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Proceedings of the IEEE, 2001-04, Vol.89 (4), p.529-555
2001
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IEEE transactions on microwave theory and techniques, 1997-10, Vol.45 (10), p.1836-1846
1997
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IEEE transactions on electromagnetic compatibility, 2001-11, Vol.43 (4), p.446-465
2001
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IEEE transactions on very large scale integration (VLSI) systems, 2002-12, Vol.10 (6), p.695-711
2002
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IEEE transactions on advanced packaging, 2007-05, Vol.30 (2), p.279-287
2007
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IEEE transactions on advanced packaging, 2006-02, Vol.29 (1), p.11-20
2006
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IEEE transactions on advanced packaging, 2005-02, Vol.28 (1), p.63-70
2005
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A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
2004
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ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005, 2005, p.188-189 Vol. 1
2005
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IEEE transactions on advanced packaging, 2002-02, Vol.25 (1), p.102-117
2002
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2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315), 2002, Vol.2, p.152-153
- Almasi, G.
- Almasi, G.S.
- Beece, D.
- Bellofatto, R.
- Bhanot, G.
- Bickford, R.
- Blumrich, M.
- Bright, A.A.
- Brunheroto, J.
- Cascaval, C.
- Castanos, J.
- Ceze, L.
- Cateus, P.
- Chatterjee, S.
- Chen, D.
- Chiu, G.
- Cipolla, T.M.
- Crumley, P.
- Deutsch, A.
- Dombrowa, M.B.
- Donath, W.
- Eleftheriou, M.
- Fitch, B.
- Gagliano, J.
- Gara, A.
- Germain, R.
- Giampapa, M.E.
- Gupta, M.
- Gustavson, F.
- Hall, S.
- Haring, R.A.
- Heidel, D.
- Heidelberger, P.
- Herger, L.M.
- Hoenicke, D.
- Jackson, R.D.
- Jamal-Eddine, T.
- Kopcsay, G.V.
- Lanzetta, A.P.
- Lieber, D.
- Lu, M.
- Mendell, M.
- Mok, L.
- Moreira, J.
- Nathanson, B.J.
- Newton, M.
- Ohmacht, M.
- Rand, R.
- Regan, R.
- Sahoo, R.
- Sanomiya, A.
- Schenfeld, E.
- Singh, S.
- Song, P.
- Steinmacher-Burow, B.D.
- Strauss, K.
- Swetz, R.
- Takken, T.
- Vranas, P.
- Ward, T.J.C.
- Brown, J.
- Liebsch, T.
- Schram, A.
- Ulsh, G.
2002
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IEEE transactions on microwave theory and techniques, 1990-05, Vol.38 (5), p.615-621
1990
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Electronics letters, 1991-01, Vol.27 (2), p.175-176
1991
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Electronics letters, 1989-04, Vol.25 (8), p.523-524
1989
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IEEE transactions on instrumentation and measurement, 1990-06, Vol.39 (3), p.504-507
1990
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Electronics letters, 1992-01, Vol.28 (1), p.62-63
1992
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Electronics letters, 1988, Vol.24 (21), p.1318-1319
1988
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Synthetic metals, 1991-04, Vol.41 (1), p.721-721
1991
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IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005, 2005, p.39-42
2005
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2007 IEEE Workshop on Signal Propagation on Interconnects, 2007, p.99-102
2007
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IEEE transactions on advanced packaging, 2005-02, Vol.28 (1), p.4
2005
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IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005, 2005, p.21-24
2005
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IEEE microwave and guided wave letters, 1992-01, Vol.2 (1), p.25-27
1992
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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710), 2003, p.235-238
2003
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Electrical Performance of Electronic Packaging - 2004, 2004, p.295-298
2004
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- Integrated Circuit Interconnections
- Crosstalk
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Kollektion
Zeitschrift / Serie
- Ieee Transactions On Advanced Packaging
- Electronics Letters
- Ieee Microwave And Guided Wave Letters
- Ieee Transactions On Microwave Theory And Techniques
- 2002 Ieee International Solid-State Circuits Conference. Digest Of Technical Papers
- Digest Of Technical Papers - Ieee International Solid-State Circuits Conference
- Ieee Transactions On Components, Hybrids, And Manufacturing Technology
- Ieee Transactions On Components, Packaging, And Manufacturing Technology. Part B, Advanced Packaging
- Ieee Transactions On Electromagnetic Compatibility
- Ieee Transactions On Instrumentation And Measurement