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Solution-processed SnO2 thin film for a hysteresis-free planar perovskite solar cell with a power conversion efficiency of 19.2

Journal of materials chemistry. A, Materials for energy and sustainability, 2017, Vol.5 (47), p.2479-2483

2017

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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Design and fabrication of screen-printed silver circuits for stretchable electronics

Microelectronic engineering, 2014-05, Vol.120, p.216-220

2014

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.6835-6842

2020

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Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Journal of materials science. Materials in electronics, 2021-02, Vol.32 (3), p.3054-3065

2021

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Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (20), p.18848-18857

2019

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Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-09, Vol.10 (9), p.1432-1437

2020

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Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.12869-12875

2019

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Electronic Materials Letters, 2020, 16(4), , pp.347-354

2020

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Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (4), p.4079-4084

2019

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RF characteristics of flexible circuits patterned with hybrid Ag paste

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (6), p.5074-5081

2018

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Adhesion of PDMS substrates assisted by Plasma Graft Polymerization

Surface and interface analysis, 2016-07, Vol.48 (7), p.597-600

2016

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Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate

Nanoscience and nanotechnology letters, 2015-12, Vol.7 (12), p.999-1003

2015

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Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB

Journal of alloys and compounds, 2019-02, Vol.775, p.581-588

2019

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Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility

Journal of alloys and compounds, 2017-03, Vol.699, p.1186-1191

2017

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Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Journal of alloys and compounds, 2019-04, Vol.781, p.657-663

2019

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Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

Journal of alloys and compounds, 2021-03, Vol.857, p.157595, Article 157595

2021

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Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics

Journal of alloys and compounds, 2019-07, Vol.794, p.341-346

2019

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Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

Advanced engineering materials, 2020-12, Vol.22 (12), p.n/a

2020

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Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering

Journal of materials science & technology, 2020-09, Vol.53, p.13-18

2020

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Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy

Journal of alloys and compounds, 2018-06, Vol.748, p.898-904

2018

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Effect of Sodium Dodecylbenzene Sulfonate Contents on Oxide Behavior in Cu Nanopaste

Journal of nanoscience and nanotechnology, 2017-10, Vol.17 (10), p.7497-7501

2017

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Preparation of antibacterial PDMAEMA-functionalized multiwalled carbon nanotube via atom transfer radical polymerization

Journal of applied polymer science, 2013-02, Vol.127 (3), p.1508-1518

2013

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Screen-Printed Cu Circuit for Low-Cost Fabrication and Its Electrochemical Migration Characteristics

Journal of nanoscience and nanotechnology, 2014-12, Vol.14 (12), p.9493-9497

2014

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The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste

Journal of materials science. Materials in electronics, 2015-11, Vol.26 (11), p.8644-8651

2015

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Solution-processed SnO2 thin film for a hysteresis-free planar perovskite solar cell with a power conversion efficiency of 19.2

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Design and fabrication of screen-printed silver circuits for stretchable electronics

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method

RF characteristics of flexible circuits patterned with hybrid Ag paste

Adhesion of PDMS substrates assisted by Plasma Graft Polymerization

Effects of Polyvinylpyrrolidone Molecular Weight on Adhesion Strength of Screen-Printed Cu Circuits to Polyimide Substrate

Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB

Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility

Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant

Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics

Ultrafast Photonic Soldering with Sn–58Bi Using Intense Pulsed Light Energy

Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering

Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy

Effect of Sodium Dodecylbenzene Sulfonate Contents on Oxide Behavior in Cu Nanopaste

Preparation of antibacterial PDMAEMA-functionalized multiwalled carbon nanotube via atom transfer radical polymerization

Screen-Printed Cu Circuit for Low-Cost Fabrication and Its Electrochemical Migration Characteristics

The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste

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