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Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2011-09, Vol.650 (1), p.189-193

2011

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Design, Fabrication, and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Interdigital Electrodes

Journal of physics. Conference series, 2015-12, Vol.660 (1), p.12064

2015

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Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1111-1116

2013

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Automotive high voltage grid simulation modelling and simulation high voltage car grids from system prospective

2014 International Symposium on Electromagnetic Compatibility, 2014, p.426-431

2014

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IEEE_Xplore

Design, Fabrication and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Side-by-Side Electrodes

Journal of physics. Conference series, 2013-01, Vol.476 (1), p.12086-5

2013

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Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications

Advances in Science and Technology, 2013-01, Vol.80, p.96-101

2013

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Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

2022 International Conference on Electronics Packaging (ICEP), 2022, p.167-168

2022

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Panel Level Packaging - A View Along the Process Chain

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.70-78

2018

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IEEE_Xplore

Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes

Journal of microelectronics and electronic packaging, 2012-04, Vol.9 (2), p.78-86

2012

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Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-6

2019

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Large area compression molding for Fan-out Panel Level Packing

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1077-1083

2015

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IEEE_Xplore

Flip chip assembly of thinned chips for hybrid pixel detector applications

Journal of instrumentation, 2014-05, Vol.9 (5), p.C05039-C05039

2014

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Fan-out wafer level packaging for 5G and mm-Wave applications

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018, p.247-251

2018

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IEEE_Xplore

Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-8

2019

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Sea water magnesium fuel cell power supply

Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach

Investigation of low temperature bonding process using indium bumps

Small fuel cell system with cartridges for controlled hydrogen generation

High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach

Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography

Corrosion behaviour of sintered silver under maritime environmental conditions

Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars

Improving the FE simulation of molded packages using warpage measurements

Modelling the shape, length and radiation characteristics of bond wire antennas

High frequency impedance of Li-ion batteries

Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications

Design, Fabrication, and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Interdigital Electrodes

Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling

Automotive high voltage grid simulation modelling and simulation high voltage car grids from system prospective

Design, Fabrication and Testing of Silicon-integrated Li-ion Secondary Micro Batteries with Side-by-Side Electrodes

Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications

Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

Panel Level Packaging - A View Along the Process Chain

Transfer Molding Technology for Smart Power Electronics Modules: Materials and Processes

Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection

Large area compression molding for Fan-out Panel Level Packing

Flip chip assembly of thinned chips for hybrid pixel detector applications

Fan-out wafer level packaging for 5G and mm-Wave applications

Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices

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