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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1729-1738
2017
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1544-1560
2018
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-06, Vol.8 (6), p.991-1002
2018
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1561-1572
- Cheng-Ta Ko
- Yang, Henry
- Lau, John H.
- Ming Li
- Li, Margie
- Lin, Curry
- Lin, J. W.
- Chen, Tony
- Xu, Iris
- Chieh-Lin Chang
- Jhih-Yuan Pan
- Hsing-Hui Wu
- Qing Xiang Yong
- Fan, Nelson
- Kuah, Eric
- Zhang Li
- Kim Hwee Tan
- Yiu-Ming Cheung
- Ng, Eric
- Wu Kai
- Ji Hao
- Beica, Rozalia
- Lin, Marc
- Yu-Hua Chen
- Zhong Cheng
- Koh Sau Wee
- Jiang Ran
- Cao Xi
- Sze Pei Lim
- Lee, N. C.
- Mian Tao
- Lo, Jeffery
- Lee, Ricky S. W.
2018
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Applied surface science, 2019-08, Vol.484, p.33-38
2019
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Applied thermal engineering, 2014-02, Vol.63 (2), p.588-597
2014
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International journal of plasticity, 2008-03, Vol.24 (3), p.371-396
2008
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4
2014
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2013 10th China International Forum on Solid State Lighting (ChinaSSL), 2013, p.65-68
2013
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1593-1599
2018
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.595-602
2017
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Journal of microelectronics and electronic packaging, 2017-10, Vol.14 (4), p.123-131
2017
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-5
2013
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2014 11th China International Forum on Solid State Lighting (SSLCHINA), 2014, p.71-75
2014
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2019 20th International Conference on Electronic Packaging Technology(ICEPT), 2019, p.1-3
2019
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2018 20th International Conference on Electronic Materials and Packaging (EMAP), 2018, p.1-3
2018
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2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.347-350
2018
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1574-1582
2018
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2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.1476-1478
2018
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2360-2366
2018
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.355-363
- Ko, Cheng-Ta
- Chang, Chieh-Lin
- Pan, Jhih-Yuan
- Wu, Hsing-Hui
- Yong, Qing Xiang
- Fan, Nelson
- Kuah, Eric
- Li, Zhang
- Tan, Kim Hwee
- Cheung, Y. M.
- Ng, Eric
- Yang, Henry
- Kai, Wu
- Hao, Ji
- Beica, Rozalia
- Lin, Marc
- Chen, Y.H.
- Cheng, Zhong
- Wee, Koh Sau
- Ran, Jiang
- Xi, Cao
- Lim, Sze Pei
- Lau, John
- Lee, N.C.
- Tao, Mian
- Lo, Jeffery
- Lee, Ricky
- Li, Ming
- Li, Margie
- Lin, Curry
- Lin, J.W.
- Chen, Tony
- Xu, Iris
2018
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International Symposium on Microelectronics, 2017-10, Vol.2017 (1), p.576-583
2017
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56th Electronic Components and Technology Conference 2006, 2006, p.10 pp.
2006
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Journal of engineering education (Washington, D.C.), 2010-07, Vol.99 (3), p.237-251
2010
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Oncotarget, 2018-02, Vol.9 (16), p.12796-12804
- Chan, Claire Hian Tzer
- Munusamy, Prabhakaran
- Loke, Sau Yeen
- Koh, Geok Ling
- Yang, Audrey Zhi Yi
- Law, Hai Yang
- Yoon, Chui Sheun
- Wong, Chow Yin
- Yong, Wei Sean
- Wong, Nan Soon
- Ng, Raymond Chee Hui
- Ong, Kong Wee
- Madhukumar, Preetha
- Oey, Chung Lie
- Ho, Gay Hui
- Tan, Puay Hoon
- Tan, Min Han
- Ang, Peter
- Yap, Yoon Sim
- Lee, Ann Siew Gek
2018
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- Science & Technology
- Technology
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- Engineering, Electrical & Electronic
- Electromagnetic Compatibility
- Materials Science
- Capacitors
- Materials Science, Multidisciplinary
- Packaging
- Reliability
- Compression Molding
- Copper
- Engineering, Manufacturing
- Lighting
- Metals
- Physical Sciences
- Physics
- Computer Simulation
- Fan-Out Wafer-Level Packaging
- Glass
Kollektion
Zeitschrift / Serie
- Ieee Transactions On Components, Packaging, And Manufacturing Technology
- Applied Surface Science
- Applied Thermal Engineering
- Cancers
- Ieee Transactions On Components, Packaging And Manufacturing Technology
- International Journal Of Plasticity
- International Symposium On Microelectronics
- Journal Of Engineering Education
- Journal Of Microelectronics And Electronic Packaging
- Oncotarget