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Journal of Virology, 2012-04, Vol.86 (7), p.3995-4008
2012
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-01, Vol.13 (1), p.1-1
2023
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Microelectronics international, 2011-05, Vol.28 (2), p.8-22
2011
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-02, Vol.12 (2), p.228-252
2022
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1st ed. 2020., 2020
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Microelectronics and reliability, 2012-11, Vol.52 (11), p.2660-2669
2012
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-08, Vol.12 (8), p.1271-1281
2022
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-03, Vol.13 (3), p.399-425
2023
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Materials, 2022-03, Vol.15 (7), p.2396
2022
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-06, Vol.8 (6), p.991-1002
2018
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Journal of microelectronics and electronic packaging, 2021-10, Vol.18 (4), p.145-160
2021
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-09, Vol.4 (9), p.1407-1419
2014
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-08, Vol.11 (8), p.1301-1309
2021
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-06, Vol.1 (6), p.841-851
2011
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1729-1738
2017
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Expert review of molecular diagnostics, 2020-12, Vol.20 (12), p.1253-1258
2020
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2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1031-1042
2010
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-07, Vol.10 (7), p.1125-1137
2020
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-09, Vol.13 (9), p.1371-1379
2023
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1544-1560
2018
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