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Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices

IEEE electron device letters, 2015-05, Vol.36 (5), p.502-504

2015

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IEEE_Xplore

Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-02, Vol.10 (2), p.255-262

2020

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IEEE_Xplore

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-03, Vol.14 (3), p.397-405

2024

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IEEE_Xplore

Effect of Thermal Cycling on the Thermal and Mechanical Properties of Dielectric Materials

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-07, Vol.10 (7), p.1166-1174

2020

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IEEE_Xplore

Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-12, Vol.5 (12), p.1740-1746

2015

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IEEE_Xplore

Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.50-57

2017

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IEEE_Xplore

Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-05, Vol.6 (5), p.729-739

2016

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IEEE_Xplore

Design Optimization and Characterization of Silicon Microcooler System Through Finite-Element Modeling and Experimental Analyses

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-02, Vol.6 (2), p.224-237

2016

Link zum Volltext
IEEE_Xplore

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.581-587

2014

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IEEE_Xplore

Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-05, Vol.5 (5), p.606-613

2015

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IEEE_Xplore

Molding process development for Low-Cost MEMS-WLCSP with silicon pillars and Cu wires as vertical interconnections

2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-6

2017

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IEEE_Xplore

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-06, Vol.4 (6), p.983-990

2014

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IEEE_Xplore

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-09, Vol.4 (9), p.1441-1450

2014

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IEEE_Xplore

Laser de-bonding process development of glass substrate for Fan-out wafer level packaging

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.43-46

2016

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Development of Si-Based Micro-Fluidic Cooler for Thermal Management of Server Processor in Data Center

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.976-981

2019

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Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.330-334

2014

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Forming a Vertical Interconnect Structure Using Dry Film Processing for Fan Out Wafer Level Packaging

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.878-883

2017

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IEEE_Xplore

Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1654-1659

2017

Link zum Volltext
IEEE_Xplore

Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-5

2015

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Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1188-1193

2018

Link zum Volltext
IEEE_Xplore

Development of a jet-based Si micro-cooler with multiple drainage micro-trenches

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-5

2015

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Verfügbarkeit prüfen

Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices

2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2015, p.603-606

2015

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Through mold interconnects for fan-out wafer level package

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.51-56

2016

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Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1989-1993

2023

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IEEE_Xplore

Process and challenges of ultra-thick spin-on photoresist

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-5

2015

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Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices

Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

Effect of Thermal Cycling on the Thermal and Mechanical Properties of Dielectric Materials

Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices

Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices

Design Optimization and Characterization of Silicon Microcooler System Through Finite-Element Modeling and Experimental Analyses

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps

Molding process development for Low-Cost MEMS-WLCSP with silicon pillars and Cu wires as vertical interconnections

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

Laser de-bonding process development of glass substrate for Fan-out wafer level packaging

Development of Si-Based Micro-Fluidic Cooler for Thermal Management of Server Processor in Data Center

Package-level Si-based micro-jet impingement cooling solution with multiple drainage micro-trenches

Forming a Vertical Interconnect Structure Using Dry Film Processing for Fan Out Wafer Level Packaging

Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows

Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

Development of a jet-based Si micro-cooler with multiple drainage micro-trenches

Heat dissipation improvement with diamond heat spreader on hybrid Si micro-cooler for GaN devices

Through mold interconnects for fan-out wafer level package

Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC

Process and challenges of ultra-thick spin-on photoresist

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