UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 231

Sortiert nach

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Journal of alloys and compounds, 2016-09, Vol.679, p.18-25

2016

Volltextzugriff (PDF)

Laser-engineered oxygen vacancies for improving the NO2 sensing performance of SnO2 nanowires

Journal of materials chemistry. A, Materials for energy and sustainability, 2019, Vol.7 (48), p.27205-27211

2019

Volltextzugriff (PDF)

Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties

Journal of materials chemistry. C, Materials for optical and electronic devices, 2018, Vol.6 (27), p.7207-7218

2018

Volltextzugriff (PDF)

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Microelectronics and reliability, 2019-08, Vol.99, p.62-73

2019

Volltextzugriff (PDF)

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability

Journal of materials science. Materials in electronics, 2019-09, Vol.30 (17), p.15889-15896

2019

Volltextzugriff (PDF)

Oxygen Evolution Reaction of Co-Mn-O Electrocatalyst Prepared by Solution Combustion Synthesis

Catalysts, 2019-06, Vol.9 (6), p.564

2019

Volltextzugriff (PDF)

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

Journal of materials science. Materials in electronics, 2021, Vol.32 (1), p.1042-1051

2021

Volltextzugriff (PDF)

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Microelectronics and reliability, 2017-04, Vol.71, p.119-125

2017

Volltextzugriff (PDF)

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials, 2021-01, Vol.14 (2), p.335

2021

Volltextzugriff (PDF)

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Journal of materials science. Materials in electronics, 2020, Vol.31 (2), p.1227-1235

2020

Volltextzugriff (PDF)

Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules

Journal of materials science. Materials in electronics, 2021-02, Vol.32 (3), p.3324-3333

2021

Volltextzugriff (PDF)

Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

Journal of materials science. Materials in electronics, 2021-12, Vol.32 (24), p.28346-28357

2021

Volltextzugriff (PDF)

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations

Journal of materials research and technology, 2024-05, Vol.30, p.6668-6685

2024

Volltextzugriff (PDF)

Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics

Microelectronics and reliability, 2018-07, Vol.86, p.66-71

2018

Volltextzugriff (PDF)

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (3), p.2334-2341

2019

Volltextzugriff (PDF)

Framework for the validation of simulation-based productivity analysis: focused on curtain wall construction process

Journal of civil engineering and management, 2017-02, Vol.23 (2), p.163-172

2017

Volltextzugriff (PDF)

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Metals (Basel ), 2021-02, Vol.11 (2), p.210

2021

Volltextzugriff (PDF)

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Electronics (Basel), 2024-06, Vol.13 (11), p.2173

2024

Volltextzugriff (PDF)

Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

Electronic Materials Letters, 2018, 14(6), , pp.678-688

2018

Volltextzugriff (PDF)

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

ACS applied materials & interfaces, 2016-03, Vol.8 (8), p.5679-5686

2016

Volltextzugriff (PDF)

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Materials characterization, 2017-02, Vol.124, p.250-259

2017

Volltextzugriff (PDF)

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals (Basel ), 2018-08, Vol.8 (8), p.586

2018

Volltextzugriff (PDF)

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Journal of alloys and compounds, 2017-12, Vol.728, p.992-1001

2017

Volltextzugriff (PDF)

Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method

Journal of materials processing technology, 2016-10, Vol.236, p.84-92

2016

Volltextzugriff (PDF)

Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

Microelectronics and reliability, 2022-02, Vol.129, p.114472, Article 114472

2022

Volltextzugriff (PDF)

1 – 25 von 231

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(182)
Mit Volltextzugriff
(211)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(132)
Technology
(69)
Physical Sciences
(48)
Life Sciences & Biomedicine
(46)
Engineering
(37)
Materials Science
(37)
Physics
(36)
Materials Science, Multidisciplinary
(32)
Engineering, Electrical & Electronic
(29)
Humans
(27)
Physics, Applied
(23)
Female
(20)
Copper
(15)
Middle Aged
(15)
Tin
(15)
Substrates
(14)
물리학
(14)
Adult
(13)
Chemistry
(13)
Endocrinology & Metabolism
(12)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(3)

Menü

Weitere Dienste

Einstellungen

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Laser-engineered oxygen vacancies for improving the NO2 sensing performance of SnO2 nanowires

Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability

Oxygen Evolution Reaction of Co-Mn-O Electrocatalyst Prepared by Solution Combustion Synthesis

Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding

Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules

Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations

Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Framework for the validation of simulation-based productivity analysis: focused on curtain wall construction process

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Transient Liquid Phase Bonding with Sn-Ag-Co Composite Solder for High-Temperature Applications

Oxidation and Repeated-Bending Properties of Sn-Based Solder Joints After Highly Accelerated Stress Testing (HAST)

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method

Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

Suchergebnisse filtern