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Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

Journal of alloys and compounds, 2008-02, Vol.450 (1), p.229-237

2008

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Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy

Journal of alloys and compounds, 2008-05, Vol.455 (1), p.148-158

2008

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Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Thin solid films, 2006-05, Vol.504 (1), p.371-378

2006

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Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.423 (1), p.57-63

2006

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Application of piezoresistive stress sensors in ultra thin device handling and characterization

Sensors and actuators. A. Physical., 2009-11, Vol.156 (1), p.2-7

2009

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Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011-05, Vol.528 (12), p.4166-4172

2011

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Development of 3-D Silicon Module With TSV for System in Packaging

IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.3-9

2010

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Characterization of optical properties of acrylate based adhesives exposed to different temperature conditions

Journal of applied polymer science, 2005-11, Vol.98 (3), p.950-956

2005

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Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.536-544

2011

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Scanning localized arc discharge lithography for the fabrication of microstructures made of carbon nanotubes

Nanotechnology, 2007-09, Vol.18 (38), p.385304-385304 (6)

2007

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Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

IEEE transactions on components and packaging technologies, 2009-09, Vol.32 (3), p.566-571

2009

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Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects

Nanotechnology, 2007-08, Vol.18 (30), p.305306-305306 (5)

2007

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Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-01, Vol.1 (1), p.52-59

2011

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A survey of remote patient monitoring systems for the measurement of multiple physiological parameters

Health and technology, 2017-11, Vol.7 (2-3), p.153-159

2017

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Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Materials letters, 2006-04, Vol.60 (8), p.1089-1094

2006

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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.299-309

2011

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Refractive indices variation with temperature and humidity of optical adhesive

Journal of electronic materials, 2005-11, Vol.34 (11), p.1378-1384

2005

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Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates

Materials letters, 2000-07, Vol.44 (6), p.347-351

2000

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Misalignment of the optical fibers in multi-channel V-grooves

Thin solid films, 2006-05, Vol.504 (1), p.341-345

2006

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Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Thin solid films, 2006-05, Vol.504 (1), p.410-415

2006

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Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.838-848

2009

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Optical coupling efficiency studies of passively aligned CWDM optical modules

Optics communications, 2005-04, Vol.248 (1-3), p.191-199

2005

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FABRICATION OF SELF-ORGANIZED METAL NANOWIRE ARRAY USING POROUS ALUMINA TEMPLATE FOR OFF-CHIP INTERCONNECTS

International journal of nanoscience, 2006-08, Vol.5 (4n05), p.453-458

2006

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Bed of Nails-100- \mum-Pitch Wafer-Level Interconnections Process

IEEE transactions on electronics packaging manufacturing, 2008-10, Vol.31 (4), p.333-340

2008

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Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-04, Vol.1 (4), p.502-509

2011

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Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

Application of piezoresistive stress sensors in ultra thin device handling and characterization

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

Development of 3-D Silicon Module With TSV for System in Packaging

Characterization of optical properties of acrylate based adhesives exposed to different temperature conditions

Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules

Scanning localized arc discharge lithography for the fabrication of microstructures made of carbon nanotubes

Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects

Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

A survey of remote patient monitoring systems for the measurement of multiple physiological parameters

Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

Refractive indices variation with temperature and humidity of optical adhesive

Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates

Misalignment of the optical fibers in multi-channel V-grooves

Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

Optical coupling efficiency studies of passively aligned CWDM optical modules

FABRICATION OF SELF-ORGANIZED METAL NANOWIRE ARRAY USING POROUS ALUMINA TEMPLATE FOR OFF-CHIP INTERCONNECTS

Bed of Nails-100- \mum-Pitch Wafer-Level Interconnections Process

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

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