UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

SnSe monolayer: A promising candidate of SO2 sensor with high adsorption quantity

Applied surface science, 2019-08, Vol.484, p.33-38

2019

Volltextzugriff (PDF)

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-10, Vol.7 (10), p.1729-1738

2017

Volltextzugriff (PDF)

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1544-1560

2018

Volltextzugriff (PDF)

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-06, Vol.8 (6), p.991-1002

2018

Volltextzugriff (PDF)

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1561-1572

2018

Volltextzugriff (PDF)

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

IEEE photonics journal, 2017-02, Vol.9 (1), p.1-14

2017

Volltextzugriff (PDF)

Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes

Applied thermal engineering, 2014-02, Vol.63 (2), p.588-597

2014

Volltextzugriff (PDF)

A review of passive thermal management of LED module

Journal of semiconductors, 2011, Vol.32 (1), p.57-60

叶怀宇 SauKoh HenkvanZeijl A．WJ．Gielen 张国旗

2011

Volltextzugriff (PDF)

Nonlinear constitutive models from nanoindentation tests using artificial neural networks

International journal of plasticity, 2008-03, Vol.24 (3), p.371-396

2008

Volltextzugriff (PDF)

Degradation modeling of mid-power white-light LEDs by using Wiener process

Optics express, 2015-07, Vol.23 (15), p.A966-A978

2015

Volltextzugriff (PDF)

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

Reliability engineering & system safety, 2016-10, Vol.154, p.152-159

2016

Volltextzugriff (PDF)

Degradation of light emitting diodes： a proposed methodology

Journal of semiconductors, 2011, Vol.32 (1), p.41-44

2011

Volltextzugriff (PDF)

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

Microelectronics and reliability, 2015-12, Vol.55 (12), p.2654-2662

2015

Volltextzugriff (PDF)

Electricalathermalaluminousachromatic model of phosphor-converted white light-emitting diodes

Applied thermal engineering, 2014-02, Vol.63 (2), p.588-597

2014

Volltextzugriff (PDF)

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.595-602

2017

Volltextzugriff (PDF)

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Journal of microelectronics and electronic packaging, 2017-10, Vol.14 (4), p.123-131

2017

Volltextzugriff (PDF)

Thermal analysis of phosphor in high brightness LED

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.1535-1539

2012

Volltextzugriff (PDF)

Investigation of lumen degradation mechanisms of mid-power LED by HAST

2014 15th International Conference on Electronic Packaging Technology, 2014, p.1437-1441

2014

Volltextzugriff (PDF)

Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1593-1599

2018

Volltextzugriff (PDF)

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4

2014

Volltextzugriff (PDF)

An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

2013 10th China International Forum on Solid State Lighting (ChinaSSL), 2013, p.65-68

2013

Volltextzugriff (PDF)

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-5

2013

Volltextzugriff (PDF)

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2012, p.1/7-7/7

2012

Volltextzugriff (PDF)

Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1928-1932

2021

Volltextzugriff (PDF)

A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections

2008 58th Electronic Components and Technology Conference, 2008, p.1625-1629

2008

Volltextzugriff (PDF)

1 – 25 von 73

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(38)
Mit Volltextzugriff
(64)

Publikationsform

1 weiteren anzeigen...

Weniger anzeigen...

Sprache

Englisch
(73)
Japanisch
(1)

Erscheinungsjahr

n.n

Thema

Science & Technology
(43)
Engineering
(29)
Technology
(29)
Engineering, Electrical & Electronic
(24)
Physical Sciences
(13)
Physics
(11)
Copper
(10)
Life Sciences & Biomedicine
(10)
Light Emitting Diodes
(10)
Materials Science
(8)
Physics, Applied
(8)
Degradation
(7)
Electromagnetic Compatibility
(6)
Electronic Packaging
(6)
Materials Science, Multidisciplinary
(6)
Packaging
(6)
Reliability
(6)
Capacitors
(5)
Engineering, Manufacturing
(5)
Led
(5)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

SnSe monolayer: A promising candidate of SO2 sensor with high adsorption quantity

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes

A review of passive thermal management of LED module

Nonlinear constitutive models from nanoindentation tests using artificial neural networks

Degradation modeling of mid-power white-light LEDs by using Wiener process

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

Degradation of light emitting diodes： a proposed methodology

Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

Electricalathermalaluminousachromatic model of phosphor-converted white light-emitting diodes

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Thermal analysis of phosphor in high brightness LED

Investigation of lumen degradation mechanisms of mid-power LED by HAST

Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

A numerical analysis of crack growth and morphology evolution in chip-to-packages nano-interconnections

Suchergebnisse filtern