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Estimating the quantities of critical metals embedded in ICT and consumer equipment

Resources, conservation and recycling, 2015-05, Vol.98, p.9-18

2015

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Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors

Micromachines (Basel), 2021-11, Vol.12 (11), p.1429

2021

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Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments

Sensors (Basel, Switzerland), 2015-08, Vol.15 (8), p.20305-20315

2015

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High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-10, Vol.1 (10), p.1627-1641

2011

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Platinum Interconnections for Harsh Environment Applications Using Atmospheric Pressure Sputtering

TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, 2023, Vol.16, p.E23-E21-005-11

2023

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Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-03, Vol.4 (3), p.504-515

2014

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Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS

Micromachines (Basel), 2020-04, Vol.11 (5), p.474

2020

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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

Micromachines (Basel), 2018-05, Vol.9 (6), p.266

2018

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On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas

IEEE transactions on antennas and propagation, 2018-11, Vol.66 (11), p.5672-5686

2018

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Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-12, Vol.5 (12), p.1793-1801

2015

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Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics

IEEE transactions on electromagnetic compatibility, 2019-06, Vol.61 (3), p.966-968

2019

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Advances in CO2-Laser Drilling of Glass Substrates

Physics procedia, 2012, Vol.39, p.548-555

2012

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A WSi⁻WSiN⁻Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems

Micromachines (Basel), 2016-10, Vol.7 (10), p.193-193

2016

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On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes

IEEE transactions on microwave theory and techniques, 2016-08, Vol.64 (8), p.2511-2518

2016

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Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias

IEEE transactions on electron devices, 2016-08, Vol.63 (8), p.3199-3204

2016

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Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines

IEEE transactions on electromagnetic compatibility, 2019-08, Vol.61 (4), p.1175-1182

2019

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High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes

Microsystem technologies : sensors, actuators, systems integration, 2019-04, Vol.25 (4), p.1137-1149

2019

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Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

Microelectronic engineering, 2016-04, Vol.156, p.41-45

2016

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Aluminum-Scandium: A Material for Semiconductor Packaging

Journal of electronic materials, 2016-10, Vol.45 (10), p.5456-5467

2016

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Modeling Method of Stray Magnetic Couplings in an EMC Filter for Power Electronic Devices

IEEJ JOURNAL OF INDUSTRY APPLICATIONS, 2015-01, Vol.4 (6), p.738-744

2015

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Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

IEEE transactions on electromagnetic compatibility, 2015-04, Vol.57 (2), p.241-249

2015

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Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-03, Vol.12 (3), p.437-445

2022

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Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Journal of electronic packaging, 2017-09, Vol.139 (3)

2017

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Data availability and the need for research to localize, quantify and recycle critical metals in information technology, telecommunication and consumer equipment

Waste management & research, 2013-10, Vol.31 (10_suppl), p.3-16

2013

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Addressing Sustainability and Flexibility in Manufacturing Via Smart Modular Machine Tool Frames to Support Sustainable Value Creation

Procedia CIRP, 2015, Vol.29, p.514-519

2015

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Estimating the quantities of critical metals embedded in ICT and consumer equipment

Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors

Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments

High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes

Platinum Interconnections for Harsh Environment Applications Using Atmospheric Pressure Sputtering

Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS

Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics

Advances in CO2-Laser Drilling of Glass Substrates

A WSi⁻WSiN⁻Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems

On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes

Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias

Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines

High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes

Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

Aluminum-Scandium: A Material for Semiconductor Packaging

Modeling Method of Stray Magnetic Couplings in an EMC Filter for Power Electronic Devices

Analytical Models for Calculating the Inductances of Bond Wires in Dependence on their Shapes, Bonding Parameters, and Materials

Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Data availability and the need for research to localize, quantify and recycle critical metals in information technology, telecommunication and consumer equipment

Addressing Sustainability and Flexibility in Manufacturing Via Smart Modular Machine Tool Frames to Support Sustainable Value Creation

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