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Plasma induced damage mitigation in spin-on self-assembly based ultra low-k dielectrics using template residues

Applied physics letters, 2017-01, Vol.110 (1)

2017

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Low-k films modification under EUV and VUV radiation

Journal of physics. D, Applied physics, 2014-01, Vol.47 (2), p.025102-1-025102-14

2014

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Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

Applied physics letters, 2016-01, Vol.108 (1)

2016

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Improvement of cohesion strength in ULK OSG materials by pore structure adjustment

Microelectronic engineering, 2015-04, Vol.137, p.75-78

2015

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Fractally aggregated micro- and nanosystems synthesized from sols

Glass physics and chemistry, 2014-03, Vol.40 (2), p.190-202

2014

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Leakage current induced by surfactant residues in self-assembly based ultralow-k dielectric materials

Applied physics letters, 2017-07, Vol.111 (3)

2017

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Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

Applied surface science, 2019-08, Vol.485, p.170-178

2019

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Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Applied physics letters, 2017-10, Vol.111 (16)

2017

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Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics

Journal of applied physics, 2015-10, Vol.118 (13)

2015

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On the mechanical and electrical properties of self-assembly-based organosilicate porous films

Journal of materials chemistry. C, Materials for optical and electronic devices, 2017, Vol.5 (33), p.8599-8607

2017

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UV cure of oxycarbosilane low-k films

Microelectronic engineering, 2016-04, Vol.156, p.103-107

2016

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On the mechanical and electrical properties of self-assembly-based organosilicate porous filmsElectronic supplementary information (ESI) available: FTIR of pristine films; FTIR after UV cure; RI, YM, k-value, open pore volume and mass density of the reported films. See DOI: 10.1039/c7tc02276j

2017-08

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On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control

2016 IEEE Symposium on VLSI Technology, 2016, p.1-2

2016

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Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015, p.103-106

2015

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Pore Sealing of Porous Ultralow-k Dielectrics by Self-Assembled Monolayers Combined with Atomic Layer Deposition

ECS solid state letters, 2012-07, Vol.1 (2), p.P42-P44

2012

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Study of Wet Surface Activation Routes to Enable the Deposition of Monomolecular Organic Thin Films on k 2.0 Porous Dielectrics

ECS journal of solid state science and technology, 2014-01, Vol.3 (1), p.N3106-N3111

2014

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Impact of curing condition on chemical stability of ultralow-k PMO material

MRS proceedings, 2012, Vol.1428 (1), p.7-12, Article mrss12-1428-c02-07

2012

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Impact of UV wavelength and curing time on the properties of spin-coated low-k films

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015, p.99-102

2015

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Pore sealing of SiOCH ultra low-k dielectrics with polyimide Langmuir-Blodgett film

MRS proceedings, 2012, Vol.1428 (1), p.32-37, Article mrss12-1428-c01-05

2012

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HF etching mechanisms of advanced low-k films

IEEE International Interconnect Technology Conference, 2014, p.155-158

2014

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Integrated Cleanroom Process for the Vapor-Phase Deposition of Large-Area Zeolitic Imidazolate Framework Thin Films

Chemistry of materials, 2019-11, Vol.31 (22), p.9462-9471

2019

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Effect of porosity and pore size on dielectric constant of organosilicate based low-k films: An analytical approach

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2016-07, Vol.34 (4)

2016

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Enhanced synthesis of the exopolysaccharide ethapolan by Acinetobacter sp. 12s grown on a mixture of substrates

Microbiology (New York), 2003, Vol.72 (1), p.18-23

2003

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Study of Chemical Vapor Deposition of Manganese on Porous SiCOH Low-k Dielectrics Using Bis(ethylcyclopentadienyl)manganese

Electrochemical and solid-state letters, 2012, Vol.15 (5), p.H176

2012

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Intensification of synthesis of the exopolysaccharide ethapolan by Acinetobacter sp. 12S grown on a mixture of substrates

Mikrobiologija (Moskva. 1932), 2003-01, Vol.72 (1), p.26

2003

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Plasma induced damage mitigation in spin-on self-assembly based ultra low-k dielectrics using template residues

Low-k films modification under EUV and VUV radiation

Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

Improvement of cohesion strength in ULK OSG materials by pore structure adjustment

Fractally aggregated micro- and nanosystems synthesized from sols

Leakage current induced by surfactant residues in self-assembly based ultralow-k dielectric materials

Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics

On the mechanical and electrical properties of self-assembly-based organosilicate porous films

UV cure of oxycarbosilane low-k films

On the mechanical and electrical properties of self-assembly-based organosilicate porous filmsElectronic supplementary information (ESI) available: FTIR of pristine films; FTIR after UV cure; RI, YM, k-value, open pore volume and mass density of the reported films. See DOI: 10.1039/c7tc02276j

On-chip interconnect trends, challenges and solutions: How to keep RC and reliability under control

Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics

Pore Sealing of Porous Ultralow-k Dielectrics by Self-Assembled Monolayers Combined with Atomic Layer Deposition

Study of Wet Surface Activation Routes to Enable the Deposition of Monomolecular Organic Thin Films on k 2.0 Porous Dielectrics

Impact of curing condition on chemical stability of ultralow-k PMO material

Impact of UV wavelength and curing time on the properties of spin-coated low-k films

Pore sealing of SiOCH ultra low-k dielectrics with polyimide Langmuir-Blodgett film

HF etching mechanisms of advanced low-k films

Integrated Cleanroom Process for the Vapor-Phase Deposition of Large-Area Zeolitic Imidazolate Framework Thin Films

Effect of porosity and pore size on dielectric constant of organosilicate based low-k films: An analytical approach

Enhanced synthesis of the exopolysaccharide ethapolan by Acinetobacter sp. 12s grown on a mixture of substrates

Study of Chemical Vapor Deposition of Manganese on Porous SiCOH Low-k Dielectrics Using Bis(ethylcyclopentadienyl)manganese

Intensification of synthesis of the exopolysaccharide ethapolan by Acinetobacter sp. 12S grown on a mixture of substrates

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