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Advanced materials (Weinheim), 2020-05, Vol.32 (21), p.e1908422-n/a
2020
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Applied surface science, 2019-11, Vol.495, p.143487, Article 143487
2019
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Scripta materialia, 2007-04, Vol.56 (8), p.661-664
2007
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Journal of alloys and compounds, 2008-06, Vol.458 (1), p.253-260
2008
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Microelectronics and reliability, 2008-11, Vol.48 (11), p.1857-1863
2008
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Microsystem technologies, 2007-07, Vol.13 (11-12), p.1463-1469
2007
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Japanese Journal of Applied Physics, 2008-05, Vol.47 (5S), p.4257
2008
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Surface and interface analysis, 2006-04, Vol.38 (4), p.426-428
2006
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Japanese Journal of Applied Physics, 2008-05, Vol.47 (5S), p.4309
2008
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Japanese Journal of Applied Physics, 2008-05, Vol.47 (5S), p.4300
2008
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Microelectronics and reliability, 2007-12, Vol.47 (12), p.2169-2178
2007
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Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2008-06, Vol.483, p.254-257
2008
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Microelectronic engineering, 2005-12, Vol.82 (3), p.569-574
2005
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Journal of materials research, 2008-06, Vol.23 (6), p.1631-1641
2008
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Journal of alloys and compounds, 2008-10, Vol.466 (1), p.73-79
2008
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Journal of electronic materials, 2004-10, Vol.33 (10), p.1190-1199
2004
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Microsystem technologies, 2007-07, Vol.13 (11-12), p.1567-1573
2007
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Intermetallics, 2022-05, Vol.144, p.107535, Article 107535
2022
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Journal of electronic materials, 2008, Vol.37 (1), p.118-124
2008
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Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2008-06, Vol.483, p.620-624
2008
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Advanced materials (Weinheim), 2020-05, Vol.32 (21), p.n/a
2020
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Japanese Journal of Applied Physics, 2009-07, Vol.48 (7), p.7
2009
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International journal of adhesion and adhesives, 2008-09, Vol.28 (6), p.314-320
2008
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Materials Science Forum, 2006-01, Vol.510-511, p.730-733
2006
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Materials science forum, 2008-01, Vol.580-582, p.423-426
2008
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