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Genetic and Molecular Evidence of a Tetrapolar Mating System in the Edible Mushroom Grifola frondosa

Journal of fungi (Basel), 2023-09, Vol.9 (10), p.959

2023

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Four New Species of Russula Subsection Sardoninae from China

Journal of fungi (Basel), 2023-02, Vol.9 (2), p.199

2023

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Three new Russula species in sect. Ingratae (Russulales, Basidiomycota) from southern China

MycoKeys (Sofia, Bulgaria), 2021-11, Vol.84, p.103-139

2021

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Effects of foliar spraying with low concentration NaCl on the growth and physiological responses of cucumber seedlings under temperature regulation in solar greenhouse

Ying yong sheng tai xue bao, 2021-01, Vol.32 (1), p.222-230

2021

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Genetic and Molecular Evidence of a Tetrapolar Mating System in the Edible Mushroom IGrifola frondosa/I

Journal of fungi (Basel), 2023-09, Vol.9 (10)

2023

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Four New Species of IRussula/I Subsection ISardoninae/I from China

Journal of fungi (Basel), 2023-02, Vol.9 (2)

2023

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Effect of thickness scaling on the permeability and thermal stability of Ta(N) diffusion barrier

Applied surface science, 2019-12, Vol.498, p.143887, Article 143887

2019

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Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO2 hybrid bonding

Japanese Journal of Applied Physics, 2019-07, Vol.58, p.SHHC01

2019

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Development of air-gap etching process by a mask approach for characterization of intralayer and interlayer capacitances

Japanese Journal of Applied Physics, 2018-07, Vol.57 (7S2), p.7

2018

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Extraction of geometry-related interconnect variation based on parasitic capacitance data

IEEE electron device letters, 2014-10, Vol.35 (10), p.980-982

2014

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Rabbiteye blueberry prevents osteoporosis in ovariectomized rats

Journal of orthopaedic surgery and research, 2014-08, Vol.9 (1), p.56-56, Article 56

2014

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The impact of N-terminal phosphorylation on LHCII conformation in state transition

Acta mechanica Sinica, 2014-06, Vol.30 (3), p.447-456

2014

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Statistical Variability Analysis in Vertically Stacked Gate All Around FETs at 7 nm Technology

2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2018, p.1-3

2018

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Impact of channel and spacer engineering on DC and RF performance of Gate-all-around FET

2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2018, p.1-3

2018

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Voidless metal filling and elimination of metal diffusion in PVD barrier and seed process for high performance Cu interconnect

2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2018, p.1-3

2018

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Self-Heating Effects Investigation on Nanoscale FinFET and Its Thermal Resistance Modeling

2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2018, p.1-3

2018

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Cu CMP process development and characterization of Cu dishing with 1.8 μ m Cu pad and 3.6 μ m pitch in Cu/SiO 2 hybrid bonding

Japanese Journal of Applied Physics, 2019-07, Vol.58 (SH), p.SHHC01

2019

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Cu CMP process development and characterization of Cu dishing with 1.8 m Cu pad and 3.6 m pitch in Cu/SiO2 hybrid bonding

Japanese Journal of Applied Physics, 2019-06, Vol.58 (SH)

2019

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CU seed, CMP process development and via resistance extraction in through silicon via technology

2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2014, p.1-3

2014

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TCAD Study of the Raised SiGe Source/Drain in 40nm PMOS

Key engineering materials, 2015-05, Vol.645-646, p.70-74

2015

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Characterization of HDP FSG process

2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings, 2006, p.348-350

2006

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STUDIES ON THE ANGULAR DISTRIBUTION OF ISOTOPIC PREFERENTIAL SPUTTERING

Wuli xuebao, 1989, Vol.38 (11), p.1785

1989

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PREFERENTIAL SPUTTERING FROM Ni-Pd ALLOY AT ELEVATED TEMPERATURES

Wuli xuebao, 1990-03, Vol.39 (3), p.501

1990

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Distinct Kinetics Features of LFA-1 and Mac-1 in Neutrophil Activation

中国生物医学工程学报（英文版）, 2015, Vol.24 (1), p.40-46

LI Ning MAO De-bin GONG Yi-xin LV Shou-qin ZHANG Yan LONG Mian

2015

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Distinct Kinetics Features of LFA-1 and Mac-1 in Neutrophil Activation

中国生物医学工程学报（英文版）, 2013, Vol.22 (3), p.105-110

LI Ning MAO De-bin GONG Yi-xin LV Shou-qin ZHANG Yan LONG Mian

2013

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Genetic and Molecular Evidence of a Tetrapolar Mating System in the Edible Mushroom Grifola frondosa

Four New Species of Russula Subsection Sardoninae from China

Three new Russula species in sect. Ingratae (Russulales, Basidiomycota) from southern China

Effects of foliar spraying with low concentration NaCl on the growth and physiological responses of cucumber seedlings under temperature regulation in solar greenhouse

Genetic and Molecular Evidence of a Tetrapolar Mating System in the Edible Mushroom IGrifola frondosa/I

Four New Species of IRussula/I Subsection ISardoninae/I from China

Effect of thickness scaling on the permeability and thermal stability of Ta(N) diffusion barrier

Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6 μm pitch in Cu/SiO2 hybrid bonding

Development of air-gap etching process by a mask approach for characterization of intralayer and interlayer capacitances

Extraction of geometry-related interconnect variation based on parasitic capacitance data

Rabbiteye blueberry prevents osteoporosis in ovariectomized rats

The impact of N-terminal phosphorylation on LHCII conformation in state transition

Statistical Variability Analysis in Vertically Stacked Gate All Around FETs at 7 nm Technology

Impact of channel and spacer engineering on DC and RF performance of Gate-all-around FET

Voidless metal filling and elimination of metal diffusion in PVD barrier and seed process for high performance Cu interconnect

Self-Heating Effects Investigation on Nanoscale FinFET and Its Thermal Resistance Modeling

Cu CMP process development and characterization of Cu dishing with 1.8 μ m Cu pad and 3.6 μ m pitch in Cu/SiO 2 hybrid bonding

Cu CMP process development and characterization of Cu dishing with 1.8 m Cu pad and 3.6 m pitch in Cu/SiO2 hybrid bonding

CU seed, CMP process development and via resistance extraction in through silicon via technology

TCAD Study of the Raised SiGe Source/Drain in 40nm PMOS

Characterization of HDP FSG process

STUDIES ON THE ANGULAR DISTRIBUTION OF ISOTOPIC PREFERENTIAL SPUTTERING

PREFERENTIAL SPUTTERING FROM Ni-Pd ALLOY AT ELEVATED TEMPERATURES

Distinct Kinetics Features of LFA-1 and Mac-1 in Neutrophil Activation

Distinct Kinetics Features of LFA-1 and Mac-1 in Neutrophil Activation

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