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Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy

Journal of alloys and compounds, 2018-04, Vol.742, p.835-843

2018

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Dynamic rumor spreading of public opinion reversal on Weibo based on a two-stage SPNR model

Physica A, 2020-11, Vol.558, p.125005, Article 125005

2020

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Investigation on improving soldering reliability of large-scale LCCC devices with high-lead solder ball materials

Journal of physics. Conference series, 2024-08, Vol.2827 (1), p.012021

2024

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Investigation on Rheological Characterization of Isotropic Conductive Adhesives

Journal of physics. Conference series, 2023-08, Vol.2578 (1), p.12021

2023

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Study on the Influence of Vacuum Vapor Phase Soldering Process Technology on SiP Component

Journal of physics. Conference series, 2023-03, Vol.2459 (1), p.12079

2023

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Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods

Journal of electronic materials, 2019-05, Vol.48 (5), p.2801-2810

2019

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Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints

Journal of materials science. Materials in electronics, 2017-11, Vol.28 (21), p.16120-16132

2017

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Effect of solvent on rheological properties of Sn–0.3Ag–0.7Cu solder paste for jet printing

Materials research express, 2019-05, Vol.6 (8), p.86323

2019

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Rheological characterization and jet printing performance of Sn–58Bi solder pastes

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (6), p.4575-4582

2018

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Effect of thixotropic agents on the rheology of SnAgCu lead-free solder pastes used for jet printing

Materials research express, 2019-02, Vol.6 (5), p.56303

2019

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Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs)

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.271-274

2017

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Investigation of jet printing performance of lead-free solder paste

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.709-712

2016

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A Generative Adversarial Constraint Encoder-Decoder Model for the Text Summarization

2022 International Symposium on Electrical, Electronics and Information Engineering (ISEEIE), 2022, p.63-68

2022

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The effect of conductive filler on the properties of electrically Conductive Adhesives(ECAs)

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.803-808

2017

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Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.275-279

2017

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The effect of curing agent on the properties of silver paste Electrically Conductive Adhesives(ECAs)

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.644-648

2017

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Effect of rheological characterization on the jet printing performance of lead-free solder paste

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-5

2017

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The influence of thermal aging on reliability of Sn-58Bi interconnects

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.744-749

2017

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Investigation on rheological behavior and jet printing process of the solder pastes

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, p.1-5

2022

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Effect of active agents on the rheological properties of SnAgCu solder pastes used for jetting printing

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.69-73

2018

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Microstructure and mechanical properties of resistor chip joints fabricated by laser soldering using Sn-58Bi solder on Ni(P)/Cu pads

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.240-243

2017

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How the smart product attributes influence consumer adoption intention

Frontiers in psychology, 2023-02, Vol.14, p.1090200-1090200

2023

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Fluorescent recognition and selective detection of nitrite ions with carbon quantum dots

Analytical and bioanalytical chemistry, 2020-02, Vol.412 (4), p.993-1002

2020

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Sparse attention double-channel FCN network for numerical analysis tracheid features in larch

Frontiers in plant science, 2022-12, Vol.13, p.1079556-1079556

2022

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Determination of ligand selectivity to G-tetrad through an AMCA fluorescence quenching approach

Talanta (Oxford), 2024-12, Vol.280, p.126732, Article 126732

2024

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Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy

Dynamic rumor spreading of public opinion reversal on Weibo based on a two-stage SPNR model

Investigation on improving soldering reliability of large-scale LCCC devices with high-lead solder ball materials

Investigation on Rheological Characterization of Isotropic Conductive Adhesives

Study on the Influence of Vacuum Vapor Phase Soldering Process Technology on SiP Component

Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods

Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints

Effect of solvent on rheological properties of Sn–0.3Ag–0.7Cu solder paste for jet printing

Rheological characterization and jet printing performance of Sn–58Bi solder pastes

Effect of thixotropic agents on the rheology of SnAgCu lead-free solder pastes used for jet printing

Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs)

Investigation of jet printing performance of lead-free solder paste

A Generative Adversarial Constraint Encoder-Decoder Model for the Text Summarization

The effect of conductive filler on the properties of electrically Conductive Adhesives(ECAs)

Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)

The effect of curing agent on the properties of silver paste Electrically Conductive Adhesives(ECAs)

Effect of rheological characterization on the jet printing performance of lead-free solder paste

The influence of thermal aging on reliability of Sn-58Bi interconnects

Investigation on rheological behavior and jet printing process of the solder pastes

Effect of active agents on the rheological properties of SnAgCu solder pastes used for jetting printing

Microstructure and mechanical properties of resistor chip joints fabricated by laser soldering using Sn-58Bi solder on Ni(P)/Cu pads

How the smart product attributes influence consumer adoption intention

Fluorescent recognition and selective detection of nitrite ions with carbon quantum dots

Sparse attention double-channel FCN network for numerical analysis tracheid features in larch

Determination of ligand selectivity to G-tetrad through an AMCA fluorescence quenching approach

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