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SARS-CoV-2 in migrant worker dormitories: Geospatial epidemiology supporting outbreak management

International journal of infectious diseases, 2021-02, Vol.103, p.389-394

2021

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Characterization and cross-comparison of digital stethoscopes for telehealth remote patient auscultation

Medicine in novel technology and devices, 2023-09, Vol.19, p.100256, Article 100256

2023

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3-D TSV Six-Die Stacking and Reliability Assessment of 20- \mu m-Pitch Bumps on Large-Scale Dies

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.33-38

2017

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Appropriateness of orthodontic referrals: self-perceived and normative treatment needs of patients referred for orthodontic consultation

Community dentistry and oral epidemiology, 2002-12, Vol.30 (6), p.449-454

2002

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Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

Journal of electronic materials, 2014-09, Vol.43 (9), p.3317-3323

2014

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Promoted Iron-Based Catalysts for the Fischer–Tropsch Synthesis: Design, Synthesis, Site Densities, and Catalytic Properties

Journal of catalysis, 2002-03, Vol.206 (2), p.202-217

2002

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Pathways for CO2 formation and conversion during Fischer-Tropsch synthesis on iron-based catalysts

Catalysis letters, 2002-01, Vol.80 (1-2), p.77-86

2002

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Stress and Thyroid Autoimmunity

Thyroid (New York, N.Y.), 2004-12, Vol.14 (12), p.147-1055

2004

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Basic Fibroblast Growth Factor (FGF-2) Overexpression Is a Risk Factor for Esophageal Cancer Recurrence and Reduced Survival, which Is Ameliorated by Coexpression of the FGF-2 Antisense Gene

Clinical cancer research, 2005-11, Vol.11 (21), p.7683-7691

2005

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Effect of self-healing on fatigue of engineered cementitious composites (ECCs)

Cement & concrete composites, 2018-11, Vol.94, p.145-152

2018

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Characterisation and permeation of palladium/stainless steel composite membranes

Journal of membrane science, 1998-10, Vol.149 (2), p.259-268

1998

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Fabrication of dense palladium composite membranes for hydrogen separation

Catalysis today, 2000-02, Vol.56 (1), p.45-51

2000

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Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.438-443

2014

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Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.574-578

2014

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Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.225-228

2014

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Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.493-497

2013

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Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.936-942

2016

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Fabrication of defect-free Pd/α-Al2O3 composite membranes for hydrogen separation

Thin solid films, 1999-08, Vol.350 (1-2), p.106-112

1999

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The endogenous fibroblast growth factor-2 antisense gene product regulates pituitary cell growth and hormone production

Molecular endocrinology (Baltimore, Md.), 2001-04, Vol.15 (4), p.589-599

2001

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Characterization of pressure-less Ag sintering on Ni/Au surface

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4

2015

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Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.543-548

2013

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Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.224-229

2013

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Expression of alternatively spliced FGF-2 antisense RNA transcripts in the central nervous system: regulation of FGF-2 mRNA translation

Molecular and cellular endocrinology, 2000-12, Vol.170 (1-2), p.233-242

2000

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Implication of alpha4 phosphoprotein and the rapamycin-sensitive mammalian target-of-rapamycin pathway in prolactin receptor signalling

Journal of endocrinology, 2002-06, Vol.173 (3), p.493-506

2002

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Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.250-254

2013

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SARS-CoV-2 in migrant worker dormitories: Geospatial epidemiology supporting outbreak management

Characterization and cross-comparison of digital stethoscopes for telehealth remote patient auscultation

3-D TSV Six-Die Stacking and Reliability Assessment of 20- \mu m-Pitch Bumps on Large-Scale Dies

Appropriateness of orthodontic referrals: self-perceived and normative treatment needs of patients referred for orthodontic consultation

Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

Promoted Iron-Based Catalysts for the Fischer–Tropsch Synthesis: Design, Synthesis, Site Densities, and Catalytic Properties

Pathways for CO2 formation and conversion during Fischer-Tropsch synthesis on iron-based catalysts

Stress and Thyroid Autoimmunity

Basic Fibroblast Growth Factor (FGF-2) Overexpression Is a Risk Factor for Esophageal Cancer Recurrence and Reduced Survival, which Is Ameliorated by Coexpression of the FGF-2 Antisense Gene

Effect of self-healing on fatigue of engineered cementitious composites (ECCs)

Characterisation and permeation of palladium/stainless steel composite membranes

Fabrication of dense palladium composite membranes for hydrogen separation

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

Process development and optimization for high temperature endurable flip chip interconnection in SiC high power module

Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Fabrication of defect-free Pd/α-Al2O3 composite membranes for hydrogen separation

The endogenous fibroblast growth factor-2 antisense gene product regulates pituitary cell growth and hormone production

Characterization of pressure-less Ag sintering on Ni/Au surface

Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications

Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting

Expression of alternatively spliced FGF-2 antisense RNA transcripts in the central nervous system: regulation of FGF-2 mRNA translation

Implication of alpha4 phosphoprotein and the rapamycin-sensitive mammalian target-of-rapamycin pathway in prolactin receptor signalling

Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process

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