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Non-Volatile Ferroelectric FETs Using 5-nm Hf0.5Zr0.5O2 With High Data Retention and Read Endurance for 1T Memory Applications

IEEE electron device letters, 2019-03, Vol.40 (3), p.399-402

2019

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The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

IEEE transactions on electron devices, 2022-03, Vol.69 (3), p.1600-1603

2022

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The demonstration of low-temperature (350 °C) grown carbon nano-tubes for the applications of through silicon via in 3D stacking and power-via

Applied physics letters, 2022-12, Vol.121 (23)

2022

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The Investigation of Electrical Characteristics for Carbon Nano-Tubes as Through Silicon Via in Multi-Layer Stacking Scheme With an Optimized Structure

IEEE transactions on electron devices, 2022-09, Vol.69 (9), p.5386-5390

2022

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Ferroelectric HfZrO2 With Electrode Engineering and Stimulation Schemes as Symmetric Analog Synaptic Weight Element for Deep Neural Network Training

IEEE transactions on electron devices, 2020-10, Vol.67 (10), p.4201-4207

2020

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The Analysis of Multiwall Carbon Nanotubes as Through Silicon Via by Equivalent Circuit Model at Different Operating Temperatures in Multilayers Stacking Scheme

IEEE transactions on electron devices, 2023-06, Vol.70 (6), p.3360-3364

2023

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Systematic Investigation of Self-Heating Effect on CMOS Logic Transistors From 20 to 5 nm Technology Nodes by Experimental Thermoelectric Measurements and Finite Element Modeling

IEEE transactions on electron devices, 2017-02, Vol.64 (2), p.646-648

2017

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Reduction of Metal/Carbon Nano-Tubes Interface Contact Resistance by Floating Catalyst Growing Method and Semimetals

IEEE transactions on electron devices, 2023-08, Vol.70 (8), p.4463-4466

2023

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The Development of a Dynamic Model to Investigate the Dielectric Layer Thickness Effect for the Device Performance in Triboelectric Nanogenerators

IEEE transactions on electron devices, 2019-10, Vol.66 (10), p.4478-4480

2019

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The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance

IEEE transactions on electron devices, 2020-05, Vol.67 (5), p.2205-2207

2020

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The Demonstration of 3-D Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 Thermoelectric Devices by Ionized Sputter System

IEEE transactions on electron devices, 2020-01, Vol.67 (1), p.406-408

2020

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The demonstration of promising Ge n-type multi-gate-field-effect transistors with the magnetic FePt metal gate scheme

Applied physics letters, 2015-08, Vol.107 (9)

2015

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The reduction of keep-out zone (∼10×) by the optimized novel trench structures near the through silicon vias for the application in 3-dimensional integrated circuits

Journal of applied physics, 2013-10, Vol.114 (15)

Liao, M. H.

2013

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Direct Binding and Characterization of Lipase onto Magnetic Nanoparticles

Biotechnology progress, 2003-05, Vol.19 (3), p.1095-1100

2003

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Negative Schottky barrier height and surface inhomogeneity in n-silicon M–I–S structures

AIP advances, 2022-07, Vol.12 (7), p.075117-075117-8

2022

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ARHGEF10 knockout inhibits platelet aggregation and protects mice from thrombus formation

Journal of thrombosis and haemostasis, 2017-10, Vol.15 (10), p.2053-2064

2017

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The demonstration of the Si nano-tube device with the promising short channel control

Journal of applied physics, 2015-10, Vol.118 (13)

2015

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The special trench design near the through silicon vias (TSVs) to reduce the keep-out zone for application in three-dimensional integral circuits

Journal of physics. D, Applied physics, 2013-12, Vol.46 (49), p.495103-5

Liao, M-H

2013

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The dependency of different stress-level SiN capping films and the optimization of D-SMT process for the device performance booster in Ge n-FinFETs

Applied physics letters, 2015-08, Vol.107 (7)

2015

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Ferroelectric HfZrO2 FETs for steep switch onset

Microelectronic engineering, 2019-07, Vol.215, p.110991, Article 110991

2019

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The demonstration of colossal magneto-capacitance effect with the promising gate stack characteristics on Ge (100) by the magnetic gate stack design

Applied physics letters, 2014-06, Vol.104 (26)

2014

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Studies of boron diffusivities on (001) and (110) substrate orientation in Si and Ge along vertical/out-of plane and lateral/in-plane directions study

Thin solid films, 2013-10, Vol.544, p.313-317

Liao, M.-H.

