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Low Temperature SoIC Bonding and Stacking Technology for 12-/16-Hi High Bandwidth Memory (HBM)

IEEE transactions on electron devices, 2020-12, Vol.67 (12), p.5343-5348

2020

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Low Temperature SoIC™ Bonding and Stacking Technology for 12/16-Hi High Bandwidth Memory (HBM)

2020 IEEE Symposium on VLSI Technology, 2020, p.1-2

2020

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SoICH Technology for Heterogeneous System Integration

IEEE transactions on electron devices, 2022-12, Vol.69 (12), p.7167-7172

2022

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SoIC_H Technology for Heterogeneous System Integration

IEEE transactions on electron devices, 2022-12, Vol.69 (12), p.7167-7172

2022

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An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1025-1029

2024

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Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Microelectronics and reliability, 2006-02, Vol.46 (2), p.523-534

2006

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3D-MiM (MUST-in-MUST) Technology for Advanced System Integration

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1-6

2019

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A Thermally Friendly Bonding Scheme for 3D System Integration

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1973-1976

2023

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InFOSoW (System-on-Wafer) for High Performance Computing

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1-6

2020

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Advanced System Integration for High Performance Computing with Liquid Cooling

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.105-111

2021

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Failure life prediction and factorial design of lead-free flip chip package

Journal of the Chinese Institute of Engineers, 2007-05, Vol.30 (3), p.481-490

2007

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Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the, 2004, p.149-156

2004

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Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology

2006 International Microsystems, Package, Assembly Conference Taiwan, 2006, p.1-4

2006

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Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.687-691

2005

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The Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package

EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006, p.1-8

2006

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Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.90-97 Vol.1

2004

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Characterization of thin films and intermetallic compounds in solder joint

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.703-705