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LEOS 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packagi, 1993, p.H33-H34

1993

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Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS

Summaries of papers presented at the Conference on Lasers and Electro-Optics, 1996, p.517-518

1996

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Design and characterization of multilayer spiral transmission-line baluns

GaAs MQW modulators integrated with silicon CMOS

An approach for fabricating high-performance inductors on low-resistivity substrates

High-speed optoelectronic VLSI switching chip with >4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS

3-D integration of MQW modulators over active submicron CMOS circuits: 375 Mb/s transimpedance receiver-transmitter circuit

1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 μm silicon CMOS

Arrays of optoelectronic switching nodes comprised of flip-chip-bonded MQW modulators and detectors on silicon CMOS circuitry

Clocked-sense-amplifier-based smart-pixel optical receivers

Photonic page buffer based on GaAs multiple-quantum-well modulators bonded directly over active silicon complementary-metal-oxide-semiconductor (CMOS) circuits

Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal

Photonic page buffer based on GaAs multiple-quantum-well modulators bonded directly over active silicon complementary-metal-oxide-semiconductor (CMOS) circuits: errata

An approach for fabricating high performance inductors on low resistivity substrates

High Q-factor inductors integrated on MCM Si substrates

Investigation of current crowding effect on spiral inductors

A novel MCM package for RF applications

1-Gb/s two-beam transimpedance smart-pixel optical receivers made from hybrid GaAs MQW modulators bonded to 0.8 mum silicon CMOS

Ring oscillators with optical and electrical readout based on hybrid GaAs MQW modulators bonded to 0.8 µm silicon VLSI circuits

3-D integration of MQW SEED detectors and modulators over active sub-micron CMOS circuits: Application to a 2KBit parallel photonic page buffer

15 /spl mu/m solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 /spl mu/m CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter

Large array of GaAs modulators and detectors flip-chip solder bonded to silicon CMOS using InGaP as the selective etch stop for GaAs substrate removal

A process for fabricating high current circuits with high interconnect density

The role of laminate, LTCC, and silicon based approaches to system in package development

High quality-factor inductors integrated on Si multichip modules

Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection

Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS

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