2013

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Thickness dependence of electrical conductivity and thermo-electric power of Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 thermo-electric devices

AIP advances, 2018-01, Vol.8 (1), p.015020-015020-4

2018

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The comprehensive study and the reduction of contact resistivity on the n-InGaAs M-I-S contact system with different inserted insulators

AIP advances, 2015-05, Vol.5 (5), p.057117-057117-4

2015

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The Epidemiology and Characteristics of Q fever and Co‐infections with Scrub Typhus, Murine Typhus or Leptospirosis in Taiwan: A Nationwide Database Study

Zoonoses and public health, 2017-11, Vol.64 (7), p.517-526

2017

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Non-Volatile Ferroelectric FETs Using 5-nm Hf0.5Zr0.5O2 With High Data Retention and Read Endurance for 1T Memory Applications

The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

The demonstration of low-temperature (350 °C) grown carbon nano-tubes for the applications of through silicon via in 3D stacking and power-via

The Investigation of Electrical Characteristics for Carbon Nano-Tubes as Through Silicon Via in Multi-Layer Stacking Scheme With an Optimized Structure

Ferroelectric HfZrO2 With Electrode Engineering and Stimulation Schemes as Symmetric Analog Synaptic Weight Element for Deep Neural Network Training

The Analysis of Multiwall Carbon Nanotubes as Through Silicon Via by Equivalent Circuit Model at Different Operating Temperatures in Multilayers Stacking Scheme

Systematic Investigation of Self-Heating Effect on CMOS Logic Transistors From 20 to 5 nm Technology Nodes by Experimental Thermoelectric Measurements and Finite Element Modeling

Reduction of Metal/Carbon Nano-Tubes Interface Contact Resistance by Floating Catalyst Growing Method and Semimetals

The Development of a Dynamic Model to Investigate the Dielectric Layer Thickness Effect for the Device Performance in Triboelectric Nanogenerators

The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance

The Demonstration of 3-D Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 Thermoelectric Devices by Ionized Sputter System

The demonstration of promising Ge n-type multi-gate-field-effect transistors with the magnetic FePt metal gate scheme

The reduction of keep-out zone (∼10×) by the optimized novel trench structures near the through silicon vias for the application in 3-dimensional integrated circuits

Direct Binding and Characterization of Lipase onto Magnetic Nanoparticles

Negative Schottky barrier height and surface inhomogeneity in n-silicon M–I–S structures

ARHGEF10 knockout inhibits platelet aggregation and protects mice from thrombus formation

The demonstration of the Si nano-tube device with the promising short channel control

The special trench design near the through silicon vias (TSVs) to reduce the keep-out zone for application in three-dimensional integral circuits

The dependency of different stress-level SiN capping films and the optimization of D-SMT process for the device performance booster in Ge n-FinFETs

Ferroelectric HfZrO2 FETs for steep switch onset

The demonstration of colossal magneto-capacitance effect with the promising gate stack characteristics on Ge (100) by the magnetic gate stack design

Studies of boron diffusivities on (001) and (110) substrate orientation in Si and Ge along vertical/out-of plane and lateral/in-plane directions study

Thickness dependence of electrical conductivity and thermo-electric power of Bi2.0Te2.7Se0.3/Bi0.4Te3.0Sb1.6 thermo-electric devices

The comprehensive study and the reduction of contact resistivity on the n-InGaAs M-I-S contact system with different inserted insulators

The Epidemiology and Characteristics of Q fever and Co‐infections with Scrub Typhus, Murine Typhus or Leptospirosis in Taiwan: A Nationwide Database Study

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