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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4

2014

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An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

2013 10th China International Forum on Solid State Lighting (ChinaSSL), 2013, p.65-68

2013

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IEEE_Xplore

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-5

2013

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IEEE_Xplore

Wireless-driven LED semiconductor lighting system

2014 11th China International Forum on Solid State Lighting (SSLCHINA), 2014, p.71-75

2014

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A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections

2008 58th Electronic Components and Technology Conference, 2008, p.1625-1629

2008

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IEEE_Xplore

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SnSe monolayer: A promising candidate of SO2 sensor with high adsorption quantity

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes

A review of passive thermal management of LED module

Nonlinear constitutive models from nanoindentation tests using artificial neural networks

Degradation modeling of mid-power white-light LEDs by using Wiener process

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

Degradation of light emitting diodes： a proposed methodology

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

Electricalathermalaluminousachromatic model of phosphor-converted white light-emitting diodes

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Thermal analysis of phosphor in high brightness LED

Investigation of lumen degradation mechanisms of mid-power LED by HAST

Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

Wireless-driven LED semiconductor lighting system

A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections

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