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High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications

Japanese Journal of Applied Physics, 2020-04, Vol.59 (SG), p.SGGC02

2020

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Ras-related C3 botulinum toxin substrate 1 (RAC1) regulates glucose-stimulated insulin secretion via modulation of F-actin

Diabetologia, 2013-05, Vol.56 (5), p.1088-1097

2013

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X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications-characterization technique-dependent reliability issues

Japanese Journal of Applied Physics, 2019-04, Vol.58 (SB), p.SBBC05

2019

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Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

IEEE transactions on electron devices, 2006-11, Vol.53 (11), p.2799-2808

2006

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FoxO1 signaling plays a pivotal role in the cardiac telomere biology responses to calorie restriction

Molecular and cellular biochemistry, 2016-01, Vol.412 (1-2), p.119-130

2016

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Extremely large magnetoresistance in a high-quality WTe2 grown by flux method

Journal of physics. Conference series, 2018, Vol.969 (1)

2018

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Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application

2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020, p.1-5

2020

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Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking

Journal of electronic materials, 2012-04, Vol.41 (4), p.720-729

2012

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Extremely large magnetoresistance in a high-quality WTe2 grown by flux method

Journal of physics. Conference series, 2018-03, Vol.969 (1)

2018

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New anti-monocyte chemoattractant protein-1 gene therapy attenuates atherosclerosis in apolipoprotein E-knockout mice

Circulation (New York, N.Y.), 2001-04, Vol.103 (16), p.2096-2101

2001

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Future system-on-silicon LSI chips

IEEE MICRO, 1998-07, Vol.18 (4), p.17-22

1998

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Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement

Journal of the Electrochemical Society, 2011-01, Vol.158 (8), p.H795

2011

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High-Density Through Silicon Vias for 3-D LSIs

Proceedings of the IEEE, 2009-01, Vol.97 (1), p.49-59

2009

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Physical Model of Noise Mechanisms in SOI and Bulk-Silicon MOSFETs for RF Applications

IEEE transactions on electron devices, 2008-03, Vol.55 (3), p.872-880

2008

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Implication of hrpW in virulence of Pseudomonas cichorii

Plant pathology, 2012-04, Vol.61 (2), p.355-363

2012

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High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate—an alternative method to wire bonding

Journal of micromechanics and microengineering, 2012-08, Vol.22 (8), p.1-9

2012

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High-step-coverage Cu-lateral interconnections over 100 µm thick chips on a polymer substrate-an alternative method to wire bonding

Journal of micromechanics and microengineering, 2012-07, Vol.22 (8), p.85033

2012

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GST polymorphisms, interaction with smoking and pesticide use, and risk for Parkinson’s disease in a Japanese population

Parkinsonism & related disorders, 2010-08, Vol.16 (7), p.447-452

2010

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Genetic characterization and specific detection of beer-spoilage Lactobacillus sp. LA2 and related strains

Journal of applied microbiology, 2004-04, Vol.96 (4), p.677-683

2004

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Neuromorphic vision chip fabricated using three-dimensional integration technology

2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177), 2001, p.270-271

2001

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Muscle activity during knee extension training in the prone position putting the fulcrum in the distal leg in osteoarthritis patients

Physiotherapy, 2015-05, Vol.101, p.e1319-e1319

2015

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Control of HIV-1 by multiple immunodominant HIV-1-specific CD8+ T cells in HIV-1-infected Japanese individuals

Retrovirology, 2012-09, Vol.9 (S2), p.P256-P256, Article P256

2012

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Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement

Semiconductor science and technology, 2011-02, Vol.26 (2), p.025007

2011

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Non-conductive film underfill for 3D integration of 20 pm-thick LSI wafers with fine Cu-TSVs

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2016, p.466-471

2016

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Genetic characterization of non-spoilage variant isolated from beer-spoilage Lactobacillus brevis ABBC45

Journal of applied microbiology, 2004, Vol.96 (5), p.946-953

2004

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High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications

Ras-related C3 botulinum toxin substrate 1 (RAC1) regulates glucose-stimulated insulin secretion via modulation of F-actin

X-ray computed tomography studies on directed self-assembly formed vertical nanocylinders containing metals for 3D LSI applications-characterization technique-dependent reliability issues

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

FoxO1 signaling plays a pivotal role in the cardiac telomere biology responses to calorie restriction

Extremely large magnetoresistance in a high-quality WTe2 grown by flux method

Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application

Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking

Extremely large magnetoresistance in a high-quality WTe2 grown by flux method

New anti-monocyte chemoattractant protein-1 gene therapy attenuates atherosclerosis in apolipoprotein E-knockout mice

Future system-on-silicon LSI chips

Cu Retardation Performance of Extrinsic Gettering Layers in Thinned Wafers Evaluated by Transient Capacitance Measurement

High-Density Through Silicon Vias for 3-D LSIs

Physical Model of Noise Mechanisms in SOI and Bulk-Silicon MOSFETs for RF Applications

Implication of hrpW in virulence of Pseudomonas cichorii

High-step-coverage Cu-lateral interconnections over 100 μm thick chips on a polymer substrate—an alternative method to wire bonding

High-step-coverage Cu-lateral interconnections over 100 µm thick chips on a polymer substrate-an alternative method to wire bonding

GST polymorphisms, interaction with smoking and pesticide use, and risk for Parkinson’s disease in a Japanese population

Genetic characterization and specific detection of beer-spoilage Lactobacillus sp. LA2 and related strains

Neuromorphic vision chip fabricated using three-dimensional integration technology

Muscle activity during knee extension training in the prone position putting the fulcrum in the distal leg in osteoarthritis patients

Control of HIV-1 by multiple immunodominant HIV-1-specific CD8+ T cells in HIV-1-infected Japanese individuals

Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement

Non-conductive film underfill for 3D integration of 20 pm-thick LSI wafers with fine Cu-TSVs

Genetic characterization of non-spoilage variant isolated from beer-spoilage Lactobacillus brevis ABBC45

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