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Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation

IEEE transactions on microwave theory and techniques, 2010-09, Vol.58 (9), p.2408-2419

2010

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Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology

Applied physics express, 2013-12, Vol.6 (12), p.126701

2013

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Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-03, Vol.2 (3), p.402-409

2012

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An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM), 2010, p.1-4

2010

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Improvement in RF performance of 40-nm InAs-channel based HEMTs using Pt gate sinking with two-step recess processes technology

Microelectronic engineering, 2010-12, Vol.87 (12), p.2625-2628

2010

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A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Japanese Journal of Applied Physics, 2011-09, Vol.50 (9R), p.96503

2011

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Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Japanese Journal of Applied Physics, 2011-09, Vol.50 (9), p.096503-096503-5

2011

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Impact of bonding temperature on the performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) device packaged using Flip-Chip-on-Board (FCOB) technology

2012 Asia Pacific Microwave Conference Proceedings, 2012, p.938-940

2012

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Thermoelastic properties of printed circuit boards: Effect of copper trace

2009 European Microelectronics and Packaging Conference, 2009, p.1-6

2009

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Flip-Chip-Based Multichip Module for Low Phase-Noise [Formula Omitted]-Band Frequency Generation

IEEE transactions on microwave theory and techniques, 2010-09, Vol.58 (9), p.2408

2010

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Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate

2010 International Conference on Enabling Science and Nanotechnology (ESciNano), 2010, p.1-2

2010

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A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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A flip-chip packaged 80-nm In 0.7Ga 0.3As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011, Vol.88 (2), p.183-186

2011

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Flip-Chip Packaging of In 0.6 Ga 0.4 As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications

ECS transactions, 2010-10, Vol.33 (13), p.171-176

2010

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Flip-Chip Packaging of MHEMT Device on Low-Cost Organic Substrate for W-band Applications

Meeting abstracts (Electrochemical Society), 2010-07, Vol.MA2010-02 (28), p.1777-1777

2010

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Laboratory‐adapted and wild‐type black soldier flies express differential plasticity in bioconversion and nutrition when reared on urban food waste streams

Journal of the science of food and agriculture, 2024-02, Vol.104 (3), p.1521-1530

2024

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The nuage mediates retrotransposon silencing in mouse primordial ovarian follicles

Development (Cambridge), 2013-09, Vol.140 (18), p.3819-3825

2013

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Maxillary Third Molar: Patterns of Impaction and Their Relation to Oroantral Perforation

Journal of oral and maxillofacial surgery, 2012-05, Vol.70 (5), p.1035-1039

2012

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A Novel Respiratory Rate Estimation Algorithm from Photoplethysmogram Using Deep Learning Model

Diagnostics (Basel), 2024-01, Vol.14 (3), p.284

2024

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Phase-Selective Synthesis of Copper Sulfide Nanocrystals

Chemistry of materials, 2006-12, Vol.18 (26), p.6170-6177

2006

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Preparation of Ag2S Nanocrystals of Predictable Shape and Size

Angewandte Chemie International Edition, 2004-10, Vol.43 (42), p.5685-5689

2004

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Pure Blue-Light Emissive Poly(oligofluorenes) with Bifunctional POSS in the Main Chain

Macromolecular rapid communications., 2014-04, Vol.35 (8), p.801-806

2014

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From Winter Snowflakes to Spring Blossoms: Manipulating the Growth of Copper Sulfide Dendrites

Crystal growth & design, 2007-12, Vol.7 (12), p.2429-2435

2007

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What is at stake in a war? A prospective evaluation of the Ukraine and Russia conflict for business and society

Global business and organizational excellence, 2022-09, Vol.41 (6), p.23-36

2022

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Flip-Chip-Based Multichip Module for Low Phase-Noise V-Band Frequency Generation

Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology

Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

Improvement in RF performance of 40-nm InAs-channel based HEMTs using Pt gate sinking with two-step recess processes technology

A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Impact of bonding temperature on the performance of In0.6Ga0.4As Metamorphic High Electron Mobility Transistor (mHEMT) device packaged using Flip-Chip-on-Board (FCOB) technology

Thermoelastic properties of printed circuit boards: Effect of copper trace

Flip-Chip-Based Multichip Module for Low Phase-Noise [Formula Omitted]-Band Frequency Generation

Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate

A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

A flip-chip packaged 80-nm In 0.7Ga 0.3As MHEMT for millimeter-wave low-noise applications

Flip-Chip Packaging of In 0.6 Ga 0.4 As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications

Flip-Chip Packaging of MHEMT Device on Low-Cost Organic Substrate for W-band Applications

Laboratory‐adapted and wild‐type black soldier flies express differential plasticity in bioconversion and nutrition when reared on urban food waste streams

The nuage mediates retrotransposon silencing in mouse primordial ovarian follicles

Maxillary Third Molar: Patterns of Impaction and Their Relation to Oroantral Perforation

A Novel Respiratory Rate Estimation Algorithm from Photoplethysmogram Using Deep Learning Model

Phase-Selective Synthesis of Copper Sulfide Nanocrystals

Preparation of Ag2S Nanocrystals of Predictable Shape and Size

Pure Blue-Light Emissive Poly(oligofluorenes) with Bifunctional POSS in the Main Chain

From Winter Snowflakes to Spring Blossoms: Manipulating the Growth of Copper Sulfide Dendrites

What is at stake in a war? A prospective evaluation of the Ukraine and Russia conflict for business and society

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