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Coalescence Behavior of Gold Nanoparticles

Nanoscale research letters, 2009-07, Vol.4 (7), p.684-688, Article 684

2009

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The presence probability of mandibular lingla and antilingula

Journal of stomatology, oral and maxillofacial surgery, 2020-12, Vol.121 (6), p.621-625

2020

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Exploring human biology with N-of-1 clinical trials

Cambridge prisms. Precision medicine, 2023, Vol.1, Article e12

2023

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Causes of ozone pollution in summer in Wuhan, Central China

Environmental pollution (1987), 2018-10, Vol.241, p.852-861

2018

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A meta-analysis and systematic review of prophylactic endoscopic treatments for postpolypectomy bleeding

International journal of colorectal disease, 2011-06, Vol.26 (6), p.709-719

2011

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Impact of laterally non-uniform carrier lifetime on photoconductance-based lifetime measurements with self-consistent calibration

Progress in photovoltaics, 2013-12, Vol.21 (8), p.1640-1644

2013

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Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish

Journal of electronic materials, 2012-09, Vol.41 (9), p.2502-2507

2012

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Structural engineering of Ba0.5Sr0.5TiO3 epitaxial films

Thin solid films, 2012-07, Vol.520 (18), p.5918-5921

2012

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Symmetrical transition of an atomic arrangement for 2D Bi films on Rh(111)

Surface science, 2011-04, Vol.605 (7), p.844-847

2011

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Electrical properties of atomic layer deposited Al2O3 with anneal temperature for surface passivation

Thin solid films, 2013-07, Vol.539, p.309-316

2013

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Relieving hot-spot temperature and current crowding effects during electromigration in solder bumps by using Cu columns

Journal of electronic materials, 2007-10, Vol.36 (10), p.1348-1354

2007

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Electromigration issues in lead-free solder joints

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.259-268

2007

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Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints

Journal of electronic materials, 2010-10, Vol.39 (10), p.2316-2323

2010

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Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing

Journal of electronic materials, 2007-02, Vol.36 (2), p.159-167

2007

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Comparison of outcomes of direct-acting oral anticoagulants vs. vitamin K antagonists in patients with bioprosthetic heart valves or valve repair: a systematic review and meta-analysis

European review for medical and pharmacological sciences, 2021-08, Vol.25 (15), p.5006

2021

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Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

Applied physics letters, 2006-07, Vol.89 (3), p.032103-032103-3

2006

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Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

Journal of electronic materials, 2009-12, Vol.38 (12), p.2443-2448

2009

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Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration

Journal of electronic materials, 2008-07, Vol.37 (7), p.962-967

2008

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Coalescence Behavior of Gold Nanoparticles

Nanoscale research letters, 2009-03, Vol.4 (7), p.684-688

2009

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Geometrical effect of bump resistance for flip-chip solder joints : Finite-element modeling and experimental results

Journal of electronic materials, 2006-08, Vol.35 (8), p.1647-1654

2006

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Temperature and current-density distributions in flip-chip solder joints with Cu traces

Journal of electronic materials, 2006-05, Vol.35 (5), p.947-953

2006

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Effect of bump size on current density and temperature distributions in flip-chip solder joints

Microelectronics and reliability, 2009-05, Vol.49 (5), p.544-550

2009

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Shape evolution of gold nanoparticles

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2010-02, Vol.12 (2), p.655-661

2010

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Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Journal of applied physics, 2010-05, Vol.107 (9), p.093715-093715-4

2010

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Fabrication and microstructure of Cu2O nanocubes

Journal of crystal growth, 2010-04, Vol.312 (9), p.1605-1609

2010

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Coalescence Behavior of Gold Nanoparticles

The presence probability of mandibular lingla and antilingula

Exploring human biology with N-of-1 clinical trials

Causes of ozone pollution in summer in Wuhan, Central China

A meta-analysis and systematic review of prophylactic endoscopic treatments for postpolypectomy bleeding

Impact of laterally non-uniform carrier lifetime on photoconductance-based lifetime measurements with self-consistent calibration

Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish

Structural engineering of Ba0.5Sr0.5TiO3 epitaxial films

Symmetrical transition of an atomic arrangement for 2D Bi films on Rh(111)

Electrical properties of atomic layer deposited Al2O3 with anneal temperature for surface passivation

Relieving hot-spot temperature and current crowding effects during electromigration in solder bumps by using Cu columns

Electromigration issues in lead-free solder joints

Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints

Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing

Comparison of outcomes of direct-acting oral anticoagulants vs. vitamin K antagonists in patients with bioprosthetic heart valves or valve repair: a systematic review and meta-analysis

Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints

Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration

Coalescence Behavior of Gold Nanoparticles

Geometrical effect of bump resistance for flip-chip solder joints : Finite-element modeling and experimental results

Temperature and current-density distributions in flip-chip solder joints with Cu traces

Effect of bump size on current density and temperature distributions in flip-chip solder joints

Shape evolution of gold nanoparticles

Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Fabrication and microstructure of Cu2O nanocubes

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