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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (4), p.3035-3041

2020

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Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Electronic Materials Letters, 2020, 16(4), , pp.332-339

2020

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Electronic Materials Letters, 2020, 16(4), , pp.347-354

2020

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Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test

Journal of electronic materials, 2021-10, Vol.50 (10), p.5639-5646

2021

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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (24), p.22926-22932

2020

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Journal of electronic materials, 2020-10, Vol.49 (10), p.6073-6079

2020

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.6835-6842

2020

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Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Journal of materials science. Materials in electronics, 2021-02, Vol.32 (3), p.3054-3065

2021

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Automatic guidance control of an articulated all-wheel-steered vehicle

Vehicle system dynamics, 2014-04, Vol.52 (4), p.456-474

2014

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Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Electronic Materials Letters, 2019, 15(6), , pp.693-701

2019

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Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Journal of alloys and compounds, 2020-04, Vol.820, p.153077, Article 153077

2020

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Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability

Materials characterization, 2024-10, Vol.216, p.114289, Article 114289

2024

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Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.2206-2210

2022

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Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Advanced engineering materials, 2023-05, Vol.25 (10), p.n/a

2023

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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for CuNi bonding

Applied surface science, 2021-06, Vol.551, Article 149396

2021

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Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Journal of alloys and compounds, 2019-04, Vol.781, p.657-663

2019

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Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

Journal of alloys and compounds, 2021-03, Vol.857, p.157595, Article 157595

2021

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Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints

Journal of nanoscience and nanotechnology, 2019-10, Vol.19 (10), p.6437-6443

2019

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Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

Journal of alloys and compounds, 2021-05, Vol.863, p.158726, Article 158726

2021

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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding

Applied surface science, 2021-06, Vol.551, p.149396, Article 149396

2021

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The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

Journal of electronic materials, 2020-11, Vol.49 (11), p.6746-6753

2020

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Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Microelectronics and reliability, 2020-09, Vol.112, p.113918, Article 113918

2020

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Position and Orientation Estimation of a Maneticalluy Guided-Articulated Vehicle

The transactions of the Korean Institute of Electrical Engineers, 2011-10, Vol.60 (10), p.1915-1923

2011

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Bending reliability of Ni–MWCNT composite solder with a differential structure

Microelectronics and reliability, 2020-10, Vol.113, p.113934, Article 113934

2020

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Automatic guidance control of an articulated all-wheel-steered vehicle

Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability

Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for CuNi bonding

Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints

Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior

Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding

The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature

Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test

Position and Orientation Estimation of a Maneticalluy Guided-Articulated Vehicle

Bending reliability of Ni–MWCNT composite solder with a differential structure

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