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Porous Nickel Oxide/Nickel Films for Electrochemical Capacitors

Journal of the Electrochemical Society, 1996-01, Vol.143 (1), p.124-130

1996

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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Journal of electronic materials, 2012-02, Vol.41 (2), p.283-301

2012

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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Journal of electronic materials, 2011-09, Vol.40 (9), p.1895-1902

2011

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Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-12, Vol.1 (12), p.1965-1974

2011

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Journal of electronic materials, 2010-12, Vol.39 (12), p.2588-2597

2010

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Suppressing Ni₃Sn₄ formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Materials letters, 2011-11, Vol.65 (21-22), p.3216-3218

2011

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Journal of electronic materials, 2010-12, Vol.39 (12), p.2564-2573

2010

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Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Journal of electronic materials, 2010-12, Vol.39 (12), p.2669-2679

2010

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Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free Solder Joints

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-05, Vol.1 (5), p.714-721

2011

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Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Journal of electronic materials, 2009-12, Vol.38 (12), p.2702-2711

2009

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Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Journal of electronic materials, 2009-12, Vol.38 (12), p.2685-2693, Article 2685

2009

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Synthesis of Monodisperse Silica Microspheres by a Modified Stöber Method

Integrated ferroelectrics, 2014-06, Vol.154 (1), p.142-146

2014

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Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

Journal of electronic materials, 2010-12, Vol.39 (12), p.2544-2552

2010

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Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Journal of electronic materials, 2011-10, Vol.40 (10), p.2111-2118

2011

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Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Journal of electronic materials, 2012-02, Vol.41 (2), p.273-282

2012

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The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

Journal of electronic materials, 2009-12, Vol.38 (12), p.2585-2591

2009

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Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Journal of electronic materials, 2009-12, Vol.38 (12), p.2712-2719

2009

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

Journal of electronic materials, 2011-09, Vol.40 (9), p.1967-1976

2011

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The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

Journal of electronic materials, 2009-02, Vol.38 (2), p.221-226

2009

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In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

Journal of electronic materials, 2012-02, Vol.41 (2), p.262-272

2012

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The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints

2011 International Reliability Physics Symposium, 2011, p.5F.1.1-5F.1.9

2011

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Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1816-1822

2010

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A novel integrated warpage prediction model based on characterization of viscoelasticity in time domain and chemical shrinkage for molded underfill

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.79-82

2015

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Method for early detection of PCB bending induced pad cratering

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1255-1262

2011

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Pb-free solder joint reliability of fine pitch chip-scale packages

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1587-1590

2010

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Porous Nickel Oxide/Nickel Films for Electrochemical Capacitors

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Suppressing Ni₃Sn₄ formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free Solder Joints

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Synthesis of Monodisperse Silica Microspheres by a Modified Stöber Method

Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects

Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints

Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions

A novel integrated warpage prediction model based on characterization of viscoelasticity in time domain and chemical shrinkage for molded underfill

Method for early detection of PCB bending induced pad cratering

Pb-free solder joint reliability of fine pitch chip-scale packages

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