 2024-01, Vol.13 (3), p.210

2024

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Preconditioned Mesenchymal Stromal Cells to Improve Allotransplantation Outcome

Cells (Basel, Switzerland), 2021-09, Vol.10 (9), p.2325

2021

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Predicting Outcomes of Rat Vascularized Composite Allotransplants through Quantitative Measurement of Chimerism with PCR-Amplified Short Tandem Repeat

Journal of immunology research, 2020, Vol.2020 (2020), p.1-10

2020

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A novel rat full‐thickness hemi‐abdominal wall/hindlimb osteomyocutaneous combined flap: influence of allograft mass and vascularized bone marrow content on vascularized composite allograft survival

Transplant international, 2014-09, Vol.27 (9), p.977-986

2014

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Geometric effect on photonic nanojet generated by dielectric microcylinders with non-cylindrical cross-sections

Optics communications, 2016-12, Vol.380, p.287-296

2016

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Reciprocal Donor-Recipient Strain Combinations Present Different Vascularized Composite Allotransplantation Outcomes in Rodent Models

Plastic and reconstructive surgery (1963), 2023-06, Vol.151 (6), p.1220

2023

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Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints

Journal of alloys and compounds, 2017-06, Vol.708, p.220-230

2017

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Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions

Journal of alloys and compounds, 2016-05, Vol.668, p.91-96

2016

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Comparison of multiple imputation algorithms and verification using whole-genome sequencing in the CMUH genetic biobank

Biomedicine (Taipei), 2021-01, Vol.11 (4), p.57-65

2021

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Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers

Journal of the Electrochemical Society, 2014-01, Vol.161 (10), p.D522-D527

2014

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Syngeneic adipose-derived stem cells with short-term immunosuppression induce vascularized composite allotransplantation tolerance in rats

Cytotherapy (Oxford, England), 2014-03, Vol.16 (3), p.369-380

2014

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Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn

Journal of electronic materials, 2015, Vol.44 (1), p.511-517

2015

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Electrochemical fabrication of transparent nickel hydroxide nanostructures with tunable superhydrophobicity/superhydrophilicity for 2D microchannels application

Journal of materials chemistry. A, Materials for energy and sustainability, 2014-01, Vol.2 (6), p.1985-1990

2014

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Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10)

Journal of electronic materials, 2012-12, Vol.41 (12), p.3303-3308

2012

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Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-10, Vol.4 (10), p.1739-1744

2014

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Does Chinese OFDI really promote export?

China finance and economic review, 2016-10, Vol.4 (1), p.1-16, Article 13

Lin, Chih-Fan

2016

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Does Chinese OFDI really promote export?

China finance and economic review, 2016-09, Vol.5 (3), p.110-128

Chih-Fan, Lin

2016

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Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2012-08, Vol.43 (8), p.2571-2573

2012

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Retarding the Cu5Zn8 phase fracture at the Sn–9wt.% Zn/Cu interface

Scripta materialia, 2011-04, Vol.64 (7), p.633-636

2011

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Retarding the Cu 5Zn 8 phase fracture at the Sn–9 wt.% Zn/Cu interface

Scripta materialia, 2011, Vol.64 (7), p.633-636

2011

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Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10) : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Journal of electronic materials, 2012, Vol.41 (12), p.3303-3308

2012

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Effect of Sn Grain Orientation on the Cu^sub 6^Sn^sub 5^ Formation in a Sn-Based Solder Under Current Stressing

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2012-08, Vol.43 (8), p.2571

2012

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5G High Mobility Wireless Communications: Challenges and Solutions

China communications, 2016, Vol.13 (S2), p.1-13

2016

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Ch'uan T'ang shih tien-ku tz'u-tien (Shang, hsia) (Quan Tang shi dian gu ci dian) (Shang, xia)

Chinese literature, essays, articles, reviews, 1989-12, Vol.11, p.171

1989

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Bioimaging of alloantigen-stimulated regulatory T cells in rat vascularized composite allotransplantation

Enhancing Immunomodulatory Function of Mesenchymal Stromal Cells by Hydrogel Encapsulation

Preconditioned Mesenchymal Stromal Cells to Improve Allotransplantation Outcome

Predicting Outcomes of Rat Vascularized Composite Allotransplants through Quantitative Measurement of Chimerism with PCR-Amplified Short Tandem Repeat

A novel rat full‐thickness hemi‐abdominal wall/hindlimb osteomyocutaneous combined flap: influence of allograft mass and vascularized bone marrow content on vascularized composite allograft survival

Geometric effect on photonic nanojet generated by dielectric microcylinders with non-cylindrical cross-sections

Reciprocal Donor-Recipient Strain Combinations Present Different Vascularized Composite Allotransplantation Outcomes in Rodent Models

Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints

Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions

Comparison of multiple imputation algorithms and verification using whole-genome sequencing in the CMUH genetic biobank

Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers

Syngeneic adipose-derived stem cells with short-term immunosuppression induce vascularized composite allotransplantation tolerance in rats

Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn

Electrochemical fabrication of transparent nickel hydroxide nanostructures with tunable superhydrophobicity/superhydrophilicity for 2D microchannels application

Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10)

Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints

Does Chinese OFDI really promote export?

Does Chinese OFDI really promote export?

Effect of Sn Grain Orientation on the Cu6Sn5 Formation in a Sn-Based Solder Under Current Stressing

Retarding the Cu5Zn8 phase fracture at the Sn–9wt.% Zn/Cu interface

Retarding the Cu 5Zn 8 phase fracture at the Sn–9 wt.% Zn/Cu interface

Interfacial Reactions and Mechanical Properties of Bi-x wt.%Sn/Cu Joints (x = 2, 5, 10) : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Effect of Sn Grain Orientation on the Cu^sub 6^Sn^sub 5^ Formation in a Sn-Based Solder Under Current Stressing

5G High Mobility Wireless Communications: Challenges and Solutions

Ch'uan T'ang shih tien-ku tz'u-tien (Shang, hsia) (Quan Tang shi dian gu ci dian) (Shang, xia)

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