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Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Intermetallics, 2017-06, Vol.85, p.117-124

2017

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Silane modification on mesoporous silica coated carbon nanotubes for improving compatibility and dispersity in epoxy matrices

Composites. Part A, Applied science and manufacturing, 2015-11, Vol.78, p.1-9

2015

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Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-Chip Solder Interconnects

Journal of electronic packaging, 2007-03, Vol.129 (1), p.56-62

2007

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Electromigration Reliability and Morphologies of 62Sn-36Pb-2Ni and 62Sn-36Pb-2Cu Flip-Chip Solder Joints

IEEE transactions on components and packaging technologies, 2007-09, Vol.30 (3), p.526-531

2007

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Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Microelectronics and reliability, 2007-08, Vol.47 (8), p.1273-1279

2007

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Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Journal of electronic packaging, 2009-06, Vol.131 (2)

2009

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Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates

Journal of electronic materials, 2012-12, Vol.41 (12), p.3368-3374

2012

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Parasite and Infected-Erythrocyte Image Segmentation in Stained Blood Smears

Journal of medical and biological engineering, 2015-12, Vol.35 (6), p.803-815

2015

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Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.601-606

2018

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Novel ultra-fine line 2.1D package with organic interposer

2017 IEEE CPMT Symposium Japan (ICSJ), 2017, p.167-171

2017

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Person Authentication by Air-Writing Using 3D Sensor and Time Order Stroke Context

Smart Multimedia, p.260-273

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Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device

2016 International Conference on Electronics Packaging (ICEP), 2016, p.526-529

2016

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Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

2008 58th Electronic Components and Technology Conference, 2008, p.330-335

2008

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Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process

2018 IEEE CPMT Symposium Japan (ICSJ), 2018, p.99-104

2018

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Electromigration of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps bonded on substrate pads of Au/Ni/Cu or Cu metallization

56th Electronic Components and Technology Conference 2006, 2006, p.5 pp.

2006

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The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.518-521

2014

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Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites

2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014, p.458-461

2014

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Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Journal of electronic materials, 2012, Vol.41 (12), p.3368-3374

2012

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Interfacial behavior between copper foil and tin upon thermal aging

2008 International Conference on Electronic Materials and Packaging, 2008, p.37-40

2008

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Control of petroleum-hydrocarbon contaminated groundwater by intrinsic and enhanced bioremediation

Journal of environmental sciences (China), 2010-01, Vol.22 (6), p.864-871

2010

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Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1421-1426 Vol. 2

2005

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Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/C under bump metallurgy

Microelectronics and reliability, 2007, Vol.47 (8), p.1273-1279

2007

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Polystyrene microplastic particles: In vitro pulmonary toxicity assessment

Journal of hazardous materials, 2020-03, Vol.385, p.121575, Article 121575

2020

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The Kidney-Related Effects of Polystyrene Microplastics on Human Kidney Proximal Tubular Epithelial Cells HK-2 and Male C57BL/6 Mice

Environmental health perspectives, 2021-05, Vol.129 (5), p.57003

2021

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Analysis of complex time series using refined composite multiscale entropy

Physics letters. A, 2014-04, Vol.378 (20), p.1369-1374

2014

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Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Silane modification on mesoporous silica coated carbon nanotubes for improving compatibility and dispersity in epoxy matrices

Effect of Test Conditions on Electromigration Reliability of Sn-Ag-Cu Flip-Chip Solder Interconnects

Electromigration Reliability and Morphologies of 62Sn-36Pb-2Ni and 62Sn-36Pb-2Cu Flip-Chip Solder Joints

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates

Parasite and Infected-Erythrocyte Image Segmentation in Stained Blood Smears

Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

Novel ultra-fine line 2.1D package with organic interposer

Person Authentication by Air-Writing Using 3D Sensor and Time Order Stroke Context

Novel copper surface preparation processes for copper alloy lead frame lamination pretreatment in embedded packaging device

Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process

Electromigration of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps bonded on substrate pads of Au/Ni/Cu or Cu metallization

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites

Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates : PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS XI

Interfacial behavior between copper foil and tin upon thermal aging

Control of petroleum-hydrocarbon contaminated groundwater by intrinsic and enhanced bioremediation

Integrating electrothermal coupling analysis in the calibration of experimental electromigration reliability of flip-chip packages

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/C under bump metallurgy

Polystyrene microplastic particles: In vitro pulmonary toxicity assessment

The Kidney-Related Effects of Polystyrene Microplastics on Human Kidney Proximal Tubular Epithelial Cells HK-2 and Male C57BL/6 Mice

Analysis of complex time series using refined composite multiscale entropy

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