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Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

Journal of materials science, 2018-02, Vol.53 (4), p.2618-2630

2018

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Method of computing direction-dependent margins for the development of consensus contouring guidelines

Radiation oncology (London, England), 2021-04, Vol.16 (1), p.71-7, Article 71

2021

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Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules

Journal of materials science. Materials in electronics, 2011-09, Vol.22 (9), p.1313-1320

2011

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Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2018-06, Vol.729, p.208-218

2018

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Direct silver to aluminum solid-state bonding processes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2018-04, Vol.722, p.160-166

2018

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The growth and tensile deformation behavior of the silver solid solution phase with zinc

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-06, Vol.668, p.160-165

2016

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Input impedance matching of acoustic transducers operating at off-resonant frequencies

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2010-12, Vol.57 (12), p.2784-2794

2010

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Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-09, Vol.4 (9), p.1420-1426

2014

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New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction

Journal of alloys and compounds, 2019-02, Vol.774, p.1207-1215

2019

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A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (5), p.3985-3991

2018

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Exploring the DBR superlattice effect on the thermal performance of a VECSEL with the finite element method

Optics letters, 2019-01, Vol.44 (2), p.327-330

2019

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Determination of the optical properties of turbid media using relative interstitial radiance measurements: Monte Carlo study, experimental validation, and sensitivity analysis

Journal of Biomedical Optics, 2007-11, Vol.12 (6), p.064027-0640213

2007

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A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

Journal of materials science. Materials in electronics, 2017-10, Vol.28 (20), p.15739-15747

2017

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Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-12, Vol.1 (12), p.1983-1987

2011

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Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (10), p.8059-8071

2020

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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-02, Vol.14 (2), p.328-341

2024

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Survey of patient‐specific quality assurance practice for IMRT and VMAT

Journal of applied clinical medical physics, 2021-07, Vol.22 (7), p.155-164

2021

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A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

Journal of materials science. Materials in electronics, 2016-10, Vol.27 (10), p.10382-10392

2016

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Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures

Journal of electronic materials, 2009-10, Vol.38 (10), p.2106-2111

2009

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Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging

Journal of materials research and technology, 2024-05, Vol.30, p.4600-4611

2024

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Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches

Journal of materials science. Materials in electronics, 2018-06, Vol.29 (12), p.10037-10043

2018

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Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging

Journal of materials research and technology, 2023-05, Vol.24, p.6065-6075

2023

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Multiple-Target Laser Rangefinding Receiver Using a Silicon Photomultiplier Array

IEEE transactions on instrumentation and measurement, 2010-11, Vol.59 (11), p.3005-3011

2010

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The Moderating Influence of Demographic Characteristics, Social Support, and Religious Coping on the Effectiveness of a Multicomponent Psychosocial Caregiver Intervention in Three Racial Ethnic Groups

The journals of gerontology. Series B, Psychological sciences and social sciences, 2010-03, Vol.65B (2), p.185-194

2010

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Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature

IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.10-15

2010

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1 – 25 von 4.775

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Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

Method of computing direction-dependent margins for the development of consensus contouring guidelines

Barrier/bonding layers on bismuth telluride (Bi2Te3) for high temperature thermoelectric modules

Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys

Direct silver to aluminum solid-state bonding processes

The growth and tensile deformation behavior of the silver solid solution phase with zinc

Input impedance matching of acoustic transducers operating at off-resonant frequencies

Thermal Cycling Reliability Study of Ag-In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes

New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

Exploring the DBR superlattice effect on the thermal performance of a VECSEL with the finite element method

Determination of the optical properties of turbid media using relative interstitial radiance measurements: Monte Carlo study, experimental validation, and sensitivity analysis

A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure

A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Survey of patient‐specific quality assurance practice for IMRT and VMAT

A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method

Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures

Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging

Solid-state bonding of silicon chips to copper substrates with graded circular micro-trenches

Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging

Multiple-Target Laser Rangefinding Receiver Using a Silicon Photomultiplier Array

The Moderating Influence of Demographic Characteristics, Social Support, and Religious Coping on the Effectiveness of a Multicomponent Psychosocial Caregiver Intervention in Three Racial Ethnic Groups

Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature

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