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Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer

ACS applied materials & interfaces, 2016-07, Vol.8 (26), p.16922-16931

2016

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Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

Advanced functional materials, 2018-06, Vol.28 (26), p.n/a

2018

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Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

Scientific reports, 2023-09, Vol.13 (1), p.14354-14354, Article 14354

2023

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Hydrogel-laden paper scaffold system for origami-based tissue engineering

Proceedings of the National Academy of Sciences - PNAS, 2015-12, Vol.112 (50), p.15426-15431

2015

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Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices

ACS applied materials & interfaces, 2019-04, Vol.11 (14), p.13416-13422

2019

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Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

Advanced functional materials, 2018-11, Vol.28 (45), p.n/a

2018

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Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials, 2021-01, Vol.14 (2), p.335

2021

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Wearable, Ultrawide-Range, and Bending-Insensitive Pressure Sensor Based on Carbon Nanotube Network-Coated Porous Elastomer Sponges for Human Interface and Healthcare Devices

ACS applied materials & interfaces, 2019-07, Vol.11 (26), p.23639-23648

2019

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Improved sinterability of micro-scale copper paste with a reducing agent

Materials letters, 2020-06, Vol.269, p.127656, Article 127656

2020

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Ultrathin, Flexible, and Transparent Oxide Thin‐Film Transistors by Delamination and Transfer Methods for Deformable Displays

Advanced materials technologies, 2021-11, Vol.6 (11), p.n/a

2021

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The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1583-1591

2017

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Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit

Nano energy, 2019-04, Vol.58, p.211-219

2019

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Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Polymers, 2015-06, Vol.7 (6), p.985-1004

2015

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An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures

Composite structures, 2018-04, Vol.189, p.27-36

2018

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Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-02, Vol.6 (2), p.208-215

2016

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Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature

Microelectronics and reliability, 2022-03, Vol.130, p.114485, Article 114485

2022

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Wireless powered wearable micro light-emitting diodes

Nano energy, 2019-01, Vol.55, p.454-462

2019

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Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-09, Vol.6 (9), p.1317-1329

2016

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Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module

Microelectronics and reliability, 2022-11, Vol.138, p.114652, Article 114652

2022

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Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography

Nanomaterials (Basel, Switzerland), 2020-12, Vol.10 (12), p.2414

2020

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Contact-free thermal expansion measurement of very soft elastomers using digital image correlation

Polymer testing, 2016-05, Vol.51, p.181-189

2016

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Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics

ACS applied materials & interfaces, 2016-07, Vol.8 (29), p.19031-19037

2016

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Thermal expansion behavior of thin films expanding freely on water surface

Scientific reports, 2019-05, Vol.9 (1), p.7071, Article 7071

2019

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Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications

ACS applied materials & interfaces, 2022-06, Vol.14 (24), p.28258-28269

2022

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Anomalous Stretchable Conductivity Using an Engineered Tricot Weave

ACS nano, 2015-12, Vol.9 (12), p.12214-12223

2015

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Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer

Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

Hydrogel-laden paper scaffold system for origami-based tissue engineering

Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices

Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Wearable, Ultrawide-Range, and Bending-Insensitive Pressure Sensor Based on Carbon Nanotube Network-Coated Porous Elastomer Sponges for Human Interface and Healthcare Devices

Improved sinterability of micro-scale copper paste with a reducing agent

Ultrathin, Flexible, and Transparent Oxide Thin‐Film Transistors by Delamination and Transfer Methods for Deformable Displays

The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit

Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature

Wireless powered wearable micro light-emitting diodes

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module

Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography

Contact-free thermal expansion measurement of very soft elastomers using digital image correlation

Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics

Thermal expansion behavior of thin films expanding freely on water surface

Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications

Anomalous Stretchable Conductivity Using an Engineered Tricot Weave

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