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Bendability of single-crystal Si MOSFETs investigated on flexible substrate

IEEE electron device letters, 2006-07, Vol.27 (7), p.538-541

2006

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Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer

IEEE transactions on electron devices, 2008-09, Vol.55 (9), p.2484-2491

2008

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Novel Integration of Metal-Insulator-Metal (MIM) Capacitors Comprising Perovskite-type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates

IEEE electron device letters, 2008-01, Vol.29 (1), p.31-33

2008

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High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates

IEEE electron device letters, 2005-12, Vol.26 (12), p.885-887

2005

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Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling

IEEE transactions on components and packaging technologies, 2006-09, Vol.29 (3), p.560-569

2006

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Development of 3-D Silicon Module With TSV for System in Packaging

IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.3-9

2010

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Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

Thin solid films, 2006-05, Vol.504 (1-2), p.252-256

2006

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High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology

Electronics letters, 2008-01, Vol.44 (3), p.241-243

2008

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Etching control of benzocyclobutene in CF 4 / O 2 and SF 6 / O 2 plasmas with thick photoresist and titanium masks

Thin solid films, 2006, Vol.504 (1), p.252-256

2006

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RF, DC, and Reliability Performance of MIM Capacitors Embedded in Organic Substrates by Wafer-Transfer Technology (WTT) for System-on-Package Applications

IEEE transactions on electron devices, 2007-03, Vol.54 (3), p.425-432

2007

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Planar Microspring-A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.379-389

2009

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Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

IEEE transactions on advanced packaging, 2006-05, Vol.29 (2), p.343-353

2006

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Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

2009 59th Electronic Components and Technology Conference, 2009, p.305-312

2009

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High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

2010 International Electron Devices Meeting, 2010, p.2.1.1-2.1.4

2010

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A low insertion loss 60 GHz band pass filter using wafer transfer

2008 Asia-Pacific Microwave Conference, 2008, p.1-4

2008

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High performance embedded RF passive device process integration

2008 58th Electronic Components and Technology Conference, 2008, p.1709-1713

2008

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Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2006, p.486-491

2006

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Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique

2008 58th Electronic Components and Technology Conference, 2008, p.1953-1957

2008

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Self-Assembly of Components using Shape-matching

2007 9th Electronics Packaging Technology Conference, 2007, p.826-829

2007

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Shape matching-assisted self-assembly of microchips on a silicon substrate

2006 8th Electronics Packaging Technology Conference, 2006, p.6-9

2006

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Moisture effect on adhesive bonding strength characterized by crack opening method

2006 8th Electronics Packaging Technology Conference, 2006, p.889-893

2006

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Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

2005 7th Electronic Packaging Technology Conference, 2005, Vol.1, p.6 pp.

2005

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Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System

2006 International Electron Devices Meeting, 2006, p.1-4

2006

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A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

56th Electronic Components and Technology Conference 2006, 2006, p.5 pp.

2006

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A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007, p.419-422

2007

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Bendability of single-crystal Si MOSFETs investigated on flexible substrate

Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer

Novel Integration of Metal-Insulator-Metal (MIM) Capacitors Comprising Perovskite-type Dielectric and Cu Bottom Electrode on Low-Temperature Packaging Substrates

High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates

Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling

Development of 3-D Silicon Module With TSV for System in Packaging

Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks

High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology

Etching control of benzocyclobutene in CF 4 / O 2 and SF 6 / O 2 plasmas with thick photoresist and titanium masks

RF, DC, and Reliability Performance of MIM Capacitors Embedded in Organic Substrates by Wafer-Transfer Technology (WTT) for System-on-Package Applications

Planar Microspring-A Novel Compliant Chip-to-Package Interconnect for Wafer-Level Packaging

Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

A low insertion loss 60 GHz band pass filter using wafer transfer

High performance embedded RF passive device process integration

Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer

Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique

Self-Assembly of Components using Shape-matching

Shape matching-assisted self-assembly of microchips on a silicon substrate

Moisture effect on adhesive bonding strength characterized by crack opening method

Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate

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