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Journal of cell science, 2020-01, Vol.133 (1)
2020
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Additive manufacturing, 2019-05, Vol.27, p.372-378
2019
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Journal of manufacturing processes, 2021-08, Vol.68, p.1735-1745
2021
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International journal of advanced manufacturing technology, 2019-11, Vol.105 (1-4), p.637-649
2019
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International journal of molecular sciences, 2019-12, Vol.20 (24), p.6168
2019
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Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2022-11, Vol.857, p.144051, Article 144051
2022
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Journal of the Taiwan Institute of Chemical Engineers, 2023-09, Vol.150, p.105082, Article 105082
2023
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Cells (Basel, Switzerland), 2019-12, Vol.8 (12), p.1568
2019
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RSC advances, 2013-01, Vol.3 (43), p.20143
2013
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Journal of business ethics, 2014-06, Vol.122 (2), p.283-306
- Ralston, David A.
- Egri, Carolyn P.
- Furrer, Olivier
- Kuo, Min-Hsun
- Li, Yongjuan
- Wangenheim, Florian
- Dabic, Marina
- Naoumova, Irina
- Shimizu, Katsuhiko
- de la Garza Carranza, María Teresa
- Fu, Ping Ping
- Potocan, Vojko V.
- Pekerti, Andre
- Lenartowicz, Tomasz
- Srinivasan, Narasimhan
- Casado, Tania
- Rossi, Ana Maria
- Szabo, Erna
- Butt, Arif
- Palmer, Ian
- Ramburuth, Prem
- Brock, David M.
- Terpstra-Tong, Jane
- Grison, Ilya
- Reynaud, Emmanuelle
- Richards, Malika
- Hallinger, Philip
- Castro, Francisco B.
- Ruiz-Gutiérrez, Jaime
- Milton, Laurie
- Ansari, Mahfooz
- Starkus, Arunas
- Mockaitis, Audra
- Dalgic, Tevfik
- León-Darder, Fidel
- Thanh, Hung Vu
- Moon, Yong-lin
- Molteni, Mario
- Fang, Yongqing
- Pla-Barber, Jose
- Alas, Ruth
- Maignan, Isabelle
- Jesuino, Jorge C.
- Lee, Chay-Hoon
- Nicholson, Joel D.
- Chia, Ho-Beng
- Danis, Wade
- Dharmasiri, Ajantha S.
- Weber, Mark
2014
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Surfaces and interfaces, 2023-08, Vol.40, p.103076, Article 103076
2023
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Asia Pacific journal of management, 2007-09, Vol.24 (3), p.305-320
2007
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The FASEB journal, 2020-04, Vol.34 (S1), p.1-1
2020
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Materials Science Forum, 2006-01, Vol.505-507, p.1075-1080
2006
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Asia Pacific journal of management, 2024-03, Vol.41 (1), p.1-44
- Ralston, David A.
- Russell, Craig J.
- Terpstra-Tong, Jane
- Trevino, Len J.
- Ramburuth, Prem
- Richards, Malika
- Casado, Tania
- de la Garza Carranza, María Teresa
- Naoumova, Irina
- Li, Yongjuan
- Srinivasan, Narasimhan
- Lenartowicz, Tomasz
- Furrer, Olivier
- Fu, Ping Ping
- Pekerti, Andre
- Dabic, Marina
- Palmer, Ian
- Kangasniemi, Maria
- Szabo, Erna
- Ruiz Gutiérrez, Jaime
- Reynaud, Emmanuelle
- Darder, Fidel León
- Maria Rossi, Ana
- von Wangenheim, Florian
- Molteni, Mario
- Starkus, Arunas
- Mockaitis, Audra
- Butt, Arif
- Girson, Ilya
- Dharmasiri, Ajantha S.
- Kuo, Min-Hsun
- Dalgic, Tevfik
- Thanh, Hung Vu
- Moon, Yong-lin
- Hallinger, Philip
- Potocan, Vojko V.
- Nicholson, Joel
- Milton, Laurie
- Weber, Mark
- Lee, Chay Hoon
- Ansari, Mahfooz
- Pla-Barber, Jose
- Jesuino, Jorge C.
- Alas, Ruth
- Danis, Wade
- Chia, Ho-Beng
- Fang, Yongqing
- Elenkov, Detelin
- Brock, David M.
2024
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Asia Pacific journal of management, 2024-03, Vol.41 (1), p.45-50
- Ralston, David A.
- Russell, Craig J.
- Terpstra-Tong, Jane
- Trevino, Len J.
- Ramburuth, Prem
- Richards, Malika
- Casado, Tania
- de la Garza Carranza, María Teresa
- Naoumova, Irina
- Li, Yongjuan
- Srinivasan, Narasimhan
- Lenartowicz, Tomasz
- Furrer, Olivier
- Fu, Ping Ping
- Pekerti, Andre
- Dabic, Marina
- Palmer, Ian
- Kangasniemi, Maria
- Szabo, Erna
- Gutiérrez, Jaime Ruiz
- Reynaud, Emmanuelle
- Darder, Fidel León
- Rossi, Ana Maria
- von Wangenheim, Florian
- Molteni, Mario
- Starkus, Arunas
- Mockaitis, Audra
- Butt, Arif
- Girson, Ilya
- Dharmasiri, Ajantha S.
- Kuo, Min-Hsun
- Dalgic, Tevfik
- Thanh, Hung Vu
- Moon, Yong-lin
- Hallinger, Philip
- Potocan, Vojko V.
- Nicholson, Joel
- Milton, Laurie
- Weber, Mark
- Lee, Chay Hoon
- Ansari, Mahfooz
- Pla-Barber, Jose
- Jesuino, Jorge C.
- Alas, Ruth
- Danis, Wade
- Chia, Ho-Beng
- Fang, Yongqing
- Elenkov, Detelin
- Brock, David M.
2024
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RSC advances, 2013-10, Vol.3 (43), p.20143-20149
2013
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Materials science forum, 2005, p.1075-1080
2005
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022, p.1-4
2022
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