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IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.673-681
2001
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Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications
2007
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IEEE transactions on components, packaging, and manufacturing technology. Part A, 1994-12, Vol.17 (4), p.564-572
1994
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IEEE transactions on components, hybrids, and manufacturing technology, 1992-10, Vol.15 (5), p.778-785
1992
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[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 1992, p.49-58
1992
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1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium, 1991, p.123-130
1991
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[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1992, p.30-36
1992
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IEEE transactions on components, hybrids, and manufacturing technology, 1992-10, Vol.15 (5), p.806-814
1992
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IEEE transactions on components, hybrids, and manufacturing technology, 1992-10, Vol.15 (5), p.786-793
1992
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