UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Metal Containing Resist Readiness for HVM EUV Lithography

Journal of Photopolymer Science and Technology, 2016/06/21, Vol.29(3), pp.501-507

2016

Volltextzugriff (PDF)

Direct metal etch of ruthenium for advanced interconnect

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-05, Vol.36 (3)

2018

Volltextzugriff (PDF)

Modeling the topography of uneven substrates post spin-coating

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2018-05, Vol.36 (3)

2018

Volltextzugriff (PDF)

Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2022-05, Vol.40 (3)

2022

Volltextzugriff (PDF)

Extreme contact shrink for back end of line connectivity

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2022-05, Vol.40 (3)

2022

Volltextzugriff (PDF)

High-Density Patterning of InGaZnO by CH4: a Comparative Study of RIE and Pulsed Plasma ALE

ACS applied materials & interfaces, 2022-07, Vol.14 (29), p.34029-34039

2022

Volltextzugriff (PDF)

High-Density Patterning of InGaZnO by CH 4 : a Comparative Study of RIE and Pulsed Plasma ALE

ACS applied materials & interfaces, 2022-07, Vol.14 (29), p.34029-34039

2022

Volltextzugriff (PDF)

Transient-assisted plasma etching (TAPE): Concept, mechanism, and prospects

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2024-05, Vol.42 (3)

2024

Volltextzugriff (PDF)

Evolution of lithography-to-etch bias in multi-patterning processes

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2022-12, Vol.40 (6)

2022

Volltextzugriff (PDF)

Assessment of STI dry etch process variability by means of dynamic time warping technique

Japanese Journal of Applied Physics, 2023-07, Vol.62 (SI), p.SI1004

2023

Volltextzugriff (PDF)

High-Density Nanopatterning of SiGeAsTe Chalcogenide as Ovonic Threshold Switch Selectors for Memory Applications

ACS applied nano materials, 2023-06, Vol.6 (12), p.10668-10679

2023

Volltextzugriff (PDF)

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

IEEE transactions on electron devices, 2020-12, Vol.67 (12), p.5349-5354

2020

Volltextzugriff (PDF)

Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers

Japanese Journal of Applied Physics, 2021-05, Vol.60 (SB), p.SBBI04

2021

Volltextzugriff (PDF)

Patterning of 25 nm Contact Holes at 90 nm Pitch: Combination of Line/Space Double Exposure Immersion Lithography and Plasma-Assisted Shrink Technology

Japanese Journal of Applied Physics, 2011-08, Vol.50 (8), p.08JE07-08JE07-4

2011

Volltextzugriff (PDF)

Patterning of 25 nm Contact Holes at 90 nm Pitch: Combination of Line/Space Double Exposure Immersion Lithography and Plasma-Assisted Shrink Technology

Japanese Journal of Applied Physics, 2011-08, Vol.50 (8S1), p.8

2011

Volltextzugriff (PDF)

Investigating the Metal-Plasma Interaction during the Patterning of MgZnO Alloys, Used for Compute and Memory Applications

Meeting abstracts (Electrochemical Society), 2023-12, Vol.MA2023-02 (16), p.1164-1164

2023

Volltextzugriff (PDF)

Modification of Ultra Low-k Dielectric Films by O 2 and CO 2 Plasmas

ECS journal of solid state science and technology, 2015, Vol.4 (1), p.N3048-N3057

2015

Volltextzugriff (PDF)

Integration of Wet Cleaning in 45 Nm Pitch BEOL Processing

ECS transactions, 2013, Vol.58 (6), p.135-142

2013

Volltextzugriff (PDF)

Subtractive Etch of Ruthenium for Sub-5nm Interconnect

2018 IEEE International Interconnect Technology Conference (IITC), 2018, p.10-12

2018

Volltextzugriff (PDF)

Setting up a proper power spectral density and autocorrelation analysis for material and process characterization

Journal of micro/nanolithography, MEMS, and MOEMS, 2018-10, Vol.17 (4), p.1

2018

Volltextzugriff (PDF)

Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes

Journal of micro/nanolithography, MEMS, and MOEMS, 2010-10, Vol.9 (4), p.43007

Bekaert, Joost

2010

Volltextzugriff (PDF)

Direct etched Cu characterization for advanced interconnects

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015, p.173-176

2015

Volltextzugriff (PDF)

Integration of Wet Cleaning in 45 Nm Pitch Beol Processing

Meeting abstracts (Electrochemical Society), 2013-10, Vol.MA2013-02 (30), p.2111-2111

2013

Volltextzugriff (PDF)

Experimental verification of source-mask optimization and freeform illumination for 22-nm node static random access memory cells

Journal of micro/nanolithography, MEMS, and MOEMS, 2011-01, Vol.10 (1), p.13008

Bekaert, Joost

2011

Volltextzugriff (PDF)

Mold deformation in nanoimprint lithography

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004-11, Vol.22 (6), p.3318-3322

2004

Volltextzugriff (PDF)

1 – 25 von 25

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(15)
Mit Volltextzugriff
(18)

Publikationsform

Artikel
(22)
Tagungsberichte
(3)

Sprache

Englisch
(25)
Japanisch
(4)

Erscheinungsjahr

n.n

Thema

Science & Technology
(20)
Physical Sciences
(16)
Technology
(15)
Engineering
(12)
Engineering, Electrical & Electronic
(12)
Nanoscience & Nanotechnology
(11)
Physics
(11)
Physics, Applied
(11)
Science & Technology - Other Topics
(11)
Materials Science
(6)
Materials Science, Multidisciplinary
(5)
Lithography
(3)
Metals
(3)
Optics
(3)
Annealing
(2)
Conductivity
(2)
Contamination
(2)
Electromigration
(2)
Engineering Sciences
(2)
General Engineering
(2)

15 weitere anzeigen...

Weniger anzeigen...

Kollektion

American Institute of Physics (AIP) Journals
(7)
Publisher's website
(6)
EZB Free E-Journals
(3)
IEEE Electronic Library (IEL)
(3)
Ingenta
(1)

Menü

Weitere Dienste

Einstellungen

Metal Containing Resist Readiness for HVM EUV Lithography

Direct metal etch of ruthenium for advanced interconnect

Modeling the topography of uneven substrates post spin-coating

Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below

Extreme contact shrink for back end of line connectivity

High-Density Patterning of InGaZnO by CH4: a Comparative Study of RIE and Pulsed Plasma ALE

High-Density Patterning of InGaZnO by CH 4 : a Comparative Study of RIE and Pulsed Plasma ALE

Transient-assisted plasma etching (TAPE): Concept, mechanism, and prospects

Evolution of lithography-to-etch bias in multi-patterning processes

Assessment of STI dry etch process variability by means of dynamic time warping technique

High-Density Nanopatterning of SiGeAsTe Chalcogenide as Ovonic Threshold Switch Selectors for Memory Applications

Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling

Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers

Patterning of 25 nm Contact Holes at 90 nm Pitch: Combination of Line/Space Double Exposure Immersion Lithography and Plasma-Assisted Shrink Technology

Patterning of 25 nm Contact Holes at 90 nm Pitch: Combination of Line/Space Double Exposure Immersion Lithography and Plasma-Assisted Shrink Technology

Investigating the Metal-Plasma Interaction during the Patterning of MgZnO Alloys, Used for Compute and Memory Applications

Modification of Ultra Low-k Dielectric Films by O 2 and CO 2 Plasmas

Integration of Wet Cleaning in 45 Nm Pitch BEOL Processing

Subtractive Etch of Ruthenium for Sub-5nm Interconnect

Setting up a proper power spectral density and autocorrelation analysis for material and process characterization

Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes

Direct etched Cu characterization for advanced interconnects

Integration of Wet Cleaning in 45 Nm Pitch Beol Processing

Experimental verification of source-mask optimization and freeform illumination for 22-nm node static random access memory cells

Mold deformation in nanoimprint lithography

Suchergebnisse filtern